TRIA OSM-LF-IMX95 - Tria

TRIA OSM-LF-IMX95

The TRIA OSM-LF-IMX95 is based on the new OSM 1.2 standard (Size-L) “Large” for completely machine processible low-cost embedded computer modules during soldering, assembly and testing.
Highly scalable and equipped with i.MX 95 Series Applications Processors, manufactured by NXP. The processors integrates up to six Arm Cortex-A55 cores, dedicated Arm Cortex-M7 and M33 Real-Time Processors, immersive Arm Mali™ GPU, 4K capable VPU combined with Edgelock® secure enclave security. The i.MX 95 family is the first i.MX applications processor family to integrate NXP’s eIQ® Neutron neural processing unit (NPU) and a new image signal processor (ISP) developed by NXP, helping developers to build powerful, next-generation edge platforms.
TRIA OSM-LF-IMX95 provides fast LPDDR5 memory technology with inline ECC support, combined with up to 256GB eMMC Flash memory and high speed interfaces such as SerDes Interface (up to 10G Ethernet), Dual RGMII interface (1G Ethernet), USB 3.0 and PCI Express Gen. 3. Various standard interfaces for embedded applications such as CAN-FD, dual-channel LVDS, MIPI DSI and MIPI CSI for connecting cameras are available.
The module is compliant with the new OSM 1.2 standard (OSM-LF). For evaluation and design-in of the new OSM-LF-IMX95 module, TRIA provides a development platform and a starter kit. A Yocto based Linux Board Support Package is available (Android 12 and Windows 10 IoT Enterprise support on request).

Highlights

  • Hexa core Arm Cortex-A55 up to 2.0GHz
  • ARM Cortex-M7 Real Time Processor at 800MHz
  • Arm Cortex-M33 Real Time Processor at 333MHz
  • NXP eIQ Neutron Neural Processing Unit.
  • NXP Image Signal Processor
  • Arm Mali Graphics Processing Unit
  • Video Processing Unit up to 4k decode/encode
  • Up to 16GB LPDDR5 SDRAM with inline ECC
  • Up to 256GB eMMC Flash
  • Dual-channel LVDS / MIPI-DSI x4
  • Dual MIPI CSI-2 Camera interface
  • 2x PCI Express x1 Gen. 3
  • 1x USB 3.0/2.0 Host/Device interface
  • 1x USB 2.0 Host/Device interface
  • 2x Gigabit Ethernet (RGMII)
  • 2.5 Gigabit Ethernet (SGMII)
  • 2x SDIO interface
  • 3x CAN-FD Interface
  • 2x I2S Audio Interface
  • 24x GPIO, 6x ADC, 4x PWM
  • UART, SPI, QSPI, I2C

