MSC SM2S-IMX8ULP
The flexible MSC SM2S-IMX8ULP SMARC 2.1.2 module family is highly scalable and equipped with i.MX 8ULP Crossover Applications Processor that brings ultra-low power processing and advanced integrated security with EdgeLock® secure enclave to the intelligent edge. The i.MX 8ULP family features up to two Arm Cortex-A35 running at 1 GHz, an Arm Cortex-M33 core, 3D/2D Graphics Processing Units (GPUs) and a Tensilica® Hifi 4 DSP and Fusion DSP for low-power audio/voice and edge AI/ML processing.
The MSC SM2S-IMX8ULP module integrates the processor and low-power LPDDR4 memory technology, combined with up to 256GB eMMC Flash memory. Various interfaces for embedded applications such as Ethernet, USB 2.0, CAN-FD, dual-channel LVDS or MIPI DSI and MIPI CSI for connecting a camera are available. The thermal design power (TDP) of the module ranges from 1 to 3 W depending on used power mode.
The module is compliant with the new SMARC 2.1.1 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-IMX8ULP module, MSC provides a development platform and a starter kit. Support for Linux is available (Microsoft Azure Sphere and Android support available on request).
Highlights
- Single or Dual core Arm Cortex-A35 Applications
- Processor up to 1.0GHz
- Arm Cortex-M33 Real Time Processor up to 216MHz
- Tensilica Hifi 4 DSP at 600MHz
- Tensilica Fusion DSP at 200MHz
- Vivante multimedia 2D/3D Graphics Processor
- Up to 2GB LPDDR4x SDRAM at 2400 MT/s
- Up to 256GB eMMC Flash
- Dual-channel LVDS / MIPI-DSI x4 (optional)
- MIPI CSI-2 Camera Interface
- Up to 4x USB 2.0 Host interface
- 1x USB 2.0 Host/Device interface
- 1x 10/100 Mbit Ethernet
- Wireless Module (optional)
- 1x MMC/SD/SDIO interface
- 1x CAN-FD Interface
- 2x I2S Audio Interface
- 12x GPIO
- UART, SPI, I2C
- SMARC 2.1.1 Compliant
- Optimized design for Ultra Low Power applications and high volume at low cost
Specifications
Family: | MSC Compute |
Release date: | 0000-00-00 00:00:00 |
Subtitle: | NXP™ i.MX 8ULP Arm® Cortex™-A35 / M33 |
Technology: | Arm |
Form Factor: | SMARC Short Size |
CPU: | NXP i.MX 8M Mini Arm Cortex-A35 Applications Processor - i.MX 8ULP Dual, dual-core, 800MHz - 1.0GHz - i.MX 8ULP Solo, single-core, 800MHz - 1.0GHz - i.MX 8ULP SoloLite, single-core, 800MHz - 1.0GHz Arm Cortex-M33F Real Time Processor at 216MHz Hetero |
Chipset: | SOC |
RAM: | Up to 2GB 2400MT/s LPDDR4x SDRAM, soldered, no ECC |
Flash: | Up to 256GB eMMC Flash QSPI NAND Flash APD (optional) QSPI NOR Flash RTD (optional) |
Storage Interfaces: | 1x MMC/SD/SDIO |
USB: | 1x USB 2.0 Host/Client, 4x USB 2.0 Host orrn1x USB 2.0 Host/Client, 1x USB 2.0 Host (optional) |
Serial Interfaces: | 2x UART with 2-wire hand shakern2x UART w/o hand shake |
Bus Interfaces: | 4x I2C up to 400 Kbit/s 1x CAN-FD / CAN 2.0B 2x SPI (with one chip selects) |
Display Controller: | Vivante GC NanoUlta 3D Graphics Processing Unit (GPU) 3D Graphics Acceleration, 1 shader, 6.4 GFLOPS OpenGL ES 1.0, 2.0, 3.1, Vulkan, OpenCL 1.2 Video Processing Unit not available |
Display Interfaces: | Dual-channel LVDS interface, 18 or 24 bit (up to 1920x1080); also usable as one single-channel LVDS interface (up to 1366x768) or MIPI-DSI Display Interface, 4 lanes, up to 1920x1080 @ 60fps (optional) |
Network Interface: | 10/100BASE-T Ethernet Wireless Module with 802.11b/g/n and Bluetooth 5.0, single band 2.4GHz, soldered (optional) |
Audio Interface: | 2x I2S Audio Tensilica Fusion DSP at 200MHz Tensilica Hifi 4 DSP at 600MHz (only available on Solo/Dual) |
Security Device: | Advanced Security, Safety, and Reliability integrated in the SOC Integrated EdgeLock secure enclave enables autonomous management of security functions, including runtime attestation, silicon root of trust, reusable certifications, trust provisioning |
Miscellaneous: | Watchdog Timer for system reset (programmable, 1s … 600s) High accuracy RTC 12x GPIO, configurable as input or output, interrupt capable 2x PWM outputs (shared functions) 64kbit ID EEPROM on I2C bus MIPI CSI-2 camera interface (CSI0, 2 lane) or MIP |
Feature Highlights: | SMARC 2.1.1 compatible |
Firmware: | uboot |
OS Support: | Linux Board Support Package Microsoft Azure Sphere (on request) Android Board Support Package (on request) |
Power Requirement: | Power Supply 3V - 5,25V, 5V Standby Power Consumption 1-3 W typ. (depending on CPU and optional features) Dedicated μPower management subsystem anchored by an internal NXP-built RISC-V core (more than 20 different power mode configurations across pr |
Environment: | Temperature Range: 0°C … +70°C operating commercial -40°C … +85°C operating extended -40°C … +85°C storage Humidity: 5 … 95% (operating, non condensing) 5 … 95% (storage, non-condensing) |
Dimensions: | 82 x 50 mm |
Certificates: | UL / CE |
Cooling: | Heatspreader |
Carrier: | MSC SM2-MB-EP1MSC SM2-MB-EP5 |
Order_numbers: | 98942|98851 |
Accessories_no: | 68488|83977|83981|82479|68948|74008 |
CPU Vendor: | NXP |
RAM Size: | Up to 2GB |
CPU Series: | i.MX 8ULP |
Display Size [inches]: | 82 x 50 mm |
Max Temperature (°C): | 85 |
Min Temperature (°C): | -40 |
Compute Standard: | SMARC Short Size |
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