TRIA Q7-ALN
The new TRIA Q7-ALN module features the Intel Atom® processors x7000E Intel® Core™ i3 processor Intel® Processors N Series (codenamed “Alderlake Lake N”). The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment.
The new TRIA Q7-ALN offers triple independent display support with a maximum of 4k resolution, fast LPDDR5 memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient Q7 2.1 module.
Different SOCs with dual-, quad- and eight-core processors are supported by this design. In addition to an extensive set of interfaces and features, the TRIA Q7-ALN offers 1 Gigabit Ethernet based on Intel® i226 and supports up to 2.5GbE bandwidth.
For evaluation and design-in of the TRIA Q7-ALN module, Tria Technologies provides a suitable Q7 2.1 development platform. A complete, ready-to-run Starterkit is also available.
Highlights
- Up to eight processing cores
- Power efficient processors, TDP 6 to 12W
- Integrated Intel UHD Gen.12 graphics, max. 32 executing units .
- Up to 16GB LPDDR5 SDRAM, In-band ECC
- Up to 256GB eMMC 5.1 Flash (optional)
- 2x SATA-III interface (6Gbps)
- 1x DP++
- LVDS / Embedded DisplayPort
- Up to 4x PCI Express x1/x2/x4 Gen. 3
- 2x USB 3.1 Host interfaces
- 8x USB 2.0 Host interfaces
- 1x 1/2,5 Gigabit Ethernet (Intel® i226)
- 1x SGMII Interface on SATA-Port1 (optional)
- UART, SPI, I2C, SMBus.
- HD Audio
- Trusted Platform Module TPM 2.0
- Qseven 2.1 compliant
- UEFI Firmware
Specifications
| Technology | x86 |
| Form Factor | Qseven |
| CPU | Intel® Core™ i3-N355, eight-core, 1.0GHz/1.9GHz, 32EU, 9/15W, PUC Intel® Core™ i3-N305, eight-core, 1.0GHz/1.8GHz, 32EU, 9/15W, PUC Intel Atom® x7425E, four-core, 1.5GHz, 24EU, TCC, 12W, EUC Intel Atom® x7213E, two-core, 1.7GHz, 16EU, TCC, 10W, EUC Intel Atom® x7211E, two-core, 1.0GHz, 16EU, TCC, 6W, EUC Intel® Processor N250, quad-core, 1.3GHz, 32EU, 6W, PUC Intel® Processor N200, quad-core, 1.0GHz, 32EU, 6W, PUC Intel® Processor N150, quad-core, 0.8GHz, 24EU, 6W, PUC Intel® Processor N97, quad-core, 2.0GHz, 24EU, 12W, PUC Intel® Processor N50, dual-core, 1.0GHZ, 16EU, 6W, PUC EUC - Intel Embedded Use Conditions PUC - Intel PC Client Use Conditions |
| Chipset | Integrated in SOC |
| RAM | Up to 16GB LPDDR5 SDRAM, up to 4800MT/s, IBECC, soldered |
| Flash | Up to 256GB eMMC 5.1 Flash (optional) |
| Storage Interfaces | 2x SATA-3.2 6Gbps |
| USB | 2x USB 3.2, 6x USB 2.0, 1x Dual Role Port (Host/Device)* or 1x USB 3.2, 8x USB 2.0, 1x Dual Role Port (Host/Device)* *One USB 3.2 port according to Qseven Rev. 2.1 (only SS signals) |
| Serial Interfaces | 1x UART (with RTS/CTS) |
| Bus Interfaces | Up to 4x PCI-Express x1 Gen. 3 lanes 1x LPC Bus 1x I2C Bus 1x SPI Bus 1x SMBus |
| Display Controller | Integrated Intel UHD Graphics (Gen12) Up to 32 execution units (EU) Note: only available with the Intel Atom Processor x7000RE Series |
| Display Interfaces | Three independent displays supported 1x DP++ 1x eDP 1.4b (1x DP) / 1x dual channel LVDS Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or 2x Embedded DisplayPort 1.4b up to 4096 x 2160 @ 60Hz |
| Network Interface | 1x 10/100/1000Base-T, up to 2.5Gbps based on Intel i226 with TSN support 1x SGMII Interface on SATA-Port1 (optional) |
| Audio Interface | High Definition Audio |
| Security Device | Infineon Trusted Platform Module 2.0 (optional) |
| Miscellaneous | Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan |
| Feature Highlights | Qseven Rev.2.1 compliant |
| Firmware | AMI Aptio UEFI |
| OS Support | Windows 10 LTSC Windows 11 LTSC Yocto Project (LTS kernel 2021) |
| Power Requirement | +5V +/-5% +5V Standby |
| Environment | Temperature Range: 0° … 60°C (operating) -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing) |
| Dimensions | 70 x 70 mm |
| Certificates | UL / CE |
| Cooling | Heatspreader Heatsink |
| Carrier | TRIA Q7-MB-EP5 TRIA Q7-MB-EP6 |
Order Info
| Order No. | Description | Reference | Status |
| tbd | Get in touch with your sales representative | tbd | OR |
Accessories
Carrier Options
| Order No. | Description | Reference |
| 67690 | Qseven Rev. 2.0 compatible embedded platform (148 x 102mm), 10-28V input voltage, 1x RS232 on DB9 connector, 1x RS485 on pin header, 1x RS232 no handshake on pin header, dual RJ45 LAN connector with LED, 1x SATA, 1x mSATA slot, SD card holder, 1x USB 3.0 connector, 2x USB 2.0 connector, 1x USB 2.0 on pin row, 1x microUSB 2.0 OTG, CAN, I2C, LPC/ GPIO on pin header, I2C/SMBus, SPI, DisplayPort connector, LVDS/eDP on JILI30 connector, regulated backlight supply, mini PCI Express slot, HD Audio, CMOS battery. Commercial temperature range 0..+70°C | MSC Q7-MB- EP6-601 PCBFTX |
Cooling Options
| Order No. | Description | Reference |
| 118185 | Passive Heatsink for Q7-ALN and Q7-ASL variants, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC Q7-ASL-01 HSI-001 |
| 118186 | Heatspreader for Q7-ALN and Q7-ASL variants, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC Q7-ASL-01 HSP-001 |
| 1053769 | Heat rail for Q7 baseboards. Recommended for conductive heat transfer from the Q7 module to the Q7 baseboard. Already assembled on all MSC baseboards. | MSC Q7-XXX-01 HTR-001 |