Specifications

TechnologyARM
Form FactorOSM-LF, 662 Pin, RM 1,25 mm
CPUNXP i.MX 95 Arm Cortex-A55 Applications Processor
6/4 cores, 1.8 - 2.0 GHz, with ISP, NPU, GPU, VPU, DC, dual-core option*
6/4 cores, 1.8 - 2.0 GHz, with ISP, NPU, VPU
6/4 cores, 1.8 - 2.0 GHz, with NPU, GPU, VPU, DC
6/4 cores, 1.8 - 2.0 GHz, with NPU, dual-core option
*dual-core part available in commercial temperature and 1.0 GHz
Arm Cortex-M7 Real Time Processor at 800MHz
Arm Cortex-M33 Real Time Processor at 333MHz
NXP eIQ Neutron Neural Processing Unit (processor SKU dependent)
NXP Image Signal Processor (processor SKU dependent)
ChipsetSOC
RAMUp to 16GB 6400MT/s LPDDR5 SDRAM, soldered, inline ECC support
FlashUp to 256GB eMMC 5.1 Flash
QSPI NOR/NAND Flash (optional)
Storage Interfaces2x MMC/SD/SDIO
USB1x USB 2.0 Host/Client, 1x USB 2.0 Host/Client or 1x USB 3.0 Host/Client
Serial Interfaces3x UART Console with Rx, Tx only
2x UART with 2-wire hand shake (RTS/CTS)
Bus Interfaces2x PCI Express x1 Gen.3 lane
5x I2C up to 400 Kbit/s (2x for GP)
2x CAN-FD / CAN 2.0B
1x CAN-FD / CAN 2.0B on vendor defined pins
1x SPI (with two chip selects)
1x QSPI/SPI (with two chip selects)
Display ControllerArm Mali G310 GPU (OpenGL® ES 3.2, Vulkan®1.2, OpenCL 3.0), (processor SKU dependent)
Video Processing Unit with up to 4k decode/encode (processor SKU dependent)
Display InterfacesMIPI-DSI Display Interface, 4 lanes, up to 13840x1440p60
Dual-channel 18/24 bit LVDS interface, up to 1080p60
Network Interface2x Gigabit Ethernet (RGMII interface)
1x 2.5 Gigabit Ethernet (SGMII interface)
with TSN support
Audio Interface2x I2S Audio
Security DeviceAdvanced Security, Safety, and Reliability integrated in the SOC
Integrated EdgeLock secure enclave to simplify implementation of security critical
functions like secure boot, cryptography, trust provisioning, run-time attestation,
key management services, provision for secure remote management, secure
over-the-air updates (OTA) and dedicated cryptographic engine.
MiscellaneousWatchdog Timer for system reset (programmable, 1s … 600s)
Temperature compensated RTC
24x GPIO, configurable as input or output
4x PWM
2x ADC inputs (12-bit)
4x ADC inputs (12-bit) on vendor defined pins
64kbit ID EEPROM on I2C bus
MIPI CSI-2 camera interface (CSIA, 4-lane)
MIPI CSI-2 camera interface (CSIB, 4-lane), shared with MIPI-DSI interface
Feature HighlightsOSM V1.2, Size-L compatible
OS SupportLinux Board Support Package
Android and Windows 10 IoT Enterprise support on request
Power RequirementPower Supply +5V +/-5%
Power Consumption 4-6 W typ. (depending on CPU)
EnvironmentTemperature Range:
Commercial: 0° … 70°C (operating) -20° … 85°C (storage)
Extended: -25° … 85°C (operating) -40° … 85°C (storage)
Industrial: -40° … 85°C (operating) -40° … 85°C (storage)
Humidity:
5 … 95% (operating, non condensing)
5 … 95% (storage, non-condensing)
Dimensions45 x 45 mm
CertificatesUL /CE
CarrierTRIA OSM-VB-95

Order Info

Order No.DescriptionReferenceStatus

116760

OSM 1.2 module based on NXP i.MX 9596, Hexa Core Cortex-A55 processor at 2.0GHz, NPU, ISP, 8GB LPDDR5, 32MBit QSPI, 32GB eMMC Flash, 2x RGMII, 1x SGMII (2.5G), 2x PCIe, 1x USB3.0 (OTG), 1x USB2.0 (OTG), LVDS, MIPI-DSI, MIPI CSI-2 Camera input (CSI_A), industrial temperature -40...+85°C
(Engineering Sample - get in touch with your sales representative)

MSC OSM-LF-IMX95-HC9-35N0A00I ES1 PCBES

OR

116755

OSM 1.2 module based on NXP i.MX 9596, Hexa Core Cortex-A55 processor at 2.0GHz, NPU, ISP, 2GB LPDDR5, 8GB eMMC Flash, 2x RGMII, 2x PCIe, 2x USB2.0 (OTG), LVDS, MIPI-DSI, MIPI CSI-2 Camera input (CSI_A), industrial temperature -40...+85°C
(Engineering Sample - get in touch with your sales representative)

MSC OSM-LF-IMX95-HC9-13N0A00I ES1 PCBES

OR

Download Datasheet

Click the link below to download TRIA OSM-LF-IMX95 datasheet.

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