8ULP-SOM – clone for testing
The 8ULP SOM is a compact (43mm x 36mm), ultra-low power, peripheral-rich, compute module, designed for integration onto custom OEM hardware.
The NXP i.MX 8ULP device on this SOM is architected for optimal power efficiency, with separated processing domains, e.g.
- Application domain with two Arm® Cortex®-A35 cores plus 3D/2D GPUs (plus comprehensive Linux enablement for rich GUI applications)
- Real Time domain with Arm Cortex-M33F core for real-time performance, plus Cadence Fusion F1 DSP core for low-power audio/voice use cases.
- LPAV domain (Low Power Audio Video) with a Cadence Tensilica HiFi 4 DSP core for advanced audio, ML and sensor applications.
An EdgeLock Security Enclave and µPower Manager have RISC-V cores to manage advanced security features and govern over 20 different power mode configurations across the processing domains. Together with the onboard NXP PCA9460B PMIC, exceptional energy efficiency is achieved.
Memory resources include OCRAM (896 KB), x32bit LPDDR4X DDR (2 GB), 8bit PSRAM (8 MB), eMMC 5.1 flash (32GB) and 8bit SPI NOR flash (4 MB).
Board to board interface is via two 100pin (0.4 mm pitch) connectors that can accommodate different stacking heights and have mating connectors from both Samtec and TE Connectivity.
The compact SOM dimensions, energy-efficient multi-processor architecture, EdgeLock security, graphic capabilities and rich peripheral mix, all add-up to a versatile intelligent edge solution.
Highlights
Target Applications:
- Surveillance Camera with Recognition
- Medical Devices, Portable Patient Monitors
- Inventory and Asset Monitoring
- Smart Building Control & HVAC
- Food & Beverage POS Equipment
Key Features:
- 2x A35 (800 MHz), 1x M33 (216 MHz)
- 3D/2D GPU (317 MHz)
- HiFi4 DSP and Fusion DSP
- 32GB eMMC Flash, 4MB SPI Flash
- 2GB LPDDR4X (x32bit)
- 8MB Octal PSRAM, 896KB OCRAM
- Ethernet,LPSPI,LPI2C,LPUART,CAN,I2S
- 2x USB OTG, MIPI DSI, MIPI CSI
- 2x 100pin B2B connectors
- Operating Temperature -40C~+85°C
Kit Includes:
- 8ULP SOM (system-on-module)
Specifications
Dimensions: | 43mm x 36mm |
CPU: | 2x A35 (800 MHz); 1x M33 (216 MHz); |
Chipset: | NXP |
Chipset Brand: | i.MX |
Chipset Sub-brand: | 8ULP |
RAM: | 2GB LPDDR4X (x32bit); 8MB octal PSRAM; 896KB OCRAM |
Flash: | 32 GB eMMC; 16 MB octal QSPI NOR flash |
Memory: | 32GB eMMC Flash; 4MB octal SPI Flash;<br />2GB LPDDR4X (x32bit);<br />8MB octal PSRAM; 896KB OCRAM |
USB: | 2x USB 2.0 OTG |
Serial Interfaces: | 8x LPUART; 5x LPSPI; 7x LPI2C |
Display Interfaces: | MIPI DSI (4 lane) |
Network Interface: | 10/100 Ethernet |
Audio Interface: | Stereo audio jack; |
Camera Interface: | MIPI CSI (2 lane) |
Power Requirement: | 5V, 1.5A |
Min Temperature (°C): | 85°C; |
Max Temperature (°C): | -40C; |
Cooling: | n/a |
Carrier: | MaaXBoard 8ULP |
Wireless Module: | M.2 Wi-Fi/BT module (3rd-party options) |
Documentation and Support Files
Documentation, support files, and additional information about this product.