TRIA OSM-SF-IMX93
The TRIA OSM-SF-IMX93 is based on the new OSM 1.1 standard (Size-S) “Small” for completely machine processible low-cost embedded computer modules during soldering, assembly and testing.
Highly scalable and equipped with i.MX 93 Applications Processors manufactured by NXP. The processors integrate ARM Cortex-A55 cores, bringing performance and energy efficiency to Linux-based edge applications and the ARM Ethos-U65 microNPU, enabling developers to create more capable, cost-effective and energy-efficient machine learning (ML) applications. The i.MX 93 processors deliver advanced security with integrated EdgeLock secure enclave and an efficient 2D graphics processing unit (GPU).
TRIA OSM-SF-IMX93 provides fast and low power LPDDR4 memory technology with inline ECC support, combined with up to 256GB eMMC Flash memory. Various interfaces for embedded applications such as Dual Gigabit Ethernet (RGMII), USB 2.0, 2x CAN-FD, MIPI-DSI and MIPI CSI-2 (2-lane) for connecting a camera are available. The typical design power ranges from 2 W to 4 W.
The module is compliant with the new OSM 1.1 standard (OSM-SF). For evaluation and design-in of the new OSM-SF-IMX93 module, Tria provides a development platform and a starter kit. A Yocto based Linux Board Support Package is available (Android support on request).
Highlights
- Single or Dual core Arm Cortex-A55 Applications Processors up to 1.7GHz
- Arm Cortex-M33 Real Time Processor at 250MHz
- Arm Ethos™-U65 microNPU with 256 MACs/Cycle
- Pixel processing pipeline (PXP) engine
- Up to 2GB LPDDR4 SDRAM with inline ECC
- Up to 256GB eMMC Flash
- MIPI-DSI x4, Single-channel LVDS (opt. on RGB)
- MIPI CSI-2 Camera Interface
- 1x USB 2.0 Host interface
- 1x USB 2.0 Host/Device interface
- 2x Gigabit Ethernet (RGMII)
- 2x SD/SDIO interfaces
- 2x CAN-FD interfaces
- 2x ADC inputs (12-bit)
- Optimized design for low power applications
- OSM 1.1 (SF) Compliant, 322 Pin, RM 1,25 mm