Proprietary Form-factor
AMD
MicroZed
MicroZed™ is a low-cost SOM that is based on the AMD Xilinx Zynq®-7000 SoC. In addition to the Zynq-7000 SoC, the module contains the common functions and interfaces required to support the core of most SoC designs, including memory, configuration, Ethernet, USB, and clocks. On the bottom side of the module, MicroZed contains two 100-pin I/O headers that provide connection to two I/O banks on the programmable logic (PL) side of the Zynq-7000 SoC device. When plugged onto a user designed baseboard or carrier card, these 100-pin connectors provide connectivity between the Zynq-7000 SoC PL I/Os and the user circuits on the carrier card. MicroZed also includes on-board power regulation that supports 5 V input with an option to support 12 V input.
Industrial Temperature MicroZed SOMs are built with components supporting extended temperatures of -40 to +85°C, with the exception of the use of the microSD card connector. Due to the configurability of the Zynq device, the user must perform final temperature testing validation.
PicoZed
The PicoZed module contains the core requirements to support SoC design including memory, configuration, Ethernet, USB, and clocks. It provides easy access to over 100 user I/O pins through three I/O connectors on the backside of the module. These connectors can support dedicated interfaces for Ethernet, USB, JTAG, power and other control signals, as well as the GTP/GTX transceivers on the 7015/7030 models. The transceiver based 7015 and 7030 versions of PicoZed are a superset of the 7010/7020 version, adding four high-speed serial transceiver ports to the I/O connectors. You can design your own carrier card, plug-in a PicoZed, and start application development with a proven Zynq-7000 AP SoC sub-system.
AMD Xilinx RFSoC SOMs
Avnet XRF™ RFSoC System-on-Modules are designed for integration into deployed RF systems demanding small footprint, low power, and real-time processing. XRF modules feature the AMD Xilinx Zynq®️ UltraScale+™ RFSoC with up to 16 RF-ADC and 16 RF-DAC channels and up to 6GHz analog bandwidth.
Combine a production-ready XRF module with an XRF Carrier Card and Avalon™ software suite to jumpstart proof-of-concept and application development. Then deploy your system with the same XRF module used for proof-of-concept. Example code and tutorials demonstrate AMD Xilinx RFSoC multi-tile sync (multi-converter sync) and multi-board synchronized analog capture.
AMD Xilinx RFSoC SOMs
Avnet XRF™ RFSoC System-on-Modules are designed for integration into deployed RF systems demanding small footprint, low power, and real-time processing. XRF modules feature the AMD Xilinx Zynq®️ UltraScale+™ RFSoC with up to 16 RF-ADC and 16 RF-DAC channels and up to 6GHz analog bandwidth.
Combine a production-ready XRF module with an XRF Carrier Card and Avalon™ software suite to jumpstart proof-of-concept and application development. Then deploy your system with the same XRF module used for proof-of-concept. Example code and tutorials demonstrate AMD Xilinx RFSoC multi-tile sync (multi-converter sync) and multi-board synchronized analog capture.
UltraZed-EG
UltraZed-EG™ SOM is a highly flexible, rugged, System-On-Module (SOM) based on the AMD Xilinx Zynq® UltraScale+™ MPSoC. Designed in a small form factor, the UltraZed-EG SOM packages all the necessary functions such as system memory, Ethernet, USB, and configuration memory needed for an embedded processing system. The UltraZed-EG provides easy access to 180 user I/O pins, 26 PS MIO pins, and 4 high-speed PS GTR transceivers along with 4 GTR reference clock inputs through three I/O connectors on the backside of the module.
Designers can simply design their own carrier card, plug-in UltraZed-EG SOM, and start their application development with a proven Zynq UltraScale+ MPSoC sub-system. Available with the Zynq UltraScale+ MPSoC XCZU3EG-SFVA625 device, the UltraZed-EG SOM enables designers to build high-performance systems with confidence and ease. By simply plugging the off-the-shelf UltraZed-EG SOM into an application specific carrier card, system bring-up and debug time can be cut in half, while overall system cost can be reduced by 20% or more verses a standard chip-down design.
UltraZed-EV
UltraZed-EV™ SOM is a high performance, full-featured, System-On-Module (SOM) based on the AMD Xilinx Zynq® UltraScale+™ MPSoC EV family of devices. Designed in a small form factor, the UltraZed-EV SOM on-board dual system memory, high-speed transceivers, Ethernet, USB, and configuration memory provides an ideal platform for embedded video processing systems. The UltraZed-EV provides easy access to 152 user I/O pins, 26 PS MIO pins, 4 highspeed PS GTR transceivers along with 4 GTR reference clock inputs, and 16 PL high-speed GTH transceivers along with 8 GTH reference clock inputs through three I/O connectors on the backside of the module.
