TRIA Q7-EL
The TRIA Q7-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design.
The TRIA Q7-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4x memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient Q7 module.
Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the TRIA Q7-EL offers 1 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 1 CAN-FD interface.
For evaluation and design-in of the TRIA Q7-EL module, Tria provides a suitable Q7 2.1 development platform. A complete, ready-to-run Starterkit is also available.
Highlights
- Intel Atom x6xxxRE, Real-time Embedded SKU´s, dual/quad-core (6W-12W)
- Intel Atom x6xxxE, Embeddded SKU´s, dual/quad-core (6W-12W)
- Intel Pentium/Celeron J64xx, PC Client SKU´s, quad-core (6W-12W)
- Intel Pentium/Celeron N6xxx, PC Client SKU´s, dual/quad-core (6.5W-12W)
- Integrated Intel UHD Graphics (Gen11)
- Up to 16GB LPDDR4x SDRAM with IBECC (only Atom SKU´s)
- Up to 256GB eMMC 5.1, Flash (optional)
- 2x SATA-III interface (6Gbps)
- 1x DP++
- 2x eDP 1.3 (1x DP) / MIPI-DSI 1.2 / 1 x dual channel LVDS
- Triple Independent Display support
- DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan v1.1
- Up to 4x PCI Express x1/x2/x4 Gen. 3
- 2x USB 3.1 Host interfaces
- 8x USB 2.0 Host interfaces
- 1x USB 3.0/2.0 Dual Role Port (Host/Device)
- 1x Gigabit Ethernet with TSN/TCC
- 1x SGMII Interface on SATA-Port1 (optional)
- UART, LPC, SPI, I2C, SMBus
- 1x CAN-FD
- HD Audio, SD Card interface
- Trusted Platform Module (optional)
- Qseven Rev. 2.1 compliant
- UEFI Firmware
Specifications
| Technology | x86 |
| Form Factor | Qseven |
| CPU | Intel Atom x6425RE Processor, quad-core 1.9GHz, 32EU, TCC, IBECC, 12W, IUC Intel Atom x6416RE Processor, quad-core 1.7GHz, 16EU, TCC, IBECC, 9W, IUC Intel Atom x6414RE Processor, quad-core 1.5GHz, 16EU, TCC, IBECC, 9W, IUC Intel Atom x6214RE Processor, dual-core 1.4GHz, 16EU, TCC, IBECC, 6W, IUC Intel Atom x6212RE Processor, dual-core 1.2GHz, 16EU, TCC, IBECC, 6W, IUC Intel Atom x6425E Processor, quad-core 2.0/3.0GHz, 32EU, IBECC, 12W, EUC Intel Atom x6413E Processor, quad-core 1.5/3.0GHz, 16EU, IBECC, 9W, EUC Intel Atom x6211E Processor, dual-core 1.3/3.0GHz, 16EU, IBECC, 6W, EUC Intel Pentium J6426 Processor, quad-core 2.0/3.0GHz, 32EU, 10W, PUC Intel Pentium N6415 Processor, quad-core 1.2/3.0GHz, 16EU, 6.5W, PUC Intel Celeron J6413 Processor, quad-core 1.8/3.0GHz, 16EU, 10W, PUC Intel Celeron N6211 Processor, quad-core 1.2/3.0GHz, 16EU, 6.5W, PUC Intel® Technologies: Enhanced Intel® SpeedStep® Technology Intel® Virtualization Technology (VTx-2, VT-d) Intel® Trusted Execution Engine (TXE) Intel® Time Coordinated Computing (TCC) Precision Time Measurement (PTM) Precision Time Measurement (PTP) IUC - Intel Industrial Use Conditions EUC - Intel Embedded Use Conditions PUC - Intel PC Client Use Conditions |
| Chipset | Integrated in SOC |
| RAM | Up to 16GB LPDDR4x SDRAM, up to 4267MT/s, IBECC (only Atom SKU´s), soldered |
| Flash | Up to 256GB eMMC 5.1 Flash (optional) |
| Storage Interfaces | 2x SATA-III 6Gbps 1x SD 3.01/SDIO 3.0 |
| USB | 2x USB 3.1, 6x USB 2.0, 1x Dual Role Port (Host/Device)* or 1x USB 3.1, 8x USB 2.0, 1x Dual Role Port (Host/Device)* *One USB 3.1 port according to Qseven Rev. 2.1 (only SS signals) |
| Serial Interfaces | 1x UART (no handshake) |
| Bus Interfaces | Up to 4x PCI-Express x1 Gen. 3 lanes 1x LPC Bus 1x I2C Bus 1x SPI Bus 1x SMBus 1x CAN-FD (Flexible Data-Rate) |
| Display Controller | Integrated Intel UHD Graphics (Gen11) Up to 32 execution units (EU) 3D Acceleration: DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan 1.0 Video Decode: MPEG-2, H.265/HEVC (L5.1), H.264, (L5.2), VC-1, WMV9, VP8, VP9, MVC, JPEG/MJPEG |
| Display Interfaces | Three independent displays supported 1x DP++ 2x eDP 1.3 (1x DP)/ MIPI-DSI 1.2 / 1x dual channel LVDS Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or Embedded DisplayPort 1.3 up to 4096 x 2160 @ 60Hz and MIPI-DSI x4 Interface up to 2560 x 1600 @ 60Hz (optional) |
