Stutensee, Germany – February 24, 2022 – Tria Technologies supports an optimized development of future high-performance computing applications and introduces the powerful TRIA HSD-ILDL module family. These Computer-on-Modules (COMs) are based on the new PICMG® COM-HPC® standard and provide server performance on an embedded form factor. The scalable TRIA HSD-ILDL module family integrates the Intel® Xeon® D-1700 processor (code-named “Ice Lake D”).

The TRIA HSD-ILDL COM-HPC® Server module family features extremely high compute performance at high data throughput and is designed especially for applications that require many PCIe lanes and Ethernet interfaces as well as space for large memory arrays and cooling solutions. Typical applications include demanding Industrial Internet of Things (IIoT) systems, AI/deep learning solutions, edge computing and workload consolidation applications.

In addition to the high-performance TRIA HSD-ILDL server module family, Tria delivers a comprehensive ecosystem including the COM-HPC® Server carrier board TRIA HS-MB-EV, which enables early access to new COM-HPC® technology, rapid prototyping, and fast application development.

As one of the leading manufacturers of innovative embedded products, Tria offers comprehensive design services such as design reviews, carrier design support, for example reference schematics for the carrier, design-in support, simulations, and thermal modeling. Tria develops all module families in its own design centers and manufactures the modules in-house in highly automated production facilities.

The COM-HPC® standard provides scalable performance and migration towards further technology enhancements. Tria’s long-term availability of TRIA HSD-ILDL modules ensures that system investments made by customers are safeguarded.

Technical specifications

Tria’s high-performance TRIA HSD-ILDL COM-HPC® Server module family integrates the Intel® Xeon® D-1700 processor (codenamed „Ice Lake D“). As a fully integrated System-on-Chip (SoC), the Intel® Xeon® D-1700 processor combines up to ten Xeon cores, memory controller, high bandwidth network interfaces, and multiple PCIe root complexes on a single socket.

The on-chip network controller supports up to eight Ethernet ports with different configuration options ranging from 100M up to 25G per port and an aggregated throughput of up to 100G. An additional 1Gb/2.5Gb Ethernet port based on Intel® i225 supports TSN for real-time applications. An extensive set of PCI Express™ lanes with Gen 4 and Gen 3 support allow for connecting external hardware accelerators, FPGAs, NVMe storage, and IO devices.

Memory capacity of the TRIA HSD-ILDL server modules ranges from 8GB to 256GB based on registered DIMMs (RDIMM) or unbuffered DIMMs (UDIMM). Machine robustness can be extended by enabling error correction code (ECC) and utilizing RDIMM or ECC UDIMM.

Selected variants of the TRIA HSD-ILDL COM-HPC® Server module family can be operated at extended temperature range from -40 °C to +85 °C with true 24/7 utilization. The boards are suitable for applications in harsh environmental conditions. The server modules have dimensions of 160 x 160 mm. The module height is determined by the cooling solutions, which depend on the thermal requirements.

For more information, please visit the TRIA HSD-ILDL product page.

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