Designers can simply design their own carrier card, plug-in UltraZed-EV SOM, and start their application development with a proven Zynq UltraScale+MPSoC sub-system. Available with the Zynq UltraScale+ MPSoC XCZU7EV-FBVB900 device, the UltraZed-EV SOM enables designers to build multimedia, automotive ADAS, surveillance, and other embedded vision applications with confidence and ease. The MPSoC EV device with its integrated H.264 / H.265 video codec unit is capable of simultaneous encode and decode up to 4Kx2K (60fps).
VE2302 SOM
PRODUCT PREVIEW: The VE2302 SOM is scheduled to be released 3rd Quarter 2024. Final spec’s are subject to change.
The VE2302 SOM provides the flexibility and versatility for developers to enable designs with the AMD Versal™ AI Edge series. This System-On-Module (SOM) is a small form factor and full-featured board based on the Versal AI Edge VE2302 device featuring 328K programmable logic cells with a Dual-core Arm® Cortex®-A72 MPCore™ and Dual-core Arm Cortex-R5F MPCore, as well as L1 and L2 cache and 256KB on-chip memory all with ECC. The board features 4GB of Micron LPDDR4 with non-volatile boot options in the 64MB Micron OSPI Flash or 32GB eMMC. The SOM provides use of the Versal AI Edge GTYP transceivers (8), HDIO (22), PMC MIO (13), LPD MIO (12), XPIO (104) and SYSMON interfaces.
The SOM provides a host of features to simplify application development with a custom carrier card. Along with the XCVE2302-1LSESFVA784 the VE2302 SOM enables Gigabit Ethernet and USB2.0 using a Microchip PHY, I2C MAC EEPROM, I2C 8-bit IO Expander, PMBus, and other interfaces through three Samtec JX connectors. ECS provide clocking to the Versal AI Edge device, the on-chip real-time clock, JTAG, and communication interfaces. Power is provided by on board regulators through 5V supply from a Carrier Card with TDK μPOL™ power modules.
Whether you want to use bare metal, Linux, or Vits AI Accelerators, using a Vivado-enabled board definition file and PetaLinux BSP will enable you to be up and running in no time!
Microsoft
Microsoft Azure Sphere
With billions of new devices connected each year, it’s more important than ever to secure yours. Help protect your data, privacy, physical safety, and infrastructure with Azure Sphere. It’s built on decades of Microsoft experience in hardware, software, and cloud to provide a turnkey security solution for IoT devices.
MT3620 Starter Kit V2
The Azure Sphere MT3620 Starter Kit V2 is an enhanced version of Avnet’s popular Azure Sphere Starter Kit. It supports rapid prototyping of highly secure, end-to-end IoT implementations based on Microsoft Azure Sphere. This small form-factor carrier board includes a production-ready MT3620 Sphere module with WiFi connectivity, along with multiple expansion interfaces facilitating easy integration of sensors, displays, motors, relays and more. Key features of this version are its ability to support a wired Ethernet network connection (requires MikroE ETH click adapter to be fitted) as well as more flexibility in how ISUs can be used. Downloadable documentation and tutorials guide developers through all steps, from board setup to application coding.
The Avnet-designed, production-ready, certified Azure Sphere MT3620 module is based on the MT3620 SoC, which includes built-in Microsoft security, WiFi connectivity plus the versatility and power of an Arm ® Cortex™-A7 processor and two real-time Arm Cortex-M4F microcontroller cores. A suite of on- chip peripherals, real-time clock, Flash and RAM are also available. In addition to the MT3620, the 33 x 22 mm module includes a dual-band WiFi chip antenna and system clock source. Up to 27 configurable GPIOs and three configurable serial ports (UART, I2C or SPI) are accessible on the module pinout.
The carrier board connects the Sphere module I/Os to two MikroE Click sockets, an I2C Grove connector, a connector supporting the addition of an optional 128 x 64 OLED graphical display, a 3D accelerometer, 3D gyro, temperature sensor and ambient light sensor. Debugging is accomplished through a USB-to-UART interface, which also provides 5V power to the board.
User applications for the embedded Sphere controller are developed in C using Microsoft’s Visual Studio IDE and Azure Sphere SDK. Visual Studio provides a powerful yet easy-to-use development environment for compiling and debugging application code. The combination of Visual Studio, the versatile carrier card plus the production-ready Sphere module delivers a powerful starting point for IoT developers interested in learning, prototyping and deploying Azure Sphere-based solutions MT3620 Starter Kit Product Brief
The version 1 kit has been discontinued.
MT3620 Module V3
The Avnet Azure Sphere MT3620 Module supports Microsoft’s Azure Sphere end-to-end solution for highly secured, Wi-Fi-connected microcontroller (MCU) devices. The production-ready, certified module supports an on-board chip antenna for cost-optimized systems.
By integrating all the necessary support and RF front-end circuitry onto the small 33 mm x 22 mm module, Avnet has reduced the design time for implementing Sphere-based solutions. More importantly, developers can leverage the module’s wireless certifications for their end product, saving considerable certification cost and testing time.
