TRIA C6C-QCSX
The TRIA C6C-QCSX COM Express module features the Qualcomm Snapdragon® X Elite processor family. This highly energy-efficient processor offers best-in-class performance per watt, making it an ideal platform for applications that require outstanding performance with low power consumption and minimal cooling measures. It combines the Qualcomm Oryon™ CPU with up to twelve cores, the Adreno™ GPU driving excellent graphics throughput, and the Hexagon™ NPU accelerating AI applications with up to 45 TOPS.
With its compact board size and rich IO interfaces, the module finds its place in automation, robotics, autonomous vehicles, medical appliances and other system installations that call for a space saving solution with compelling capabilities. Up to sixty-four GB main memory based on fast LPDDR5X technology, sixteen PCI Express lanes, multiple graphics outputs, USB ports and one network interface give system architects a lot of design flexibility.
System investments are well protected through long-term availability of the module, designed and manufactured by Tria Technologies. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Highlights
- Qualcomm Snapdragon® X Elite processor
- Scalable CPU performance, up to twelve cores
- Powerful Qualcomm® Adreno™ GPU
- Qualcomm® Hexagon™ NPU with 45 TOPS of AI performance
- LPDDR5X main memory, memory-down, up to 64GB
- Three DisplayPort interfaces
- LVDS / Embedded DisplayPort interface
- PCI Express® Gen 4, up to 1x8 + 1x4/2x2
- PCI Express® Gen 3, 2x1 + 1x2/1x1
- Up to two USB4, four USB 3.2 Gen1/2 and eight USB 2.0 ports
- Two UARTs
- Up to 1TB on-board UFS Flash
- 1 / 2.5 Gb Ethernet port, TSN support
- Trusted Platform Module TPM 2.0
- COM Express Type 6, Compact
- Long-term product availability
Specifications
Technology | Arm |
Form Factor | COM Express Compact Type 6 |
CPU | Qualcomm Snapdragon® X Elite X1E-84-100, 12C, 4.2GHz X1E-80-100, 12C, 4.0GHz X1E-78-100, 12C, 3.4GHz Qualcomm Snapdragon® X Plus X1P-66-100, 10C, 4.0GHz X1P-64-100, 10C, 3.4GHz X1P-46-100, 8C, 4.0GHz X1P-42-100, 8C, 3.4GHz Qualcomm Snapdragon® X X1-26-100, 8C, 2.7GHz |
Chipset | Integrated into SoC |
RAM | LPDDR5X memory, memory-down Capacity options: 8GB, 16GB, 32GB, 64GBB |
Flash | Up to 1TB UFS, soldered (optional) |
Storage Interfaces | UFS (onboard) NVME at PCI Express (carrier design dependent) |
USB | Up to 2x USB4 Gen 2, mutually exclusive with DDI 1, 2 4x USB 3.2 (Gen 1 & 2) 8x USB 2.0 Note: capabilities depending on carrier design |
Serial Interfaces | 2x UART |
Bus Interfaces | PCI Express® Gen 4, up to 1x8/(1x4) ¹ + 1x4/2x2 PCI Express® Gen 3, 2x1 + 1x2/1x1 ¹ SKU dependent |
Display Controller | Adreno™ GPU, up to 1.5GHz |
Display Interfaces | Up to 3x Digital Display Interface (DP 1.4b), DDI 1, 2 mutually exclusive with USB4 Up to two USB4/USB-C ports (DP tunneling) 1x Embedded DisplayPort 1.4b, mutually exclusive with LVDS 1x LVDS 24bit, dual-channel, mutually exclusive with eDP |
Network Interface | 10/100/1000Base-TX, 2.5G² based on Qualcomm QPS615, with TSN support ² Available bandwidths depending on carrier design |
Audio Interface | SoundWire |
Security Device | TPM 2.0 |
Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
Firmware | UEFI boot |
OS Support | Windows 11 IoT Yocto Linux Ubuntu Linux (on request) Android (on request) |
Power Requirement | Voltage: +8.5V to +18V, +5V Stby optional Power Consumption: tbd |
Environment | Ambient Temperature: 0° … 60°C (operating) -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
Dimensions | 95mm x 95mm |
Certificates | UL / CE |
Order Info
Order No. | Description | Reference | Status |
tbd | Contact Tria for ordering information | MSC C6C-QCSX-xxxxx | OR |
Accessories
Carrier Options
Order No. | Description | Reference |
111650 | COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, M.2, SD card socket, SATA, DisplayPort, LVDS, eDP, VGA, HD audio interfaces; ATX power connector. Dimensions 305 x 244 mm (ATX form factor) | MSC C6-MB-EV4 PCBFTX |
Cooling Options
Order No. | Description | Reference |
tbd | Contact Tria for ordering information | MSC C6C-QCSX-Hxxxx |
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