| Network Interface | 10/100/1000Base-T 1x SGMII Interface on SATA-Port1 (optional) |
| Audio Interface | High Definition Audio |
| Security Device | Infineon Trusted Platform Module 2.0 (optional) |
| Miscellaneous | Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan |
| Feature Highlights | Qseven Rev.2.1 compliant |
| Firmware | AMI Aptio UEFI |
| OS Support | Windows 10 IoT Enterprise RS5 (64bit) Windows 10 IoT Core RS5 (64bit) Linux (Yocto Project) |
| Power Requirement | +5V +/-5% +5V Standby |
| Environment | Temperature Range: 0° … 60°C (operating) -25° … 85°C (storage) -40° … 85°C (operating industrial) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing) |
| Dimensions | 70 x 70 mm |
| Certificates | UL / CE |
| Cooling | Heatspreader Heatsink |
| Carrier | MSC Q7-MB-EP5 MSC Q7-MB-EP6 |
Order Info
| Order No. | Description | Reference | Status |
| 76106 | Qseven 2.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, TCC, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C | MSC Q7-EL-x6425RE-46N0211I PCBFTX | PV |
| 76102 | Qseven 2.1 module with Intel Atom x6414RE, Quad-Core (1.5GHz), 9W, 4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 32GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C | MSC Q7-EL-x6414RE-25N0211I PCBFTX | PV |
| 76098 | Qseven 2.1 module with Intel Atom x6212RE, Dual-Core (1.2GHz), 6W, 4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C | MSC Q7-EL-x6212RE-24N0211I PCBFTX | PV |
| 76104 | Qseven 2.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C | MSC Q7-EL-x6425E-46N0211E PCBFTX | PV |
| 76100 | Qseven 2.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz), 9W, 8GB LPDDR4x (3733 MT/s), IBECC, 16EU, 32GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C | MSC Q7-EL-x6413E-35N0211E PCBFTX | PV |
| 76096 | Qseven 2.1 module with Intel Atom x6211E, Dual-Core (1.3GHz/3.0GHz), 6W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C | MSC Q7-EL-x6211E-24N0211E PCBFTX | PV |
| 98119 | Qseven 2.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, no eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40...+85°C | MSC Q7-EL-x6425E-4NN0111I PCBFTX | OR |
| 93069 | Qseven 2.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 8GB LPDDR4x (3733 MT/s), IBECC, 32EU, no eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25°C...+85°C | MSC Q7-EL-x6425E-3NN0211E PCBFTX | OR |
| 95692 | Qseven 2.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, TCC, no eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40...+85°C | MSC Q7-EL-x6425RE-4NN0111I PCBFTX | OR |
| 76094 | Qseven 2.1 module with Intel Pentium J6426, Quad-Core (2.0GHz/3.0GHz), 10W, 16GB LPDDR4x (3200 MT/s), 32EU, 64GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature 0...+60°C | MSC Q7-EL-J6426-46N0211C PCBFTX | OR |
| 76108 | Qseven 2.1 module with Intel Celeron J6413, Quad-Core (1.8GHz/3.0GHz), 10W, 8GB LPDDR4x (3733 MT/s), 16EU, 16GB eMMC, 1x GbE LAN, 2x USB 3.1, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature 0...+60°C | MSC Q7-EL-J6413-34N0211C PCBFTX | OR |
Accessories
Carrier Options
| Order No. | Description | Reference |
| 67690 | Qseven Rev. 2.0 compatible embedded platform (148 x 102mm), 10-28Vinput voltage, 1x RS232 on DB9 connector, 1x RS485 on pin header, 1xRS232 no handshake on pin header, dual RJ45 LAN connector with LED, 1xSATA, 1x mSATA slot, SD card holder, 1x USB 3.0 connector, 2x USB 2.0connector, 1x USB 2.0 on pin row, 1x microUSB 2.0 OTG, CAN, I2C, LPC/GPIO on pin header, I2C/SMBus, SPI, DisplayPort connector, LVDS/eDPon JILI30 connector, regulated backlight supply, mini PCI Express slot, HDAudio, CMOS battery. Commercial temperature range 0..+70°C | MSC Q7-MB-EP6-601 PCBFTX |
Cooling Options
| Order No. | Description | Reference |