The Azure Sphere MT3620 module is based on the MT3620AN SoC, which supports dual-band 802.11 b/g/n Wi-Fi connectivity, a 500 MHz Arm® Cortex™-A7 core for user applications, and two general purpose 200MHz Arm Cortex-M4F I/O subsystem cores designed to support real-time requirements. The on-chip peripherals (GPIO, UART, I2C, SPI, PWM and ADC) can be mapped to dedicated I/O pins on the module for connection to external sensors, I/O connectors, or other user application circuits.
Microsoft’s end-to-end security, OTA update service, and user-friendly Visual Studio development environment add significant value when compared to traditional MCU solutions.
For development with the Avnet module, Avnet’s Azure Sphere MT3620 Starter Kit provides extremely versatile expansion options using a wide range of inexpensive add-on boards to facilitate rapid prototyping and fast time to market. MT3620 Module Product Brief
Version 1 and 2 modules have been discontinued.
MT3620 u.FL Module V2
The Avnet Azure Sphere MT3620 u.FL V2 module is identical to the MT3620 V3 module with the exception of the RF font-end circuitry. The u.FL module includes 2-u.FL antenna connectors (instead of a single chip antenna) to support 2 external antenna (not included). The u.FL module targets Wi-Fi performance optimized systems where antenna diversity will improve the performance of the device. Additionally, in applications where the main board may be enclosed in a metal box, the external antenna allow for placement outside of metal enclosures.
The Azure Sphere MTY3620 u.FL V2 module is a special order part, please contact your local Avnet FAE for assistance is placing orders.
Version 1 u.FL modules never went to market and are not available.
Guardian 100 – The Guardian 100 is no longer available – support documents are in the section below.
Avnet Guardian 100 is a wireless edge module that uses Azure Sphere to deliver secure connectivity to devices. It includes Avnet Azure Sphere MT3620 module and connects to existing equipment via ethernet or usb. Guardian-enabled devices also receive automatic security updates through the Azure Sphere Security Service
NXP
8ULP-SOM
The 8ULP SOM is a compact (43mm x 36mm), ultra-low power, peripheral-rich, compute module, designed for integration onto custom OEM hardware.
The NXP i.MX 8ULP device on this SOM is architected for optimal power efficiency, with separated processing domains, e.g.
- Application domain with two Arm® Cortex®-A35 cores plus 3D/2D GPUs (plus comprehensive Linux enablement for rich GUI applications)
- Real Time domain with Arm Cortex-M33F core for real-time performance, plus Cadence Fusion F1 DSP core for low-power audio/voice use cases.
- LPAV domain (Low Power Audio Video) with a Cadence Tensilica HiFi 4 DSP core for advanced audio, ML and sensor applications.
An EdgeLock Security Enclave and µPower Manager include RISC-V cores to manage advanced security features and govern over 20 different power mode configurations across the processing domains. Together with the onboard NXP PCA9460B PMIC, exceptional energy efficiency is achieved.
Memory resources include OCRAM (896 KB), x32bit LPDDR4X DDR (2 GB), 8bit PSRAM (8 MB), eMMC 5.1 flash (32GB) and 8bit SPI NOR flash (4 MB).
Board to board interface is via two 100pin (0.4 mm pitch) connectors that can accommodate different stacking heights and have mating connectors from both Samtec and TE Connectivity.
The compact SOM dimensions, energy-efficient multi-processor architecture, EdgeLock security, graphic capabilities and rich peripheral mix, all add-up to a versatile intelligent edge solution.
Syntiant / Renesas
RASynBoard Kit
RASynBoard is a low-cost evaluation kit that includes the RASynBoard core module with an I/O board for prototyping and development.
RASynBoard is a tiny (25mm x 30mm), ultra-low power, edge AI/ML board, based on a Syntiant NDP120 Neural Decision Processor, a Renesas RA6M4 host MCU plus a power-efficient DA16600 Wi-Fi/BT combo module. The NDP120 subsystem with onboard digital microphone, IMU motion sensor and SPI Flash memory, achieves highly efficient processing of acoustic- and motion events. Battery and USB-C device connectors facilitate stand-alone use, while a compact under-board connector enables integration with custom OEM boards and additional sensors.
An IO board (50mm x 30mm) is included for implementation of a compact two board evaluation kit assembly. This pins-out a subset of the NDP120 and RA6M4 I/Os to popular Pmod, Click header and expansion header footprints, enabling connection with additional external microphones and sensor options. An onboard debugger MCU (SWD and UART interfaces), button switches, RGB LED and removable MicroSD storage, further maximize prototyping versatility and utility.
NDP120 AI/ML models for popular use-cases (pre-engineered by Syntiant and other vendors) are loaded from local SPI Flash storage for efficient execution on the ultralow power NDP120 neural accelerator device.
RA6M4 MCU application software development and debug is supported via the Renesas e2 Studio IDE, interfaced via the E2OB debugger MCU on the IO board.