TRIA Q7-ASL
The new TRIA Q7-ASL module features the Intel Atom® processors x7000RE/C Series (codenamed “Amston Lake”). The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment. The board is ideal for system products that are exposed to harsh ambient conditions. It is designed for extended temperature range and 24/7 continuous operation.
The new TRIA Q7-ASL offers triple independent display support with a maximum of 4k resolution, fast LPDDR5 memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient Q7 2.1 module.
Different SOCs with dual-, quad- and eight-core processors are supported by this design. In addition to an extensive set of interfaces and features, the TRIA Q7-ASL offers 1 Gigabit Ethernet based on Intel® i226 and supports up to 2.5GbE bandwidth.
For evaluation and design-in of the TRIA Q7-ASL module, Tria Technologies provides a suitable Q7 2.1 development platform. A complete, ready-to-run Starterkit is also available.
Highlights
- Up to eight processing cores
- Power efficient processors, TDP 6 to 12W
- Integrated Intel UHD Gen.12 graphics, max. 32 executing units .
- Up to 16GB LPDDR5 SDRAM, In-band ECC
- Up to 256GB eMMC 5.1 Flash (optional)
- 2x SATA-III interface (6Gbps)
- 1x DP++
- LVDS / Embedded DisplayPort
- Up to 4x PCI Express x1/x2/x4 Gen. 3
- 2x USB 3.1 Host interfaces
- 8x USB 2.0 Host interfaces
- 1x 1/2,5 Gigabit Ethernet (Intel® i226)
- 1x SGMII Interface on SATA-Port1 (optional)
- UART, SPI, I2C, SMBus.
- HD Audio
- Trusted Platform Module TPM 2.0
- Qseven 2.1 compliant
- UEFI Firmware
Specifications
| Technology | x86 |
| Form Factor | Qseven |
| CPU | Intel Atom® x7835RE, octa-core, 1.3GHz, 32EU, TCC, 12W, IUC, ET Intel Atom® x7433RE, quad-core, 1.5GHz, 32EU, TCC, 9W, IUC, ET Intel Atom® x7213RE, dual-core, 2.0GHz, 16EU, TCC, 9W, IUC, ET Intel Atom® x7211RE, dual-core, 1.0GHz, 16EU, TCC, 6W, IUC, ET Intel Atom® x7405C, quad-core, 2.2GHz, no GPU, TCC, 12W, EUC, CT Intel Atom® x7203C, dual-core, 2.0GHz, no GPU, TCC, 9W, EUC, CT Note: base frequency shown, other frequencies supported ET- Extended temperature CT- Commercial temperature EUC - Intel Embedded Use Conditions IUC - Intel Industrial Use Conditions |
| Chipset | Integrated in SOC |
| RAM | Up to 16GB LPDDR5 SDRAM, up to 4800MT/s, IBECC, soldered |
| Flash | Up to 256GB eMMC 5.1 Flash (optional) |
| Storage Interfaces | 2x SATA-3.2 6Gbps |
| USB | 2x USB 3.2, 6x USB 2.0, 1x Dual Role Port (Host/Device)* or 1x USB 3.2, 8x USB 2.0, 1x Dual Role Port (Host/Device)* *One USB 3.2 port according to Qseven Rev. 2.1 (only SS signals) |
| Serial Interfaces | 1x UART (with RTS/CTS) |
| Bus Interfaces | Up to 4x PCI-Express x1 Gen. 3 lanes 1x LPC Bus 1x I2C Bus 1x SPI Bus 1x SMBus |
| Display Controller | Integrated Intel UHD Graphics (Gen12) Up to 32 execution units (EU) Note: only available with the Intel Atom Processor x7000RE Series |
| Display Interfaces | Three independent displays supported 1x DP++ 1x eDP 1.4b (1x DP) / 1x dual channel LVDS Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or 2x Embedded DisplayPort 1.4b up to 4096 x 2160 @ 60Hz |
