TRIA SM2S-ALN
The TRIA SM2S-ALN module features the Intel Atom® processors x7000E Series, Intel® Core ™i3 processor and Intel® Processors N Series (codenamed “Alderlake N”). The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment.
The TRIA SM2S-ALN offers triple independent display support with a maximum of 4k resolution, fast LPDDR5 memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1.1 module.
Different SOCs with dual-, quad- and eight-core processors are supported by this design. In addition to an extensive set of interfaces and features, the TRIA SM2S-ALN offers 2 Gigabit Ethernet based on Intel® i226 and supports up to 2.5GbE bandwidth.
For evaluation and design-in of the TRIA SM2S-ALN module, Tria provides a suitable SMARC 2.1.1 development platform. A complete, ready-to-run Starterkit is also available.
Highlights
- Up to eight processing cores
- Power efficient processors, TDP 6 to 15W
- Integrated Intel UHD Gen.12 graphics, max. 32 executing units .
- Up to 16GB LPDDR5 SDRAM (IBECC for Atom SKU´s)
- Up to 256GB eMMC 5.1 Flash (optional)
- SATA-III interface (6Gbps)
- 2x DP++
- LVDS / Embedded DisplayPort and MIPI-DSI
- Triple Independent Display support
- 2x MIPI-CSI Camera Interface
- Up to 4x PCI Express x1/x2/x4 Gen. 3
- 2x USB 3.1 Host interfaces
- 6x USB 2.0 Host interfaces
- 2x Gigabit Ethernet (Intel® i226)
- 1x SGMII Interface on PCIE-D (opt. only Atom SKU´s)
- UART, SPI, I2C, SMBus
- HD/I2S Audio
- Trusted Platform Module
- SMARC 2.1.1 compliant
- UEFI Firmware
Specifications
Technology | x86 |
Form Factor | SMARC™ 2.1.1 Short Size |
CPU | Intel® Core™ i3-N355, eight-core, 1.0GHz/1.9GHz, 32EU, 9/15W, PUC Intel® Core™ i3-N305, eight-core, 1.0GHz/1.8GHz, 32EU, 9/15W, PUC Intel Atom® x7425E, four-core, 1.5GHz, 24EU, TCC, 12W, EUC Intel Atom® x7213E, two-core, 1.7GHz, 16EU, TCC, 10W, EUC Intel Atom® x7211E, two-core, 1.0GHz, 16EU, TCC, 6W, EUC Intel® Processor N250, quad-core, 1.3GHz, 32EU, 6W, PUC Intel® Processor N200, quad-core, 1.0GHz, 32EU, 6W, PUC Intel® Processor N150, quad-core, 0.8GHz, 24EU, 6W, PUC Intel® Processor N97, quad-core, 2.0GHz, 24EU, 12W, PUC Intel® Processor N50, dual-core, 1.0GHZ, 16EU, 6W, PUC EUC - Intel Embedded Use Conditions PUC - Intel PC Client Use Conditions |
Chipset | Integrated in SOC |
RAM | Up to 16GB LPDDR5 SDRAM, up to 4800MT/s, IBECC (only Atom SKU´s), soldered |
Flash | Up to 256GB eMMC V5.1 Flash, soldered (optional) |
Storage Interfaces | 1x SATA-III 6Gbps |
USB | 2x USB 3.1 Host interfaces 6x USB 2.0 Host interfaces |
Serial Interfaces | 4x UART (two with handshake) |
Bus Interfaces | Up to 4x PCI-Express x1 Gen. 3 lanes 1x I2C Bus 1x SPI Bus (Boot) 1x SPI Bus (general purpose)/ eSPI (optional) 1x SMBus |
Display Controller | Integrated Intel UHD Graphics (Gen12) Up to 32 execution units (EU) |
Display Interfaces | Three independent displays supported 2x DP++ Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or Embedded DisplayPort 1.4b up to 4096 x 2304 @ 60Hz and MIPI-DSI x4 Interface up to 1920 x 1080 @ 60Hz (optional) |
Network Interface | 2x 10/100/1000Base-T, up to 2.5G based on Intel i226 1x SGMII Interface on PCIE-D (opt. only Atom SKU´s) |
Audio Interface | High Definition Audio and I2S Audio or 2x I2S Audio |
Security Device | Infineon Trusted Platform Module 2.0 |
Miscellaneous | MIPI CSI-2 camera interface (CSI0, 2 lane) MIPI CSI-2 camera interface (CSI1, 4 lane) Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan |
Feature Highlights | SMARC™ 2.1.1 compliant |
Firmware | AMI Aptio UEFI |
OS Support | Windows 10 IoT Enterprise 2021 LTSC Yocto Project (LTS kernel 2021) |
Power Requirement | +5V +/-5% +5V Standby |
Environment | Temperature Range: Commercial: 0° … 60°C (operating) -20° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing) |
Dimensions | 82 x 50 mm |
Certificates | UL / CE |
Cooling | Heatspreader Heatsink |
Carrier | TRIA SM2-MB-EP1 |
Order Info
Order No. | Description | Reference | Status |
114166 | SMARC 2.1.1 module with Intel Core i3-N305, Octa-Core (1.0/1.8GHz), 9-15W, 16GB LPDDR5 (4800MT/s), no eMMC, 4x PCIex1, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0 Host, TPM 2.0, LVDS, PUC (PC Client Use Conditions), standard temperature 0...+60°C | MSC SM2S-ALN-N305-4NN0291C PCBFTX | PV |
