Stutensee, Germany – June 2022 – Tria Technologies, formerly Avnet Embedded, presents the powerful TRIA C6C-ALP COM Express™ Type 6 module family integrating the 12th Gen Intel® Core™ P-series and U-series processors into the small COM Express™ Compact form factor (95 x 95 mm). The scalable TRIA C6C-ALP product family offers a wide selection of CPU variants with scalable computing performance and energy efficiency.

The modular TRIA C6C-ALP COM Express™ module family is specified for the commercial ambient temperature range from 0 to 60°C and is ideal for different industrial applications that require outstanding performance in a small form factor. Typical examples are applications in medical equipment, process control, HMI terminals, transportation and intelligent kiosk equipment.

For the rapid development of innovative embedded products, Tria Technologies offers an entire ecosystem of suitable starter kit, board support package and design-in support for its TRIA C6C-ALP module family. The long-term availability of its boards protects customers’ system investments. In addition, the COM Express™ standard enables performance scaling and migration to future technology upgrades.

With the TRIA C6C-ALP module family, Tria Technologies expands its broad COM Express™ product portfolio at the higher end of the performance range. In January 2022, the company introduced the TRIA C6B-ALP COM Express™ module family based on 12th Gen Intel® Core™ processor technology in the COM Express™ Basic form factor (125 x 95 mm).

Technical specifications

The powerful TRIA C6C-ALP COM Express™ Type 6 module family is equipped with 12th Gen Intel® Core™ P-series and U-series processors, codenamed “Alder Lake P-series and U-series”. The Intel® performance hybrid architecture features Performance-cores and Efficient-cores, with Intel® Thread Director providing intelligent workload optimization. The architecture scales up to twelve cores and sixteen threads at 28W thermal design power (TDP).

For applications that require lower power dissipation, selected processor variants can be operated down to 12W TDP. The integrated Intel® Iris® Xe Architecture Graphics with up to 96 execution units (EUs) ensures high graphics performance.

For high data throughput, the module enables fast LPDDR5-5200 memory technology. Carried out as memory-down, the TRIA C6C-ALP COM Express™ modules can be assembled with up to 32GB main memory.

The TRIA C6C-ALP modules can be connected to the COM Express™ carrier board via up to eight PCIe Gen 3 lanes and four PCIe Gen 4 lanes. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel® i226 network controller. Additionally, four USB 3.2 Gen 1/2 and eight USB 2.0 ports, and two UARTs are available. The boards can drive up to four independent displays and feature three DisplayPort/HDMI interfaces, one LVDS and Embedded DisplayPort interface, and optional VGA.

Mass storage devices can be connected via two SATA 6Gb/s channels. Optionally, the computer-on-modules are equipped with up to 1TB NVMe SSD.

Tria Technologies develops all module families in its own design centers and manufactures the boards in highly automated production facilities.

For more information, please visit the TRIA C6C-ALP product page.

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