TRIA HCA-RLP
The TRIA HCA-RLP COM-HPC Client module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance, the module is ideal for compute intense applications in automation, instrumentation, high-end medical equipment, transportation, and video surveillance. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). The board is ideal for applications requiring support for extended temperature range and 24/7 continuous operation.
For highest data throughput the module enables fast DDR5-5200 memory technology with up to sixty-four GB SO-DIMM based memory. Module I/O comprises up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 4. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i226 network controller. Further high-speed I/O can utilize USB ports featuring USB4 and USB 3.2.
System investments are well protected through long-term availability of the module, designed and manufactured by Tria Technologies. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Highlights
- COM-HPC Client module, Size A
- 13th Gen Intel® Core™ processors
- Scalable CPU performance
- Up to fourteen cores, twenty threads
- Industrial grading options (Intel® TCC, TSN, IBECC, ext. Temp., 24/7)
- Up to 64GB DDR5-5200 SDRAM, dual channel
- Intel® Iris® Xe architecture Graphics, up to 96 EUs
- Three DisplayPort/HDMI interfaces
- Embedded DisplayPort interface
- Up to four independent displays
- PCI Express® Gen 3, up to 8 lanes, PCI Express® Gen 4, up to 2×4
- PEG 1×8, PCIe Gen 4/5 (optional)
- Two USB4, two USB 3.2 Gen2, eight USB 2.0 ports
- Two UARTs
- Optional on-board NVMe SSD, up to 256GB
- Optional two SATA 6Gb/s mass storage interfaces
- Two 1 / 2.5 Gb Ethernet ports (Intel® i226)
- Trusted Platform Module TPM 2.0
- Long-term product availability
Specifications
| Technology | x86 |
| Form Factor | COM-HPC Size A |
| CPU | 13th Gen Intel® Core™ processors H-series Intel® Core™ i7-13800HE 6P+8E/20T, 2.5GHz, 96 EUs, 24MB L3, 45/35W cTDP Intel® Core™ i7-13800HRE 6P+8E/20T, 2.5GHz, 96 EUs, 24MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-13600HE 4P+8E/16T, 2.7GHz, 80 EUs, 18MB L3, 45/35W cTDP Intel® Core™ i5-13600HRE 4P+8E/16T, 2.7GHz, 80 EUs, 18MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i3-13300HE 4P+4E/12T, 2.1GHz, 48 EUs, 12MB L3, 45/35W cTDP Intel® Core™ i3-13300HRE 4P+4E/12T, 2.1GHz, 48 EUs, 12MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET P-series Intel® Core™ i7-1370PE 6P+8E/20T, 1.9GHz, 96 EUs, 24MB L3, 28/20W cTDP Intel® Core™ i7-1370PRE 6P+8E/20T, 1.9GHz, 96 EUs, 24MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1350PE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i5-1350PRE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1340PE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i3-1320PE 4P+4E/12T, 1.7GHz, 48 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i3-1320PRE 4P+4E/12T, 1.7GHz, 48 EUs, 12MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET U-series Intel® Core™ i7-1365UE 2P+8E/12T, 1.7GHz, 96 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i7-1365URE 2P+8E/12T, 1.7GHz, 96 EUs, 12MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1345UE 2P+8E/12T, 1.4GHz, 80 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i5-1345URE 2P+8E/12T, 1.4GHz, 80 EUs, 12MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1335UE 2P+8E/12T, 1.3GHz, 80 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i3-1315UE 2P+4E/8T, 1.2GHz, 64 EUs, 10MB L3, 15/12W cTDP Intel® Core™ i3-1315URE 2P+4E/8T, 1.2GHz, 64 EUs, 10MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Processor U300E 1P+4E/6T, 1.1GHz, 48 EUs, 8MB L3, 15/12W cTDP Note: P core base frequency at nominal TDP shown, other clock frequencies supported |
| Chipset | Integrated into SoC |
| RAM | 2x 262-pin SO-DIMM socket for up to 2x 32GB DDR5 SDRAM (DDR5-5200) dual channel operation minimum capacity 1x 8GB single channel operation |
| Storage Interfaces | 2x SATA channels (up to 6Gb/s), optional optional on-board NVMe, 128GB, 256GB |
| USB | 2x USB4 on COM-HPC USB[0:1]_SSTX/RX 2x USB 3.2 (Gen 1 & 2) on COM-HPC USB[2:3]_SSTX/RX 8x USB 2.0 on COM-HPC USB[0:7] |
| Serial Interfaces | 2x high-speed serial ports |
| Bus Interfaces | PCI Express® Graphics (PEG) 1x8, PCIe Gen 4/5 on COM-HPC PCIe[16:23]¹ PCI Express® Gen 4, up to 2x4 on COM-HPC PCIe[8:15] PCI Express® Gen 3, up to 8 lanes, flexible bifurcation options on COM-HPC PCIe[0:7] ¹ Available on H-series processors |
