MSC C6B-MLH

The MSC C6B-MLH COM Express module features the Intel® Core™ Ultra processor, providing developers with a powerful workhorse to boost their target applications. The module is ideal for challenging tasks in robotics, medical, public safety, and gaming that require uncompromising performance. The architecture scales up to sixteen cores and twenty-two threads at 28/15W thermal design power (TDP). Together with the integrated AI accelerator (NPU) and up to 128 GPUs, the processor greatly supports AI projects and compute intense duties.

For highest data throughput the module enables fast DDR5 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to ninety-six GB. Up to sixteen PCIe Gen 4 lanes and an eight lane PEG port (PCIe Gen 4) allow for accessing external accelerators, storage, and I/O at high throughput. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller.

System investments are well protected through long-term availability of the module, designed, and manufactured by Tria Technologies. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Highlights

  • Intel® Core™ Ultra Processors Series 1 and 2
  • Up to sixteen cores, twenty-two threads
  • Integrated AI accelarator (NPU) Intel® AI Boost
  • Up to 96GB DDR5-6400 SDRAM, dual channel, IB-ECC
  • Intel® Arc™ Graphics, up to 8 Xe cores (128 EUs)
  • Three DisplayPort/HDMI interfaces
  • LVDS and Embedded DisplayPort interface
  • Four independent display streams
  • Up to sixteen PCI Express® Gen 4 lanes
  • PEG 1×8, PCIe Gen 4 (optional)
  • Up to two USB4 ports
  • Three USB 3.2 Gen1/2 and eight USB 2.0 ports
  • Two UARTs
  • Optional on-board NVMe SSD, up to 1TB
  • Up to two SATA 6Gb/s mass storage interfaces
  • 1 / 2.5 Gb Ethernet port (Intel® i226)
  • Trusted Platform Module TPM 2.0
  • Long-term product availability for selected variants

