Power Efficient / Low Power
Optimize power-efficiency with Tria
Tria supports OEMs to deliver advanced compute and display technologies that optimize energy use, reduce total cost of ownership, and maintain performance and reliability at the edge.
Backed by decades of embedded expertise, a global partner network, and European production capabilities, Tria provides the scale and support OEMS need bring ultra-efficient embedded solutions to market quickly.
Tria supports OEMs with power-efficient:
- Embedded compute modules
- Embedded systems
- HMIs (human machine interfaces)
- Software, OS and BIOS support
Explore our range of CPU modules
Tria’s CPU modules are ideal for developing power-efficient applications. Compact, scalable, and ultra-low power, they also enable enhanced connectivity and are fully machine-processible during soldering, assembly, and testing.
MSC OSM-MF-IMX8MINI/Nano (NXP® Arm® Cortex® -A53)
- Single, Dual or Quad core ARM Cortex-A53
- Applications Processor up to 1.8GHz
- ARM Cortex-M4 Real Time Processor up to 400MHz
- Vivante GC NanoUltra 2D/3D Graphics Processor
MSC OSM-SF-IMX93 (NXP® Arm® Cortex® -A55)
- Single or Dual core Arm Cortex-A55 Applications Processors up to 1.7GHz
- Arm Cortex-M33 Real Time Processor at 250MHz
- Arm Ethos™-U65 microNPU with 256 MACs/Cycle
- Pixel processing pipeline (PXP) engine
Explore our standard module ranges
Our partners for power-efficient technologies
We work closely with the world’s leading processor, component, software and specialist technology partners to deliver the best possible solutions for OEMs developing power-efficient solutions, including:
Designed and manufactured in Europe, available worldwide.
Empower your product with Tria
We can support you with:
- Integrating ultra-low-power CPUs (e.g. i.MX8 ULP, i.MX RT1170)
- Configuring multiple power domains and ultra-low-power modes for energy savings
- Engineering fast wake-up performance for on-demand responsiveness
- Minimizing standby power consumption (as low as 1mW)
- Delivering ultra-low-power displays (eINK, MIP, Mini LED with low-power backlight)
- Enabling low-power wireless connectivity (LoRa, Bluetooth Low Energy)
- Providing battery support options for extended device runtime
- Designing for passive cooling in high-temperature environments
- Extending MTBF to maximize product lifespan
- Reducing carbon footprint through optimized system design