| Display Controller | Intel® Iris® Xe architecture Graphics, Up to 96 execution units (EU) H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode. |
| Display Interfaces | Four independent display streams 3x Digital Display Interface (DP 1.4a, HDMI 2.0b) 1x Embedded DisplayPort 1.4b |
| Network Interface | Two 10/100/1000Base-TX, 2.5G² based on Intel i226, TSN support ² Available bandwidths depending on carrier design I-Temp variants: Intel® i226-IT C-Temp variants: Intel® i226-LM |
| Audio Interface | High Definition Audio, optional Soundwire and I2S |
| Security Device | TPM 2.0 |
| Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
| Feature Highlights | COM-HPC Client, Size A |
| Firmware | UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces |
| OS Support | Windows 11 IoT Enterprise LTSC 2024 BSP for Linux (Yocto) |
| Power Requirement | Voltage: +8V to +20V, +5V Stby optional, +3V RTC voltage Power Consumption: 23 W to 62 W (typ., variant dependent) |
| Environment | Ambient Temperature: 0° … 60°C (operating) -25° … 85°C (storage) Extended temp. variants: -40 ... +85°C (operating) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
| Dimensions | 120 x 95 |
Order Info
| Order No. | Description | Reference | Status |
| 113950 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i7-13800HE 14C/20T, vPro, 2.1GHz, 45/35W cTDP Graphics: Intel® Iris® Xe 96 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-LM Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5 0...+60°C. | MSC HCA-RLP-13800HE-NN0131C PCBFTX | OR |
| 113946 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i5-13600HE 12C/16T, vPro, 2.1GHz, 45/35W cTDP Graphics: Intel® Iris® Xe 80 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-LM Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, 2x SATA, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 6x 2x socket for DDR5 0...+60°C. | MSC HCA-RLP-13600HE-NN0121C PCBFTX | PV |
| 113942 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i3-13300HE 8C/12T, 2.1GHz, 45/35W cTDP Graphics: Intel® UHD Graphics 48 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-LM Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, 2x SATA, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 6x 2x socket for DDR5 0...+60°C. | MSC HCA-RLP-13300HE-NN0121C PCBFTX | PV |
| 113938 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i5-1350PE 12C/16T, vPro, 1.8GHz, 28/20W cTDP Graphics: Intel® Iris® Xe 80 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-LM Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5 0...+60°C. | MSC HCA-RLP-1350PE-NN0131C PCBFTX | OR |
| 113932 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i3-1320PE 8C/12T, 1.7GHz, 28/20W cTDP Graphics: Intel® UHD Graphics 48 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-LM Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5 0...+60°C. | MSC HCA-RLP-1320PE-NN0131C PCBFTX | OR |
| 113948 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i5-13600HRE 12C/16T, vPro, 1.9GHz, 45/35W cTDP Graphics: Intel® Iris® Xe 80 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-IT Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5, in-band ECC -40...+85°C, recommended for 24/7 operation. | MSC HCA-RLP-13600HRE-NN0131I PCBFTX | PV |
| 113944 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i3-13300HRE 8C/12T, 2.1GHz, 45/35W cTDP Graphics: Intel® UHD Graphics 48 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-IT Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PEG x8 Gen 4, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5, in-band ECC -40...+85°C, recommended for 24/7 operation. | MSC HCA-RLP-13300HRE-NN0131I PCBFTX | PV |
| 113940 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i5-1350PRE 12C/16T, vPro, 1.8GHz, 28/20W cTDP Graphics: Intel® Iris® Xe 80 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-IT Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5, in-band ECC -40...+85°C, recommended for 24/7 operation. | MSC HCA-RLP-1350PRE-NN0131I PCBFTX | OR |
| 113934 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i3-1320PRE 8C/12T, 1.7GHz, 28/20W cTDP Graphics: Intel® UHD Graphics 48 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-IT Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5, in-band ECC -40...+85°C, recommended for 24/7 operation. | MSC HCA-RLP-1320PRE-NN0131I PCBFTX | PV |