Specifications

Technologyx86
Form FactorCOM Express Basic
CPUIntel® Core™ Ultra Processors Series 2:
Intel® Core™ Ultra 9 processor 285H 6P+8E+2LPE/22T, 2.9GHZ, 8Xe/128EUs,
24MB L3, vPRO®, 45W BP
Intel® Core™ Ultra 7 processor 265H 6P+8E+2LPE/22T, 2.2GHZ, 8Xe/128EUs,
24MB L3, vPRO®, 28W BP
Intel® Core™ Ultra 7 processor 255H 6P+8E+2LPE/22T, 2.0GHZ, 8Xe/128EUs,
24MB L3, 28W BP
Intel® Core™ Ultra 5 processor 235H 4P+8E+2LPE/18T, 2.4GHZ, 8Xe/128EUs,
18MB L3, vPRO®, 28W BP
Intel® Core™ Ultra 5 processor 225H 4P+8E+2LPE/18T, 1.7GHZ, 7Xe/112EUs,
18MB L3, 28W BP
Intel® Core™ Ultra 7 processor 265U 2P+8E+2LPE/14T, 2.1GHZ, 4Xe/64EUs,
12MB L3, vPRO®, 15W BP
Intel® Core™ Ultra 7 processor 255U 2P+8E+2LPE/14T, 2.0GHZ, 4Xe/64EUs,
12MB L3, 15W BP
Intel® Core™ Ultra 5 processor 235U 2P+8E+2LPE/14T, 2.0GHZ, 4Xe/64EUs,
12MB L3, vPRO®, 15W BP
Intel® Core™ Ultra 5 processor 225U 2P+8E+2LPE/14T, 1.5GHZ, 4Xe/64EUs,
12MB L3, 15W BP
Intel® Core™ Ultra Processors Series 1:
Intel® Core™ Ultra 7 processor 165H 6P+8E+2LPE/22T, 1.4GHZ, 8Xe/128EUs,
24MB L3, vPRO®, 28W BP
Intel® Core™ Ultra 7 processor 155H 6P+8E+2LPE/22T, 1.4GHZ, 8Xe/128EUs,
24MB L3, 28W BP
Intel® Core™ Ultra 5 processor 135H 4P+8E+2LPE/18T, 1.7GHZ, 8Xe/128EUs,
18MB L3, vPRO®, 28W BP
Intel® Core™ Ultra 5 processor 125H 4P+8E+2LPE/18T, 1.2GHZ, 7Xe/112EUs,
18MB L3, 28W BP
Intel® Core™ Ultra 7 processor 165U 2P+8E+2LPE/14T, 1.7GHZ, 4Xe/64EUs,
12MB L3, vPRO®, 15W BP
Intel® Core™ Ultra 7 processor 155U 2P+8E+2LPE/14T, 1.7GHZ, 4Xe/64EUs,
12MB L3, 15W BP
Intel® Core™ Ultra 5 processor 135U 2P+8E+2LPE/14T, 1.6GHZ, 4Xe/64EUs,
12MB L3, vPRO®, 15W BP
Intel® Core™ Ultra 5 processor 125U 2P+8E+2LPE/14T, 1.3GHZ, 4Xe/64EUs,
12MB L3, 15W BP
Note: P core base frequency at processor base power (BP) shown, other clock
frequencies at different power levels supported
ChipsetIntegrated into SoC
RAM2x 262-pin SO-DIMM socket for up to 2x 48GB DDR5 SDRAM DDR5-6400 Series 2
processors DDR5-5600 Series 1 processors dual channel operation minimum capacity
1x 8GB single channel operation inband ECC (IB-ECC) option (OS dependent)
Storage InterfacesUp to 2x SATA channels (up to 6Gb/s)optional on-board NVMe, 64GB to 1TB
USBUp to 2x USB4 (mutually exclusive with DDI 1, 2)
3x USB 3.2 (Gen 1 & 2),
8x USB 2.0
Bus InterfacesPCI Express® Gen 4, 1x8, on COMe PCIe[24:31], PEG port, optional ¹PCI Express® Gen 4, 1x4, on COMe PCIe[20:23], optionalPCI Express® Gen 4, 1x4, on COMe PCIe[16:19]Up to eight PCI Express® Gen 4 lanes on COMe PCIe[0:7], flexible bifurcation options,up to 5 root portsLPC bus (Low Pin Count bus, no DMA support)¹ Available on H-series processors
Display ControllerIntel® Arc™ Graphics, up to 8 Xe cores / 128 execution units (EU)
H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode.
Display InterfacesFour independent display streams
2x USB4/USB-C ports (DP tunneling)
3x Digital Display Interface (DP 2.1, HDMI 2.1)
1x Embedded DisplayPort 1.4b
1x LVDS 24bit, dual-channel
Network Interface10/100/1000Base-TX, 2.5G² based on Intel i226-LM² Available bandwidths depending on carrier design
Audio InterfaceHigh Definition Audio
Security DeviceTPM 2.0
MiscellaneousWatchdog Timer:Initiates system reset, programmableFan Supply:4-pin header for CPU fan, PWM speed controlledand PWM speed control for system fan supportedRTC battery:externalSystem Monitoring:voltage, temperature, CPU fan, system fan
Feature HighlightsType 6 pin-out
FirmwareUEFI Firmware:AMI Aptio® VSecurity:TPM 2.0 support, TCG compliantPower Management:ACPIActive fan controlUSB:USB legacy support (keyboard, mouse, storage)Monitoring:System MonitoringHealth MonitoringMSC Adv. Boot Device Selection:Boot device priority setting based on physical interfaces
OS SupportWindows 10 IoT Enterprise 2021 LTSCWindows 11 IoT Enterprise LTSC (future availability)BSP for Linux (Yocto)
Power RequirementVoltage:+8.5V to +20V, +5V Stby optional, +3V RTC voltagePower Consumption:tbd W to tbd W (typ.)
EnvironmentAmbient Temperature:0° … 60°C (operating)-25° … 85°C (storage)Humidity:5 … 95% (operating, non-condensing),5 … 95% (storage, non-condensing)
Dimensions125 x 95
CertificatesUL / CE