| 82416 | Passive Heatsink for Q7-EL (only variants with Atom) with through-holedistance bolts, consisting of a single-piece aluminium profile with fins andthermo pad for the thermal contact to the CPU, M3 mounting holes for anoptional fan | MSC Q7-EL-01 HSI-001 |
| 84847 | Heatspreader for Q7-EL (only variants with Atom) with throughhole distance bolts, only offers a 70x65mm aluminium plane to mount aheatsink or thermally connect to a cooler | MSC Q7-EL-01 HSP-001 |
| 84848 | Passive Heatsink for Q7-EL (only variants with Pentium/Celeron) withthrough-hole distance bolts, consisting of a single-piece aluminium profilewith fins and thermo pad for the thermal contact to the CPU, M3 mountingholes for an optional fan | MSC Q7-EL-02 HSI-001 |
| 84849 | Heatspreader for Q7-EL (only variants with Pentium/Celeron) withthrough-hole distance bolts, only offers a 70x65mm aluminium plane tomount a heatsink or thermally connect to a cooler | MSC Q7-EL-02 HSP-001 |
| 97724 | Heatspreader for Q7-EL (only variants with Atom) with through-hole distancebolts and 4 through-holes in the heatrail part, all holes for countersunkscrews, only offers a 70x65mm aluminium plane to mount a heatsink orthermally connect to a cooler | MSC Q7-EL-03-HSP-001 |
| 1053769 | Heat rail for Q7 baseboards. Recommended for conductive heat transfer fromthe Q7 module to the Q7 baseboard. Already assembled on all MSCbaseboards. | MSC Q7-XXX-01 HTR-001 |
Support
Manual
MSC_Q7-EL_User-Manual
Last update: June 10, 2025
Application Notes
App_Note_055_Qt6_On_Mscldk_With_Qt5
Last update: September 16, 2025
App_Note_018_Q7-MB-EPx_selection_guide
Last update: June 10, 2025
App_Note_016_Comparison_of_Thermal_characteristics_of_Q7_assemblies_in_housings
Last update: June 10, 2025
App_Note_015_MXM-II_Qseven_Connectors_Overview
Last update: June 10, 2025
App_Note_012_QSeven_Baseboard_Design_Recommendations
Last update: June 10, 2025
App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf
Last update: September 16, 2025
App_Note_032_Secure_Boot
Last update: June 10, 2025
App_Note_030_Addendum_Building_from_MSC_Git_2025-09-26
Last update: September 26, 2025
App_Note_030_Building_from_MSC_Git_V3_0
Last update: June 10, 2025
App_Note_028_MSC_AutoFLASH
Last update: June 10, 2025
App_Note_022_MSC_BIOS_Configurator_Tool
Last update: June 10, 2025
App_Note_021_Install_Win7_on_Recent_Intel_Architectures
Last update: June 10, 2025
App_Note_019_Activate_screen_after_WoL_from_sleep
Last update: June 10, 2025
App_Note_017_OS_Boot_support_for_different_media
Last update: June 10, 2025
App_Note_002_EDID_File_generation
Last update: June 10, 2025
Compliance documents
REACH-ROHS_TRIA_Qseven_2024-12-16
Last update: June 10, 2025
CHINA-ROHS_TRIA_Qseven_2024-12-16
Last update: June 10, 2025
Mechanical data
App_Note_052_Mechanical_documentation_guide1v0
Last update: September 16, 2025
MSC Q7-EL-03 HSP-001 3D
Last update: June 10, 2025
MSC Q7-EL-02 HSP-001 3D
Last update: June 10, 2025
MSC Q7-EL-02 HSI-001 3D
Last update: June 10, 2025
MSC Q7-EL-01 HSP-001 3D
Last update: June 10, 2025
MSC Q7-EL-01 HSI-001 3D
Last update: June 10, 2025
MSC_Q7-EL_3D
Last update: June 10, 2025
BIOS
TRIA_PI_HSUART-WIN_DRIVER
Last update: September 11, 2025
BIOS_Update_Q7-EL_V210_01
Last update: June 10, 2025
BIOS_Update_Q7-EL_V211_01
Last update: September 9, 2025
MSC_BIOS-Configurator-Tool
Last update: June 10, 2025
Drivers
Intel_Serial_IO_5.123.1.1025_MR7
Last update: June 10, 2025
Intel_PSE_Win_Driver_MR7
Last update: June 10, 2025
Intel_Graphics_Driver_MR7
Last update: June 10, 2025
Intel_CSME_SW_2306.4.10.0_Consumer_MR7
Last update: June 10, 2025
Intel_Chipset_Device_Software_Production_MR7
Last update: June 10, 2025
IntelGbE_231020_MR7
Last update: June 10, 2025
Demo images
msc-image-base-intel-corei7-64_Scarthgap_02042025
Last update: June 10, 2025
msc-image-lxqt-intel-corei7-64_Scarthgap_02042025
Last update: June 10, 2025
PCN – EOL – Product Information
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