Open Standard Modules Webinar with NXP | Tria

LIVE WEBINAR

Simplifying Embedded Design with Open Standard Modules (OSM)

Learn how Open Standard Modules can simplify embedded development, reduce design risk and support faster time to market.

NXP Semiconductors logo
Tria Technologies logo
WEBINAR DETAILS

September 17, 2026
4:00–5:00 PM CEST
Online webinar · English

ABOUT THE WEBINAR

A practical approach to embedded system design

Embedded system developers are working with shorter timelines, limited budgets and increasing pressure to reduce design risk while supporting long product lifecycles.

In this webinar, NXP and Tria will explain how Open Standard Modules (OSM) integrate the processor, DRAM and Flash memory into a compact, solderable module. The session will cover how this approach can simplify development, shorten time to market and reduce project cost and risk.

WEBINAR TOPICS

What you’ll learn

Understand the OSM approach

Learn about the key benefits of Open Standard Modules for embedded system development.

Reduce complexity and risk

See how OSM can simplify development and reduce cost and project risk compared with chip-down designs.

Accelerate time to market

Explore how standardized, production-proven modules can shorten development cycles.

Plan for scale and longevity

Learn how Tria’s OSM portfolio supports scalability, reliability and long-term availability.

PRESENTED BY

Meet the speakers

NXP SEMICONDUCTORS

Kyle Fox, Senior Director of i.MX Processors at NXP

Kyle Fox

Senior Director, i.MX Processors

TRIA TECHNOLOGIES

Harald Maier, Product Marketing Manager at Tria Technologies

Harald Maier

Product Marketing Manager

LIVE WEBINAR

Ready to simplify your embedded design?

Join NXP and Tria on September 17 to learn how Open Standard Modules can reduce development complexity, risk and time to market.

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