Order Info

Order No.DescriptionReferenceStatus
TBDCOM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Core Ultra 7 265H 16C/22T, vPro 2.2GHz, 28W BPGraphics: Intel Arc 128 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSIEthernet: Intel i226-LM Gbit, TSN HD audio TPM 2.02x SATA 3x USB3, 8x USB2, PEG x8 Gen 4, PCIe G4 1x4, PCIe G4 6x2x socket for DDR50...+60°C.MSCC6B-MLH-265H-NN30JCPCBFTXOR
TBDCOM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Core Ultra 5 235H 14C/18T, vPro 2.4GHz, 28W BPGraphics: Intel Arc 128 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSIEthernet: Intel i226-LM Gbit, TSN HD audio TPM 2.02x SATA, 3x USB3, 8x USB2, PEG x8 Gen 4, PCIe G4 2x4, PCIe G4 6x2x socket for DDR50...+60°C.MSCC6B-MLH-235H-NN30JCPCBFTXOR
TBDCOM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Core Ultra 7 265U 12C/14T, vPro 2.1GHz, 15W BPGraphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSIEthernet: Intel i226-LM Gbit, TSN HD audio TPM 2.02x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x2x socket for DDR50...+60°C.MSCC6B-MLH-265U-NN30JCPCBFTXOR
TBDCOM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Core Ultra 5 235U 12C/14T, vPro 2.0GHz, 15W BPGraphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSIEthernet: Intel i226-LM Gbit, TSN HD audio TPM 2.02x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x2x socket for DDR50...+60°C.MSCC6B-MLH-235U-NN30JCPCBFTXOR
TBDCOM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Core Ultra 7 155H 16C/22T, 1.4GHz, 28W BPGraphics: Intel Arc 128 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSIEthernet: Intel i226-LM Gbit, TSN HD audio TPM 2.02x SATA, 3x USB3, 8x USB2, PEG x8 Gen 4, PCIe G4 2x4, PCIe G4 6x2x socket for DDR50...+60°C.MSCC6B-MLH-155H-NN30JCPCBFTXOR
TBDCOM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Core Ultra 5 125H 14C/18T, 1.2GHz, 28W BPGraphics: Intel Arc 112 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSIEthernet: Intel i226-LM Gbit, TSN HD audio TPM 2.02x SATA, 3x USB3, 8x USB2, PEG x8 Gen 4, PCIe G4 2x4, PCIe G4 6x2x socket for DDR50...+60°C.MSCC6B-MLH-125H-NN30JCPCBFTXOR
TBDCOM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Core Ultra 7 155U 12C/14T, 1.7GHz, 15W BPGraphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSIEthernet: Intel i226-LM Gbit, TSN HD audio TPM 2.02x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x2x socket for DDR50...+60°C.MSCC6B-MLH-155U-NN30JCPCBFTXOR
TBDCOM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Core Ultra 5 125U 12C/14T, 1.3GHz, 15W BPGraphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSIEthernet: Intel i226-LM Gbit, TSN HD audio TPM 2.02x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x2x socket for DDR50...+60°C.MSCC6B-MLH-125U-NN30JCPCBFTXOR

Accessories

Carrier Options

Order No.DescriptionReference
111650COM Express Type 6 Evaluation Carrier Boardwith various PCI Express x1, x4 and x16 slots, USB 3.0/2.0,GbE, M.2, SD card socket, SATA, DisplayPort, LVDS,eDP, VGA, HD audio interfaces; ATX power connector.Dimensions 305 x 244 mm (ATX form factor)MSC C6-MB-EV4 PCBFTX

Cooling Options

Order No.DescriptionReference
114058Passive Heatsink for C6B-MLH consisting of a singlepiecealuminum profile with fins, standoffs without thread (2.7mminner diameter), screws and thermopads for the thermal contact toCPU, chipset, NVMe.MSC C6B-MLH-01 HSI-001
114175Passive Heatsink / heat pipe for C6B-MLHconsisting of a single-piece aluminum profile with finsand embedded heatpipe, standoffs without thread (2.7mminner diameter), screws and thermopads for the thermalcontact to CPU, chipset, NVMe.MSC C6B-MLH-01 HSI-HP-001
114057Heatspreader for C6B-MLH. Single-piecealuminum profile, standoffs without thread (2.7mm innerdiameter), screws and thermopads for the thermal contactto CPU, chipset, NVMe.MSC C6B-MLH-01 HSP-001
114176Heatspreader / heat pipe for C6B-MLH. Singlepiecealuminum profile with embedded heat pipe, standoffswithout thread (2.7mm inner diameter), screws andthermopad for the thermal contact to CPU, chipset, NVMe.MSC C6B-MLH-01 HSP-HP-001
114177Heatspreader for C6B-MLH. Single-piecealuminum profile, standoffs with M2.5 thread, screwsand thermopads for the thermal contact to CPU, chipset,NVMe.MSC C6B-MLH-02 HSP-001

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Download Datasheet

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