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TRIA HCA-MLH

Intel Module

The TRIA HCA-MLH COM-HPC Client module features the Intel® Core™ Ultra processor Series 1 and 2, providing developers with a powerful and scalable platform for high-performance embedded and edge computing applications. The module is ideal for challenging tasks in robotics, medical, public safety, and gaming that require uncompromising performance. The architecture scales up to sixteen cores and twenty-two threads at 28/15W thermal design power (TDP). Together with the integrated AI accelerator (NPU) and up to 128 execution units (EUs), the processor greatly supports AI projects and compute intense duties.

For highest data throughput the module enables fast DDR5 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to ninety-six GB. Up to sixteen PCIe Gen 4 lanes and an eight lane PEG port (PCIe Gen 5) allow for accessing external accelerators, storage, and I/O at high throughput. Two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i226 network controller.

System investments are well protected through long-term availability of the module, designed, and manufactured by Tria Technologies. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Highlights

COM-HPC Client, Size A module
Intel® Core™ Ultra Processors Series 1 and 2
Up to sixteen cores, twenty-two threads
Integrated AI accelarator (NPU) Intel® AI Boost
Up to 96GB DDR5-6400 SDRAM, dual channel, IB-ECC
Intel® Arc™ Graphics, up to 8 Xe cores (128 EUs)
Three DisplayPort/HDMI interfaces
Embedded DisplayPort interface
Four independent display streams
Up to sixteen PCI Express® Gen 4 lanes
PEG 1×8, PCIe Gen 4/5 (optional)
Two USB4, two USB 3.2 Gen1/2 and eight USB 2.0 ports
Two UARTs
Optional on-board NVMe SSD, up to 256GB
Up to two SATA 6Gb/s mass storage interfaces
Two 1 / 2.5 Gb Ethernet ports (Intel® i226)
Trusted Platform Module TPM 2.0
Long-term product availability for selected variants

Specifications

Technology	x86
Form Factor	COM-HPC Size A
CPU	Intel® Core™ Ultra Processors Series 2: Intel® Core™ Ultra 9 processor 285H 6P+8E+2LPE/22T, 2.9GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 45W BP Intel® Core™ Ultra 7 processor 265H 6P+8E+2LPE/22T, 2.2GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 28W BP Intel® Core™ Ultra 7 processor 255H 6P+8E+2LPE/22T, 2.0GHZ, 8Xe/128EUs, 24MB L3, 28W BP Intel® Core™ Ultra 5 processor 235H 4P+8E+2LPE/18T, 2.4GHZ, 8Xe/128EUs, 18MB L3, vPRO®, 28W BP Intel® Core™ Ultra 5 processor 225H 4P+8E+2LPE/18T, 1.7GHZ, 7Xe/112EUs, 18MB L3, 28W BP Intel® Core™ Ultra 7 processor 265U 2P+8E+2LPE/14T, 2.1GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 7 processor 255U 2P+8E+2LPE/14T, 2.0GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra 5 processor 235U 2P+8E+2LPE/14T, 2.0GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 5 processor 225U 2P+8E+2LPE/14T, 1.5GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra Processors Series 1: Intel® Core™ Ultra 7 processor 165H 6P+8E+2LPE/22T, 1.4GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 28W BP Intel® Core™ Ultra 7 processor 155H 6P+8E+2LPE/22T, 1.4GHZ, 8Xe/128EUs, 24MB L3, 28W BP Intel® Core™ Ultra 5 processor 135H 4P+8E+2LPE/18T, 1.7GHZ, 8Xe/128EUs, 18MB L3, vPRO®, 28W BP Intel® Core™ Ultra 5 processor 125H 4P+8E+2LPE/18T, 1.2GHZ, 7Xe/112EUs, 18MB L3, 28W BP Intel® Core™ Ultra 7 processor 165U 2P+8E+2LPE/14T, 1.7GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 7 processor 155U 2P+8E+2LPE/14T, 1.7GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra 5 processor 135U 2P+8E+2LPE/14T, 1.6GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 5 processor 125U 2P+8E+2LPE/14T, 1.3GHZ, 4Xe/64EUs, 12MB L3, 15W BP Note: P core base frequency at processor base power (BP) shown, other clock frequencies at different power levels supported
Chipset	Integrated into SoC
RAM	2x 262-pin SO-DIMM socket for up to 2x 48GB DDR5 SDRAM DDR5-6400 Series 2 processors DDR5-5600 Series 1 processors dual channel operation minimum capacity 1x 8GB single channel operation inband ECC (IB-ECC) option (OS dependent)
Storage Interfaces	2x SATA channels (up to 6Gb/s), Optional on-board NVMe, 128GB, 256GB
USB	2x USB4 on COM-HPC USB[0:1]_SSTX/RX 2x USB 3.2 (Gen 1 & 2) on COM-HPC USB[2:3]_SSTX/RX 8x USB 2.0 on COM-HPC USB[0:7]
Serial Interfaces	2x high-speed serial ports
Bus Interfaces	PCI Express® Graphics (PEG) 1x8, PCIe Gen 4/5 on COM-HPC PCIe[16:23]¹ PCI Express® Gen 4, up to 2x4 on COM-HPC PCIe[8:15] PCI Express® Gen 4, up to 8 lanes, flexible bifurcation options on COM-HPC PCIe[0:7] ¹ Available on H-series processors
Display Controller	Intel® Arc™ Graphics, up to 8 Xe cores / 128 execution units (EU) H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode
Display Interfaces	Four independent display streams 2x USB4/USB-C ports (DP tunneling) 3x Digital Display Interface (DP 2.1, HDMI 2.1) 1x Embedded DisplayPort 1.4b
Network Interface	Two 10/100/1000Base-TX, 2.5G² based on Intel i226-LM ² Available bandwidths depending on carrier design
Audio Interface	High Definition Audio
Security Device	TPM 2.0
Miscellaneous	Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan
Feature Highlights	COM-HPC Client
Firmware	UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring Tria Adv. Boot Device Selection: Boot device priority setting based on physical interfaces
OS Support	Windows 11 IoT Enterprise LTSC BSP for Linux (Yocto)
Power Requirement	Voltage: +8V to +20V, +5V Stby optional, +3V RTC voltage Power Consumption: tbd W to tbd W (typ.)
Environment	Ambient Temperature: 0° … 60°C (operating) -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing)
Dimensions	120 x 95