| Network Interface | 1x 10/100/1000Base-T, up to 2.5Gbps based on Intel i226 with TSN support 1x SGMII Interface on SATA-Port1 (optional) |
| Audio Interface | High Definition Audio |
| Security Device | Infineon Trusted Platform Module 2.0 (optional) |
| Miscellaneous | Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan |
| Feature Highlights | Qseven Rev.2.1 compliant |
| Firmware | AMI Aptio UEFI |
| OS Support | Windows 10 LTSC Windows 11 LTSC Yocto Project (LTS kernel 2021) |
| Power Requirement | +5V +/-5% +5V Standby |
| Environment | Temperature Range: 0° … 60°C (operating) -25° … 85°C (storage) -40° … 85°C (operating industrial) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing) |
| Dimensions | 70 x 70 mm |
| Certificates | UL / CE |
| Cooling | Heatspreader Heatsink |
| Carrier | TRIA Q7-MB-EP5 TRIA Q7-MB-EP6 |
Order Info
| Order No. | Description | Reference | Status |
| 118187 | Qseven 2.1 module with Intel Atom x7835RE, Octa-Core (1.3GHz), 12W, TCC, 16GB LPDDR5 (4800 MT/s), 32EU, 64GB eMMC, 2x SATA, 1x 2.5GbE LAN, 2x USB 3.2, 6x USB 2.0 (1x Host/Device), TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40°C...+85°C (Engineering Sample - get in touch with your sales representative) | MSC Q7-ASL- X7835RE-46N0111I ES PCBES | OR |
| 118188 | Qseven 2.1 module with Intel Atom x7433RE, Quad-Core (1.5GHz), 9W, TCC, 16GB LPDDR5 (4800 MT/s), 32EU, 64GB eMMC, 2x SATA, 1x 2.5GbE LAN, 2x USB 3.2, 6x USB 2.0 (1x Host/Device), TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40°C...+85°C (Engineering Sample - get in touch with your sales representative) | MSC Q7-ASL- X7433RE-46N0111I ES PCBES | OR |
| 118189 | Qseven 2.1 module with Intel Atom x7433RE, Quad-Core (1.5GHz), 9W, TCC, 8GB LPDDR5 (4800 MT/s), 32EU, 16GB eMMC, 1x SATA, SGMII on SATA0, 1x 2.5GbE LAN, 2x USB 3.2, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40°C...+85°C (Engineering Sample - get in touch with your sales representative) | MSC Q7-ASL- X7433RE-34N0291I ES PCBES | OR |
Accessories
Carrier Options
| Order No. | Description | Reference |
| 67690 | Qseven Rev. 2.0 compatible embedded platform (148 x 102mm), 10-28V input voltage, 1x RS232 on DB9 connector, 1x RS485 on pin header, 1x RS232 no handshake on pin header, dual RJ45 LAN connector with LED, 1x SATA, 1x mSATA slot, SD card holder, 1x USB 3.0 connector, 2x USB 2.0 connector, 1x USB 2.0 on pin row, 1x microUSB 2.0 OTG, CAN, I2C, LPC/ GPIO on pin header, I2C/SMBus, SPI, DisplayPort connector, LVDS/eDP on JILI30 connector, regulated backlight supply, mini PCI Express slot, HD Audio, CMOS battery. Commercial temperature range 0..+70°C | MSC Q7-MB- EP6-601 PCBFTX |
Cooling Options
| Order No. | Description | Reference |
| 118185 | Passive Heatsink for Q7-ALN and Q7-ASL variants, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC Q7-ASL-01 HSI-001 |
| 118186 | Heatspreader for Q7-ALN and Q7-ASL variants, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC Q7-ASL-01 HSP-001 |
| 1053769 | Heat rail for Q7 baseboards. Recommended for conductive heat transfer from the Q7 module to the Q7 baseboard. Already assembled on all MSC baseboards. | MSC Q7-XXX-01 HTR-001 |
