MSC SM2S-QCS5430

The MSC SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm® QCS5430 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS5430 integrates Qualcomm® Kryo™ 670 CPU which contains up to six cores: two Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 642L GPU, Qualcomm® Adreno™ 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K30 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 3.5 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

This solution delivers powerful performance and is purpose-built for industrial and commercial IoT applications such as ruggedized handhelds and tablets, kiosks, industrial scanners, dash cameras, point-of-sale systems and human machine interface systems.

The module is compliant with the latest SMARC 2.1.1 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-QCS5430 module, Avnet Embedded provides a development platform and a starter kit. Support for Linux is available (Android support available on request).

Highlights

  • And Quad core Arm Cortex-A55 @ 1,8GHz
  • Adreno 642L GPU @ 315MHz
  • AI DSP/NSP Dual HVX, 4K HMX up to 3.5 TOPs
  • Up to 16GB LPDDR5 SDRAM 6400MT/s
  • Up to 1TB UFS Flash
  • Display up to FHD+120Hz
  • Video up to 4k30(E)/4K30(D)
  • 5xUSB 2.0, 2x USB 3.1
  • 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
  • 1x MIPI-DSI or LVDS
  • 1x DP 1.4 (2 lane)
  • 1x eDP/DP
  • 4x MIPI-CSI Camera Interface
  • WLAN/BT Wireless Module (option)
  • 2x Gigabit Ethernet
  • 2x I2S Audio Interface
  • 4x UART, 2x SPI, 2x CAN2.0-FD
  • 5x I²C
  • HW Key manager and ECC, Secure boot, Crypto engines, etc.
  • Windows 11 IOT, Yocto Linux
  • Ubuntu or Android (on request)

Specifications

TechnologyArm
Form FactorSMARCâ„¢ 2.1.1 Short Size
CPUQCS5430: 2x A78@2.1GHz, 4xA55@1.8GHz 2xHVX,4K-HMX 1.45GHz (3.5 INT8 TOPS)
ChipsetSOC
RAMUp to 16GB LPDDR5 SDRAM, up to 6400MT/s, soldered
FlashUp to 1TB UFS, soldered (optional)
Storage InterfacesUFS (onboard) NVME (carrier) SD-Card (carrier)
Bus InterfacesUp to 4x PCI-Express x1 Gen. 3 lanes 5x I²C (1x general, 2x CAM, 1x LCD, 1x PM) 2x SPI Bus 1x SDIO 2x CAN2.0-FD
Display ControllerAdreno 642L GPU @ up to 315MHz
Display InterfacesMIPI-DSI 4 - lane FHD+ @120Hz LVDS (optional instead of MIPI-DSI) 1920x1200 WUXGA 60Hz DP 1.4 (2 lane) 4K30 (4K60 compression to 16bpp) eDP/DP (4 lane) 4k60 (4K120 compression to 16bpp)
Network Interface2x 10/100/1000Base-T
Audio Interface2x I2S Audio
Security DeviceInfineon Trusted Platform Module 2.0 HW Key manager and ECC, Secure boot, Crypto engines, Key provisioning security, Qualcomm® Trusted Execution Environment (TEE), Qualcomm Content Protection (Widevine), Secure camera/UI
MiscellaneousMIPI CSI-2 camera interface on SMARC interface: 1x 2 lane, 1x 4 lane MIPI CSI-2 camera interface on CSI Connector: 2x 4 lane Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan EEPROM: 64kbit ID EEPROM on I2C bus GPIO: 14x GPIO, configurable as input or output, 13x interrupt capable
Feature HighlightsSMARCâ„¢ 2.1.1 compliant
FirmwareUEFI boot
OS SupportWindows 11 IoT Yocto Linux Ubuntu Linux (on request) Android (on request)
Power RequirementPower Supply +5V +/-5%, 5V Standby Power Consumption 5W typ. (tbd: depending on CPU, CPU load and onboard features)
EnvironmentTemperature Range: Commercial: 0° … 70°C (operating) -20° … 85°C (storage) Extended: -30° … 85°C (operating) -40° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing)
Dimensions82 x 50 mm
CertificatesUL / CE
CoolingHeatspreader
CarrierMSC SM2-MB-EP1 MSC SM2-MB-EP5

Order Info

Order No.DescriptionReferenceStatus
111994SMARC 2.1.1 module with Qualcomm QCS5430 2x A78 @2.1GHz + 4x A55 @1,8GHz 3W CPU TDP, Graphics: Adreno A642L@315Mhz, NPU: 3.5 TOPs, 4GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 32GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, TPM 2.0, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/BT, TPM 2.0, 2x CAN FD (Engineering Sample - get in touch with your sales)MSC SM2S-QCS5430-FP15-25N02F1C ES1 PCBESPV
111987SMARC 2.1.1 module with Qualcomm QCS6490 4x A78 @2.4/2.7GHz + 4x A55 @1,9GHz 5W CPU TDP, Graphics: Adreno A643@812MHz, NPU: 12 TOPs, 8GB LPDDR5 SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI interfaces, 2x MIPI CSI on SMARC and 2x onboard, Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3 x1 + 1x PCIe Gen3 x2, TPM 2.0, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/BT, TPM 2.0, 2x CAN FD (Engineering Sample - get in touch with your sales)MSC SM2S-QCS6490-FPF-36N08F1C ES1 PCBESPV

Accessories

Carrier Options

Order No.DescriptionReference
68488SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°CMSC SM2-MB-EP1-001 PCBFTX
83977SMARC 2.x compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 2x CAN, dual RJ45 LAN with LED (1 x LAN i210) , 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x USB 2.0 Host/Device, 2x SPI, I²C, 8 GPIO on FC, 1x HDMI, LVDS/eDP/DSI on JILI30 connector, SD Card Slot, regulated backlight supply, I2S Audio, 1W Mono, camera connector, RTC battery. Industrial temperature range -40..+85°C, ARM full versionMSC SM2S-MB-EP5-002 PCBFTX

Cooling Options

Order No.DescriptionReference
TBD1Heatspreader for SM2S-QCS6490 module, consisting of a single-piece aluminum plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs 
TBD2Passive Heatsink for SM2S-QCS6490 module, consisting of a single-piece aluminum pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs 

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Download Datasheet

Click the link below to download MSC SM2S-QCS5430 datasheet.