Order Info

Order No.

Description

Reference

Status

121611	COM-HPC Client Size A module (120mm x 95mm) CPU: Intel Core Ultra 7 255H 16C/22T, 2.0GHz, 28W BP Graphics: Intel Arc 128 EUs 3x DP/HDMI 1x eDP Ethernet: 2x Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x USB4 2x SATA, 2x USB3, 8x USB2, PEG Gen 5 x8 PCIe Gen 4 3x4 + 1x1 2x socket for DDR5 0...+60°C.	MSC HCA-MLH-255H- NN0101C PCBFTX	OR
121613	COM-HPC Client Size A module (120mm x 95mm) CPU: Intel Core Ultra 5 225U 12C/14T, 1.5GHz, 15W BP Graphics: Intel 64 EUs 3x DP/HDMI 1x eDP Ethernet: 2x Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x USB4 2x SATA, 2x USB3, 8x USB2, PCIe Gen 4 3x4 + 1x1 2x socket for DDR5 0...+60°C.	MSC HCA-MLH-225U- NN0101C PCBFTX	OR
121599	COM-HPC Client Size A module (120mm x 95mm) CPU: Intel Core Ultra 7 165H 16C/22T, vPro 1.4GHz, 28W BP Graphics: Intel Arc 128 EUs 3x DP/HDMI 1x eDP Ethernet: 2x Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x USB4 2x SATA, 2x USB3, 8x USB2, PEG Gen 5 x8 PCIe Gen 4 3x4 + 1x1 2x socket for DDR5 0...+60°C.	MSC HCA-MLH-165H- NN0101C PCBFTX	PV
121601	COM-HPC Client Size A module (120mm x 95mm) CPU: Intel Core Ultra 7 155H 16C/22T, 1.4GHz, 28W BP Graphics: Intel Arc 128 EUs 3x DP/HDMI 1x eDP Ethernet: 2x Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x USB4 2x SATA, 2x USB3, 8x USB2, PEG Gen 5 x8 PCIe Gen 4 3x4 + 1x1 2x socket for DDR5 0...+60°C.	MSC HCA-MLH-155H- NN0101C PCBFTX	PV
121603	COM-HPC Client Size A module (120mm x 95mm) CPU: Intel Core Ultra 5 135H 14C/18T, vPro 1.7GHz, 28W BP Graphics: Intel Arc 128 EUs 3x DP/HDMI 1x eDP Ethernet: 2x Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x USB4 2x SATA, 2x USB3, 8x USB2, PEG Gen 5 x8 PCIe Gen 4 3x4 + 1x1 2x socket for DDR5 0...+60°C.	MSC HCA-MLH-135H- NN0101C PCBFTX	OR
121605	COM-HPC Client Size A module (120mm x 95mm) CPU: Intel Core Ultra 5 125H 14C/18T, 1.2GHz, 28W BP Graphics: Intel Arc 112 EUs 3x DP/HDMI 1x eDP Ethernet: 2x Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x USB4 2x SATA, 2x USB3, 8x USB2, PEG Gen 5 x8 PCIe Gen 4 3x4 + 1x1 2x socket for DDR5 0...+60°C.	MSC HCA-MLH-125H- NN0101C PCBFTX	PV
121607	COM-HPC Client Size A module (120mm x 95mm) CPU: Intel Core Ultra 7 155U 12C/14T, 1.7GHz, 15W BP Graphics: Intel 64 EUs 3x DP/HDMI 1x eDP Ethernet: 2x Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x USB4 2x SATA, 2x USB3, 8x USB2, PCIe Gen 4 3x4 + 1x1 2x socket for DDR5 0...+60°C.	MSC HCA-MLH-155U- NN0101C PCBFTX	PV
121609	COM-HPC Client Size A module (120mm x 95mm) CPU: Intel Core Ultra 5 125U 12C/14T, 1.3GHz, 15W BP Graphics: Intel 64 EUs 3x DP/HDMI 1x eDP Ethernet: 2x Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x USB4 2x SATA, 2x USB3, 8x USB2, PCIe Gen 4 3x4 + 1x1 2x socket for DDR5 0...+60°C.	MSC HCA-MLH-125U- NN0101C PCBFTX	PV

