TRIA C6C-PLH - Tria
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TRIA C6C-PLH

COM Express
Intel
Yocto
Windows
PICMG

  • COM Express Type 6, Compact formfactor
  • Intel® Core™ Ultra Series 3 processors
  • Up to sixteen cores
  • Industrial grading options (Intel® TCC, TSN, IBECC, ind. Temp., 24/7)
  • Integrated AI accelarator (NPU)
  • Up to 96GB LPDDR5x SDRAM, IBECC
  • Intel® Iris® Xe graphics, up to 12 Xe cores
  • Three DisplayPort/HDMI interfaces
  • LVDS and Embedded DisplayPort interface
  • Four independent display streams
  • Up to eighteen PCI Express® Gen 4 lanes and up to to two PCI Express® Gen 3 lanes
  • Up to two USB4, up to four USB 3 and eight USB 2.0 ports
  • Two UARTs
  • Up to two SATA 6Gb/s mass storage interfaces
  • 1 Gb / 2.5 Gb Ethernet port (Intel® i226)
  • Trusted Platform Module TPM 2.0
  • Long-term product availability

The TRIA C6C-PLH COM Express module features the Intel® Core™ Ultra Series 3 processors, providing developers with a powerful workhorse to boost their target applications. The module is ideal for challenging tasks in robotics, industrial automation, transportation, medical equipment, process control and HMI terminals that require uncompromised performance. The architecture scales up to sixteen cores at 15 to 65W thermal design power (TDP). Together with the integrated AI accelerator (NPU) and up to 12 Xe GPU Cores, the processor greatly boosts AI projects and compute intense duties. The board is ideal for mission critical applications supporting industrial temperature range, 24/7 continuous operation, memory down with in-band ECC protection and optional conformal coating.

For highest data throughput the module enables fastest energy efficient LPDDR5x memory technology with up to 96GB capacity. Up to eighteen PCIe Gen 4 lanes and up to two PCIe Gen 3 lanes allow for accessing external accelerators, storage, and I/O at high bandwidth. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller.

System investments are well protected through long-term availability of the module, designed, and manufactured by Tria Technologies. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Specifications