| 113936 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i5-1345URE 10C/12T, vPro, 1.4GHz, 15/12W cTDP Graphics: Intel® Iris® Xe 80 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-IT Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5, in-band ECC -40...+85°C, recommended for 24/7 operation. | MSC HCA-RLP-1345URE-NN0131I PCBFTX | OR |
| 113930 | COM-HPC Client Size A module (120mm x 95mm) CPU: Intel i3-1315URE 6C/8T, 2.5GHz, 15/12W cTDP Graphics: Intel® UHD Graphics 64 EUs 3x DP/HDMI 1x eDP HD Audio Ethernet: 2x Intel i226-IT Gbit, TSN TPM 2.0 2x USB4, 2x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 3 8x 2x socket for DDR5, in-band ECC -40...+85°C, recommended for 24/7 operation. | MSC HCA-RLP-1315URE-NN0131I PCBFTX | PV |
Accessories
Carrier Options
| Order No. | Description | Reference |
| 114609 | COM-HPC Client Carrier Board with 1x PEG x16, 1x PCIe x16, 3x PCIe x4 slots; 2x USB 4 Gen 2x2, 2x USB 3.2 Gen 2x1, 2x 1G/2.5G/10GBASE-T, 2x SATA; 3x DisplayPort, 1x eDP; audio module socket; 1x M.2 socket; 24pin ATX and ATX12V power connectors; Dimensions 305mm x 244mm (ATX form factor); | MSC HC-MB-EV BRDFTX |
Cooling Options
| Order No. | Description | Reference |
| 79809 | Fan kit for Heatsink TRIA HCA-ALP/RLP/MLH-0x HSI-xxx, TRIA C6B-ALP/RLP/MLH-0x HSI-xxx, TRIA C6B-TLH-0x HSI-xxx, TRIA C6C-ALP/RLP-0x HSI-xxx, TRIA C6C-TLU-0x HSI-xxx, TRIA C6C-WLU-0x HSI-xxx, TRIA C6C-ALN/ASL-0x HSI-xxx, TRIA C6C-EL-0x HSI-xxx, TRIA C6C-RYZx-0x HSI-xxx, PWM fan 80x80x15mm. | MSC C6C- FANKIT-01- HSF-001 |
| 94875 | Passive Heatsink for HCA-ALP/RLP consisting of a singlepiece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe. | MSC HCA-ALP-01 HSI-001 |
| 94876 | Passive Heatsink / heat pipe for HCA-ALP/RLP consisting of a single-piece aluminum profile with fins and embedded heatpipe, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe. | MSC HCA-ALP-01 HSI-HP-001 |
| 94877 | Heatspreader for HCA-ALP/RLP. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe. | MSC HCA-ALP-01 HSP-001 |
| 94878 | Heatspreader / heat pipe for HCA-ALP/RLP. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to CPU, chipset, NVMe. | MSC HCA-ALP-01 HSP-HP-001 |
| 112247 | Passive heatsink / heat pipe for HCA-ALP/RLP consisting of a single-piece aluminum profile with fins (rotated orientation) and embedded heatpipe, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe. | MSC HCA-ALP-02 HSI-HP-001 |
| 94879 | Heatspreader for HCA-ALP/RLP. Single-piece aluminum profile, standoffs with M2.5 thread, screws and thermopads for the thermal contact to CPU, chipset, NVMe. | MSC HCA-ALP-02 HSP-001 |
Memory Options
| Order No. | Description | Reference |
| 115233 | 8GB DDR5-5600 SO-DIMM, commercial temperature | MOD SODIMM DDR5 8GB PC5-44800 CL22 1B |
| 114624 | 8GB DDR5-5600 SO-DIMM, sorting wide temperature | MOD SODIMM DDR5 8GB PC5-44800 CL22 1B |
| 115234 | 16GB DDR5-5600 SO-DIMM, commercial temperature | MOD SODIMM DDR5 16GB PC5-44800 CL22 1B |
| 114625 | 16GB DDR5-5600 SO-DIMM, sorting wide temperature | MOD SODIMM DDR5 16GB PC5-44800 CL22 1B |
| 115235 | 32GB DDR5-5600 SO-DIMM, commercial temperature | MOD SODIMM DDR5 32GB PC5-44800 CL22 2B |
| 114626 | 32GB DDR5-5600 SO-DIMM, sorting wide temperature | MOD SODIMM DDR5 32GB PC5-44800 CL22 2B |
Support
Application Notes
App_Note_032_Secure_Boot
Last update: June 10, 2025
App_Note_030_Addendum_Building_from_MSC_Git_2025-07-24
Last update: August 11, 2025
App_Note_030_Building_from_MSC_Git_V3_0
Last update: June 10, 2025
App_Note_028_MSC_AutoFLASH
Last update: June 10, 2025
App_Note_022_MSC_BIOS_Configurator_Tool
Last update: June 10, 2025
App_Note_002_EDID_File_generation
Last update: June 10, 2025
Mechanical data
MSC_HCA-RLP_3D
Last update: June 10, 2025
MSC HCA-ALP-01 HSP-001
Last update: June 10, 2025
MSC HCA-ALP-01 HSI-001
Last update: June 10, 2025
BIOS
TRIA_PI_HSUART-WIN_DRIVER
Last update: September 11, 2025
BIOS_Update_HCA-ALP_V110_01
Last update: June 10, 2025
BIOS_Update_HCA-ALP_V100_01
Last update: June 10, 2025
Drivers
Intel_CSME_SW_2337.5.31.0_Corporate
Last update: June 10, 2025
ADSP-10.29.00.9467-HOTFIX
Last update: June 10, 2025
gna-03.00.00.1457-win-3_0_sv2_resign-20220819
Last update: June 10, 2025
ISH_Kit_5.4.2.4591
Last update: June 10, 2025
SerialIO_30.100.2237.26_v2_RPL_ADL-PCH_22H2
Last update: June 10, 2025
gfx_win_101.5593
Last update: June 10, 2025
SetupChipset_10.1.19444.8378
Last update: June 10, 2025
PCN – EOL – Product Information
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