Traditional embedded modules rely on board-to-board connectors that add height, cost and potential points of failure. OSM takes a fundamentally different approach. By using a pre-tinned LGA package that solders directly to your carrier board, OSM modules are smaller, more robust and cheaper to assemble at scale.

OSM isn’t a replacement for connector-based standards like SMARC. It is engineered for applications where size, cost and automated assembly are the priority. To put it in perspective, even the largest OSM module at 45 x 45 mm is 51% smaller than a SMARC module, while its 662 BGA pins actually deliver more interface density. You get more capability in a fraction of the space.

The standard defines hardware and software interfaces for each module size, so you can swap between processors or upgrade to a more powerful module without redesigning your carrier board or reworking your software stack. Start with an NXP i.MX 91 for a cost-sensitive application, then move to a Qualcomm Dragonwing platform for edge AI – same footprint, same interfaces, no rework needed.
Because OSM modules are fully machine-processable during soldering, assembly and testing, they slot straight into standard SMT production lines. There’s no need for manual module placement or connector mating – they’re processed using standard pick-and-place, just like any other surface-mount component.

The standard also reserves a dedicated communication interface area for wireless connectivity, making it straightforward to integrate Wi-Fi, Bluetooth, cellular or other RF technologies via the carrier board.
And because OSM is an open-source standard maintained by SGeT, your design isn’t tied to a single vendor’s roadmap. You get the reliability of a stable, standardised platform with the freedom to choose the silicon that fits your application.