Accessories

Carrier Options

Order No.

Description

Reference

114609	COM-HPC Client Carrier Board with 1x PEG x16, 1x PCIe x16, 3x PCIe x4 slots; 2x USB 4 Gen 2x2, 2x USB 3.2 Gen 2x1, 2x 1G/2.5G/10GBASE-T, 2x SATA; 3x DisplayPort, 1x eDP; audio module socket; 1x M.2 socket; 24pin ATX and ATX12V power connectors; Dimensions 305mm x 244mm (ATX form factor);	MSC HC-MB-EV BRDFTX

114609

COM-HPC Client Carrier Board with 1x PEG x16, 1x PCIe x16, 3x PCIe x4 slots; 2x USB 4 Gen 2x2, 2x USB 3.2 Gen 2x1, 2x 1G/2.5G/10GBASE-T, 2x SATA; 3x DisplayPort, 1x eDP; audio module socket; 1x M.2 socket; 24pin ATX and ATX12V power connectors; Dimensions 305mm x 244mm (ATX form factor);

MSC HC-MB-EV BRDFTX

Cooling Options

Order No.

Description

Reference

114469	Passive Heatsink for HCA-MLH consisting of a singlepiece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.	MSC HCA-MLH-01 HSI-001
114471	Heatspreader for HCA-MLH. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.	MSC HCA-MLH-01 HSP-001
114482	Heatspreader / heat pipe for HCA-MLH. Singlepiece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to CPU, chipset, NVMe.	MSC HCA-MLH-01 HSP-HP-001
114470	Passive heatsink / heat pipe for HCA-MLH consisting of a single-piece aluminum profile with fins (rotated orientation) and embedded heatpipe, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.	MSC HCA-MLH-02 HSI- HP-001
114483	Heatspreader for HCA-MLH. Single-piece aluminum profile, standoffs with M2.5 thread, screws and thermopads for the thermal contact to CPU, chipset, NVMe.	MSC HCA-MLH-02 HSP-001
79809	Fan kit for Heatsink MSC HCA-ALP/RLP/MLH/PLH-0x HSI-xxx, MSC C6B-TLH/ALP/RLP/MLH-0x HSI- xxx, MSC C6C-WLU/TLU/ALP/RLP/PLH-0x HSI-xxx, MSC C6C-EL/ALN/ASL-0x HSI-xxx, MSC C6C- RYZx-0x HSI-xxx, PWM fan 80x80x15mm.	MSC C6C- FANKIT-01- HSF-001

Memory Options

Order No.

Description

Reference

115233	8GB DDR5-5600 SO-DIMM, commercial temperature	MOD SODIMM DDR5 8GB PC5-44800 CL22 1B
115234	16GB DDR5-5600 SO-DIMM, commercial temperature	MOD SODIMM DDR5 16GB PC5-44800 CL22 1B
115235	32GB DDR5-5600 SO-DIMM, commercial temperature	MOD SODIMM DDR5 32GB PC5-44800 CL22 2B

Support

As registered customer you can directly create a ticket in our Support Center (Ticket) and visit our Technical Documentation Center (TechDoC)

Manual

TRIA HCA-MLH HW User Manual

Last update: February 20, 2026

Compliance documents

CHINA-ROHS_TRIA_COM_HPC

Last update: January 14, 2026

REACH-ROHS_TRIA_COM_HPC

Last update: January 14, 2026

Mechanical data