Design your next great product with Intel and Tria
Tria offering an entire product family of Computer-on-Modules (CoM) based on the powerful 13th Gen Intel® Core™ processor
System designers often require a rock-solid embedded computer that covers all aspects of the system’s functionality and requirements. To enable different product classes with respect to cost versus feature set, the selected compute solution itself needs to provide a good scalability of performance and capabilities. Some applications such as in ticketing or transportation require to operate 24/7 under extended temperatures and may also be exposed to shock and vibration. In other use cases such as automation and robotics, real-time capabilities are paramount.product portfolio across many industries.
Broad Intel® Portfolio
Based on the powerful 13th Gen Intel® Core™ processor, Tria offers a full range of embedded Computer-on-Module products, which are ideal for a wide range of system designs and target applications.
Tria CoM brochure
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13th Gen Intel Core™: Hybrid Architecture with Enhanced Graphics and AI Power
The 13th Gen Intel® Core™ processor features the Intel Hybrid Architecture, which combines two different processor core architectures on chip, so called performance cores and efficiency cores. Depending on selected processor variant up to 14 cores can be utilized. Additional performance comes from the Intel® Iris Xe Graphics architecture with up to 96 EUs, useful for graphics operation and AI tasks. The graphics engines can provide content for four independent display streams.
Applications needing real-time capabilities can make use of the various RT options. Deterministic signaling can be achieved with Time-Sensitive Networking (TSN) supported by the on-board network controller and with Intel® Time Coordinated Computing (TCC) within the processor. With the Intel® Speed Shift Technology for Edge Computing, designers have the possibility to force one or more processor cores running at fixed higher clock rate, to satisfy jitter, latency, and performance requirements of the RT kernel.
COM Express® and COM-HPC® Modules Based on the powerful 13th Gen Intel® Core™ processor: Compact and Robust Solutions
Systems designers have the choice of PICMG COM Express® Type 6 and COM-HPC® Client as the CoM interface between module and carrier board. The MSC C6C-RLP is a COM Express module intended for applications requiring a Compact formfactor. It is equipped with memory down based on LPDDR5 technology. This makes it ideal for equipment exposed to harsh environments.
The second member of the COM Express module series, MSC C6B-RLP comes in Basic formfactor and allows for SODIMM memory. The larger formfactor provides more realestate for the cooling solution.
It’s counterpart, the MSC HCA-RLP is similar in configuration, but features COM-HPC Client interface and Size A formfactor. Memory content of all modules can be secured by the in-band ECC memory protection. On request all product members can be provided with assembled NVMe with up to 1TB capacity.
The modules are available with either commercial temperature range (0 to 60C°) or industrial temperature range (-40 to +85C°). The product variants with extended temperature range allow for 24/7 operation, if processor turbo frequencies are turned off.