HVAC
OEMs in the HVAC sector turn to Tria for embedded compute modules, integrated systems, and specialist design and manufacturing services.
We collaborate with customers to develop secure, efficient, and scalable solutions for next-generation climate control technologies, including smart thermostats, heat pumps, advanced air conditioning systems, and more.
As part of Avnet, Tria draws on decades of embedded design and manufacturing expertise, a global network of premier technology partners, and production campuses in Europe, with extended capabilities in North America and Asia.
OEMs count on Tria to deliver HVAC solutions that transform facilities into efficient, secure, and intelligent environments.
Application - HVAC
At Tria, we redefine building security and automation with cutting-edge IoT solutions. From smart thermostats and security cameras to fire safety systems and automated lighting, our technologies turn facilities into efficient, secure, and intelligent environments.
By embedding intelligence into everyday infrastructure, we enhance business value, drive energy efficiency, and accelerate innovation—transforming your vision into reality.
General Requirements for HVAC
Tria supports OEMs in the HVAC sector with:
- Designing user interfaces for occasional system status and service insights
- Delivering cost-competitive solutions
- Engineering for long-term reliability and product availability (15–20 years post-installation, with 10+ years of support)
- Typical production volumes of 50K–300K units annually
- Transitioning from MCUs to low-level MPUs for IoT connectivity and larger displays
- Developing advanced user interfaces (5–7” displays)
- Ensuring front-end design aligns seamlessly with customer-specific standards
CPU Building Blocks - HVAC
Typical CPU Platforms for applications at HVAC
MSC OSM-MF-IMX8PLUS
- Dual/Quad-core Arm Cortex-A53
- Multimedia 2D/3D GPU / NPU (2.3 TOPS)
- MIPI-DSI x4, PCI Express Gen 3
- 1x USB 2.0, 1x USB 3.0, 2x GbE, 2x CAN-FD
MSC OSM-MF-IMX8MINI
- Solo, Dual, or Quad-core Arm Cortex-A53
- Multimedia 2D/3D GPU (VPU available on Mini variant)
- MIPI-DSI x4, PCI Express Gen 2 (Mini only)
- 2x USB 2.0, GbE
MSC C6C-RLP (13th Gen Intel® Core™ CPU)
- Intel® Core™ 13th Gen processor
- Up to 4P+8E cores, 32GB LPDDR5-6400
- IB-ECC, PCIe 8x, TSN/TCC
- Industrial temperature range, industrial UC
MSC OSM-SF-IMX93
- Single or Dual-core Arm Cortex-A55 CPU
- MIPI-DSI x4 / LVDS (RGB optional)
- 2x Gigabit Ethernet (RGMII)
- 2x SPI, 4x I²C, 4x UART, 20 GPIOs, 2x ADC inputs, 2x CAN-FD
A complete Computer-on-Module functions as a ready-to-use macro, seamlessly integrating into a full-custom board design for any application.
This significantly reduces development time for customer-specific board designs, accelerating time-to-market with a proven, fully supported solution—including software and firmware.
Custom board and software solutions for HVAC
- Carrier board
- Custom ARM SBC
- Custom BSP / BIOS
- OS and application software support
Standard Compute Module
Standard Compute Module on Baseboard / Carrierboard
Compute module technology into full-custom compute design
HVAC - Typical HW Concept
Typical Block Diagram “HMI for heat pumps”
Display Innovation for HVAC applications
Tria’s ecosystem includes all major Tier 1 display manufacturers.
Custom displays are the new standard—most AvE projects require a full-stack approach, integrating display, touch, and an application-specific cover lens (glass) in a bonded solution.
With engineering and R&D in Germany and partnerships with leading touch, touch driver providers, and second-tier display integrators, we deliver tailored solutions for your application.
Standardized display touch platforms like SimpleFlex ensure faster time-to-market.
Typical Display – Touch Requirements
Display size: 5”–7” depending on UI and function
Display type: TFT display / ultra-low power
Brightness: 300–500 cd/m² for indoor use
Touch: PCAP low-cost / PCAP button
Bonding: Typical air-gap bonding
Operating temperature: Extended range of -20°C to +70°C
Longevity: 5–7 years (second source for the cell is crucial)
Custom HMI for Heat Pumps
Customer’s Requirements
- Advance heat pump usability beyond the competition
- Enhance energy efficiency through intelligent control
- Unify the user experience across multiple product series
Our Solution
- ARM-based single-board computer (SBC)
- 5” TFT display with capacitive touch
- Tooling-based plastic housing designed for seamless heat pump integration
- 15-year longevity
The Result
- Lower energy costs for end users through intelligent control
- Increased market share by simplifying usability
- Greater supply chain flexibility in a demanding market through in-house board and system manufacturing
Empower your product with Tria
If you’re building the next big thing in HVAC, Tria can help. Accelerate your product design, save on development costs and take advantage of the latest cutting edge processing by using embedded compute and systems from Tria.
Fill in the form below to reach out, and a member of the Tria team will contact you to discuss your project.