114170 | SMARC 2.1.1 module with Intel Processor N97, Quad-core (2.0 GHz), 12W, 8GB LPDDR5 (4800MT/s), 32GB eMMC, 4x PCIex1, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0 Host, TPM 2.0, LVDS, PUC (PC Client Use Conditions), standard temperature 0...+60°C | MSC SM2S-ALN-N97-35N0291C PCBFTX | PV |
114168 | SMARC 2.1.1 module with Intel Processor N50, Dual-core (1.0 GHz), 6W, 4GB LPDDR5 (4800MT/s), 16GB eMMC, 4x PCIex1, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0 Host, TPM 2.0, LVDS, PUC (PC Client Use Conditions), standard temperature 0...+60°C | MSC SM2S-ALN-N50-24N0291C PCBFTX | PV |
114186 | SMARC 2.1.1 module with Intel Atom x7425E, Quad-Core (1.5 GHz), 12W, TCC, 16GB LPDDR5 (4800MT/s), no eMMC, PCIex4, no SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0 Host, TPM 2.0, LVDS, EUC (Embedded use conditions), standard temperature 0...+60°C | MSC SM2S-ALN-x7425E-4NN0281C PCBFTX | PV |
114184 | SMARC 2.1.1 module with Intel Atom x7213E, Dual-Core (1.7 GHz), 10W, TCC, 4GB LPDDR5 (4800MT/s), 16GB eMMC, no PCIex4, PCIe/SGMII on PCIe_D, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0 Host, TPM 2.0, LVDS, EUC (Embedded use conditions), standard temperature 0...+ 60°C | MSC SM2S-ALN-x7213E-24N0291C PCBFTX | PV |
114182 | SMARC 2.1.1 module with Intel Atom x7211E, Dual-Core (1.0 GHz), 6W, TCC, 4GB LPDDR5 (4800MT/s), 16GB eMMC, no PCIex4, PCIe/SGMII on PCIe_D, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0 Host, TPM 2.0, LVDS, EUC (Embedded use conditions), standard temperature 0...+ 60°C | MSC SM2S-ALN-x7211E-24N0291C PCBFTX | PV |
Accessories
Carrier Options
Order No. | Description | Reference |
68488 | SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°C | MSC SM2-MB-EP1-001 PCBFTX |
85087 | SMARC 2.x compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED (1 x LAN i210), 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 3.0/ DisplayPort Type C , 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, I²C, 12 GPIO on FC, 1x DisplayPort+ + , LVDS/ eDP/DSI on JILI30 connector, μSD Card Slot, regulated backlight supply, HD Audio with amplifier, system fan connector, camera connector, RTC battery. Industrial temperature range -40..+85°C, x86 full version | MSC SM2S-MB-EP5-001 PCBFTX |
83979 | SMARC 2.x compatible embedded platform (146 x 80mm), 12V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED, 1x M.2 2280 Key M slot , 1x USB 2.0 Type A, 1x USB3.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, 12 GPIO on FC, 1x DisplayPort++ , LVDS/eDP/DSI on JILI30 connector, regulated backlight supply, RTC battery, Industrial temperature range -40..+85°C, x86 slim version | MSC SM2S-MB-EP5-003 PCBFTX |
Cooling Options
Order No. | Description | Reference |
98357 | Passive Heatsink for SM2S-ALN and SM2S-ASL variants, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through- hole standoffs | MSC SM2S-ALN-01 HSI-001 |
98358 | Heatspreader for SM2S-ALN and SM2S-ASL variants, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC SM2S-ALN-01 HSP-001 |
Support
Application Notes
App_Note_038_SMARC_2-1-1_Carrier-Board_Recommendations
App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf
App_Note_032_Secure_Boot
App_Note_030_Addendum_Building_from_MSC_Git_2025-07-24
App_Note_030_Building_from_MSC_Git_V3_0
App_Note_028_MSC_AutoFLASH
App_Note_022_MSC_BIOS_Configurator_Tool
App_Note_021_Install_Win7_on_Recent_Intel_Architectures
App_Note_019_Activate_screen_after_WoL_from_sleep
App_Note_017_OS_Boot_support_for_different_media
App_Note_002_EDID_File_generation
Mechanical data
MSC_SM2S-ALN_SM2S-ASL_3D
MSC_SM2S-ALN-01_HSP-001_3D
MSC_SM2S-ALN-01_HSI-001_3D
BIOS
TRIA_PI_HSUART-WIN_DRIVER
BIOS_Update_SM2S-ALN-ASL_BIOS_V211_01
BIOS_Update_SM2S-ALN-ASL_BIOS_V200_01
Drivers
Intel_CSME_SW_2425.6.26.0_Consumer
Release_29.4.1
Graphic_101_6080
Chipset-10.1.19899.8597-Public-Client
30.100.2422.24-ADL-N-v1
gna-03.00.00.1457-win-3_0_sv2_resign-20220819
MSCHSUart_V113_02
Demo images
msc-image-lxqt-testapplication-intel-corei7-64_26082024
msc-image-base-intel-corei7-64_Scarthgap_02042025
msc-image-lxqt-intel-corei7-64_Scarthgap_02042025
Modules (COM / SOM) > SMARC > Module > TRIA SM2S-ALN
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