Technologyx86
Form FactorCOM Express Compact
CPUIntel® Core™ Ultra Series 3 processors:
Intel® Core™ Ultra X9 processor 388H 16 Cores, 2.1 GHZ, 12Xe, vPRO®, 25W BP, 12 PCIe
Intel® Core™ Ultra X9 processor 378H 16 Cores, 2.1 GHZ, 12Xe, 25W BP, 12 PCIe
Intel® Core™ Ultra 9 processor 386H 16 Cores, 2.1 GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe
Intel® Core™ Ultra X7 processor 368H 16 Cores, 2.0 GHZ, 12Xe, vPRO®, 25W BP, 12 PCIe
Intel® Core™ Ultra 7 processor 366H 16 Cores, 2.0 GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe
Intel® Core™ Ultra 7 processor 365 8 Cores, 2.4 GHZ, 4Xe, vPRO®, 25W BP, 12 PCIe
Intel® Core™ Ultra X7 processor 358H 16 Cores, 1.9 GHZ, 12Xe, 25W BP, 12 PCIe
Intel® Core™ Ultra 7 processor 356H 16 Cores, 1.9 GHZ, 4Xe, 25W BP, 20 PCIe
Intel® Core™ Ultra 7 processor 355 8 Cores, 2.3 GHZ, 4Xe, 25W BP, 12 PCIe
Intel® Core™ Ultra 5 processor 338H 12 Cores, 1.9 GHZ, 10Xe, vPRO®, 25W BP, 12 PCIe
Intel® Core™ Ultra 5 processor 336H 12 Cores, 1.9 GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe
Intel® Core™ Ultra 5 processor 335 8 Cores, 2.2 GHZ, 4Xe, vPRO®, 25W BP, 12 PCIe
Intel® Core™ Ultra 5 processor 325 8 Cores, 2.1 GHZ, 4Xe, 25W BP, 12 PCIe
Intel® Core™ Ultra 5 processor 332 6 Cores, 2.5 GHZ, 2Xe, vPRO®, 25W BP, 12 PCIe
Intel® Core™ Ultra 5 processor 322 6 Cores, 2.5 GHZ, 2Xe, 25W BP, 12 PCIe
Intel® Core™ Ultra X7 processor 358HR 16 Cores, x.x GHZ, 12Xe, vPRO®, 25W BP, 12 PCIe
Intel® Core™ Ultra 7 processor 366HRE 16 Cores, x.x GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe, ind. T.
Intel® Core™ Ultra 7 processor 365RE 8 Cores, x.x GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe, ind. T.
Intel® Core™ Ultra 5 processor 336HRE 12 Cores, x.x GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe, ind. T.
Intel® Core™ Ultra 5 processor 335RE 8 Cores, x.x GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe, ind. T.
Note: P core base frequency at processor base power (25W BP) shown, other clock frequencies at
different power levels supported
ChipsetIntegrated into SoC
RAMLPDDR5 memory, up to 9600 MT/s memory-down
Capacity options: 16GB, 32GB, 64GB, 96GB
Inband ECC (IBECC) option (OS dependent)
Storage Interfaces2x SATA channels (up to 6Gb/s), optional
USBUp to 2x USB4 Gen 2, shared with COMe DDI1, DDI2
Up to 4x USB 3
8x USB 2.0
Note: capabilities depending on carrier design
Serial Interfaces2x high-speed serial ports
Bus InterfacesPCI Express® Gen 4, 1x8 or 2x4 lanes on COMe PCIe[20:27], optional1
PCI Express® Gen 4, 1x4 on COMe PCIe[16:19]
PCI Express® Gen 4, 6 lanes, flexible bifurcation options on COMe PCIe[0:5]
PCI Express® Gen 3, 2 lanes, COMe PCIe[6:7], optional
1 Available on select processor variants
Display ControllerIntel® Iris® Xe graphics, up to 12 Xe cores
H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode
Display InterfacesFour independent display streams
2x USB4/USB-C ports (DP Tunneling, DP Alt Mode) on DDI 1, 2
3x Digital Display Interface (DP 2.1, HDMI 2.1) on DDI 1, 2, 3
1x Embedded DisplayPort 1.5 (mutually exclusive with LVDS)
1x LVDS 24bit, dual-channel (mutually exclusive with eDP)
Network Interface10/100/1000Base-TX, 2.5G2 based on Intel i226, TSN support
2 Available bandwidths depending on carrier design
I-Temp variants: Intel® i226-IT
C-Temp variants: Intel® i226-LM
Audio InterfaceHigh Definition Audio
Security DeviceTPM 2.0
MiscellaneousWatchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported
RTC battery:
external
System Monitoring:
voltage, temperature, CPU fan, system fan
Feature HighlightsCOM Express Type 6 pin-out
FirmwareUEFI Firmware:
AMI Aptio® V
Security:
TPM 2.0 support, TCG compliant
Power Management:
ACPI
Active fan control
USB:
USB legacy support (keyboard, mouse, storage)
Monitoring:
System Monitoring
Health Monitoring
Tria Adv. Boot Device Selection:
Boot device priority setting based on physical interfaces
OS SupportWindows 11 IoT Enterprise LTSC 2024
BSP for Linux (Yocto)
Power RequirementVoltage:
+8.5V to +20V, +5V Stby optional
Power Consumption:
tbd W to tbd W (typ., variant dependent)
EnvironmentAmbient Temperature:
0° ... 60°C (operating)
-25° ... 85°C (storage)
Industrial temperature variants: -40 ... +85°C (operating)
Humidity:
5 ... 95% (operating, non-condensing),
5 ... 95% (storage, non-condensing)
Dimensions95mm x 95mm
CertificatesUL / CE

Accessories

Carrier Options

Order No.DescriptionReference
111650COM Express Type 6 Evaluation Carrier Board with various PCI Express
x1, x4 and x16 slots, USB 3.0/2.0, GbE, M.2, SD card socket, SATA,
DisplayPort, LVDS, eDP, VGA, HD audio interfaces; ATX power connector.
Dimensions 305 x 244 mm (ATX form factor)
MSC C6-MB-EV4 PCBFTX
119830COM Express Type 6 Evaluation Carrier Board with PCI Express x4 and
x16 slots, USB 3.0/2.0, USB4 Type-C, GbE, M.2, SATA, DisplayPort, LVDS,
eDP; ATX power connector. Dimensions 170 x 170 mm (Mini-ITX form
factor)
MSC C6-MB-EV4M BRDFTX

Cooling Options

Order No.DescriptionReference
tbdPassive Heatsink for C6C-PLH consisting of a single-piece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to major devices.MSC C6C-PLH-01 HSI-001
tbdPassive Heatsink / heat pipe for C6C-PLH consisting of a single-piece aluminum profile with fins and embedded heatpipe, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to major devices.MSC C6C-PLH-01 HSI-HPI-001
tbdHeatspreader for C6C-PLH. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to major devices.MSC C6C-PLH-01 HSP-001
tbdHeatspreader / heat pipe for C6C-PLH. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to major devices.MSC C6C-PLH-01 HP-001
tbdHeatspreader for C6C-PLH. Single-piece aluminum profile, standoffs with M2.5 thread, screws and thermopads for the thermal contact to major devices.MSC C6C-PLH-02 HSP-001
COM Express Carrier Board COM Express Starter kit COM Express Intel COM Express Qualcomm COM Express AMD
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