MSC HSD-ILDL
The MSC HSD-ILDL COM-HPC Server module hosts the Intel® Xeon® D-1700 processor and delivers server class performance on embedded form factor. The processor is a fully integrated System on Chip (SoC) combining up to ten Xeon cores, memory controller, high bandwidth network and multiple PCIe root complexes on a single socket.
The on-chip network controller facilitates up to eight Ethernet ports with different configuration options ranging from 1G to 25G per port and an aggregated throughput of up to 100G. An additional Ethernet port based on Intel® i225 provides 1GbE/2.5GbE bandwidth and TSN capability for real-time applications. An extensive set of PCI Express lanes with Gen 4 and Gen 3 support allow for connecting external HW accelerators, FPGAs, storage and IO devices.
The user can scale memory capacity from 8GB to 256GB based on registered DIMMs (RDIMM) or unbuffered DIMMs (UDIMM). Machine robustness can be extended by enabling error correction code (ECC) and utilizing RDIMM or ECC UDIMM. Selected variants of the MSC HSD-ILDL can be operated at extended temperature range with true 24/7 utilization. This supports system designs exposed to harsh environmental conditions that require a reliable compute engine.
System investments are well protected through long-term availability of the module. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Highlights
- Ideal for IoT, AI/deep learning, edge
- computing, HPC, workload consolidation
- Intel® Xeon® D-1700 processor
- Server class multi-core system on chip (SoC)
- Up to 10 cores
- Up to 256GB DDR4 memory, RDIMM/UDIMM
- Optional ECC memory protection
- Extensive I/O including PCI Express® and
- multiple Ethernet connections
- Sixteen PCIe Gen 4 and sixteen PCIe Gen 3 lanes
- Up to eight integrated Ethernet ports, max. 25G
- Maximum 100G aggregated Ethernet throughput
- Dedicated 1G / 2.5G Gb Ethernet port with TSN
- capability (Intel® i225)
- Two SATA 6Gb/s mass storage interfaces
- 4x USB 3.2 Gen 1, 4x USB 2.0
- 12x GPIO, 2x serial UART ports
- Trusted Platform Module TPM 2.0
- On-board mass storage (optional eMMC)
- Extended temperature range and 24/7 operation
- Long-term product availability
Specifications
Technology | x86 |
Form Factor | COM HPC Size D |
CPU | Intel Xeon D-1746TER, ten-core, 2.0GHz, 67W TDP, 8 Eth ports, 100G, DDR4-2667, I-temp Intel Xeon D-1735TR, eight-core, 2.2GHz, 59W TDP, 8 Eth ports, 50G, DDR4-2933, C-temp Intel Xeon D-1732TE, eight-core, 1.9GHz, 52W TDP, 8 Eth ports, 50G, DDR4-2667, I-temp Intel Xeon D-1715TER, four-core, 2.4GHz, 50W TDP, 8 Eth ports, 50G, DDR4-2667, I-temp Intel Xeon D-1712TR, four-core, 2.0GHz, 40W TDP, 8 Eth ports, 50G, DDR4-2400, C-temp Note: 100/50G is the recommended network throughput a device should not exceed. See the product manual for details. |
Chipset | SoC |
RAM | Up to 256GB DDR4, 4x 288pin DIMM, 2 channels, 2 DIMMs per channel RDIMM population, 1DPC/2DPC, max. DDR4-2933, ECC, max. 64GB per DIMM UDIMM population, 1DPC, max. DDR4-2933, optional ECC, max. 32GB per DIMM UDIMM population, 2DPC, max. DDR4-2666, optional ECC, max. 32GB per DIMM Note: maximum supported speed grades also depending on selected processor variant |
Flash | optional eMMC, max. 265GB |
Storage Interfaces | 2x SATA 6Gb/s |
USB | 4x USB 3.2 Gen 1 (5Gbps), connected with COM-HPC USB[0:3]_SSTX/RX 4x USB 2.0 connected with USB[0:3] |
Serial Interfaces | 2x UART |
Bus Interfaces | 16x PCI Express Gen 4, bifurcation x16, x8, x4, max. 4 root ports, NTB x16, x8, connected with COM-HPC PCIe[16:31] 16x PCI Express Gen 3, bifurcation x8, x4, x2, max. 8 root ports, connected with COM-HPC PCIe[0:15] 1x PCI Express Gen3 for optional BMC on carrier, connected with PCIe_BMC |
Network Interface | 1x 1000BASE-T / 2.5GBASE-T, TSN, connected with COM-HPC NBASET0 I-Temp variants: Intel® i225-IT C-Temp variants: Intel® i225-LM 8x configurable Ethernet ports (SoC), connected with COM-HPC ETH[0:7] Configuration options (mutually exclusive): 4x 25G 2x 25G 8x 10G 4x 10G 4x 10G & 4x 2.5G Highest possible bandwidths shown, lower speeds are supported. 25G-> 10G/2.5G/1G/100M 10G-> 2.5G/1G/100M Supported configurations, maximum throughput and number of Ethernet interfaces depending on processor variant. The COM-HPC carrier design determines capabilities of the physical interfaces. |
Security Device | Infineon Trusted Platform Module 2.0 |
Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
Feature Highlights | PICMG COM-HPC Server interface |
Firmware | UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces |
OS Support | Microsoft Windows 10 IoT Enterprise BSP for Linux (Yocto) EAPI (HW Programming Interface) |
Power Requirement | Voltage: +12V +/-5% +5V Stby +/-5% (optional) Power Consumption: 40W to 89W (typ.) |
Environment | Ambient Temperature 0° … 60°C (operating) -25° … 85°C (storage) Extended temp. variants: -40 ... +85°C°C* (operating) *Maximum operating temperatures may be lower depending on product variants, cooling design, operational and environmental conditions. See the product documentation for detailed specification of maximum operating temperatures and conditions. Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
Dimensions | 160mm x 160mm (Height depending on cooling solution) |
Certificates | UL / CE |
Cooling | Certificates |
Accessories
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