TRIA OSM-SF-IMXRT1170

NXP Module

The TRIA OSM-SF-IMXRT1170 is based on the new OSM 1.1 standard (Size-S) "Small" for completely machine
processible low-cost embedded computer modules during soldering, assembly and testing.
Highly scalable and equipped with the i.MX RT1170 family manufactured by NXP. The i.MX RT1170 Crossover MCUs
are dual-core devices featuring an Arm® Cortex®-M7 and Arm® Cortex®-M4 for real-time microcontroller (MCU)
performance and high integration for industrial and IoT applications.
TRIA OSM-SF-IMXRT1170 operates with an Cortex-M7 at up to 1 GHz and an Cortex-M4 at up to 400 MHz with 2 MB
on-chip RAM. It offers various memory interfaces and a wide range of connectivity interfaces including 2x Ethernet
up to 1 Gbps with TSN/AVB, UART, SPI, I2C, USB and 2x CAN-FD. The module provides advanced embedded
security including secure boot and crypto engines.
The module is compliant with the new OSM 1.1 standard (OSM-SF).
The i.MX RT1170 family is supported by the MCUXpresso ecosystem from NXP, which includes an SDK, a choice of
IDEs and secure provisioning and configuration tools to enable rapid development.

Highlights

Arm Cortex-M7 at 1 Ghz and Arm Cortex-M4 at 400MHz
up to 2 MB SRAM with
512 KB of TCM for Arm Cortex-M7
256 KB of TCM for Cortex-M4
2D GPU with Vector Graphics Acceleration
Up to 256MB QUAD SPI NOR Flash
Up to 2 MB SRAM (internal)
optional HyperRAM™ with up to 64MB
High accuracy, temp. compensated (DTCXO) RTC
2x USB 2.0 Host/Device interface
2x Ethernet (1x RGMII, 1x RMII)
1x SD/SDIO interface
5x UART (2x with RTS/CTS)
2x SPI . 24x GPIO
up to 2x ADC inputs (12-bit)
up to 6x PWM
1x MIPI-DSI (2 lane)
1x MIPI-CSI (2 lane)
OSM 1.1 (SF) Compliant, 322 Pin, RM 1,25 mm

Specifications

Technology	ARM
Form Factor	OSM-SF, 322 Pin, RM 1,25 mm
CPU	NXP i.MX RT1170 CROSSOVER MCUs with up to 1GHz i.MX RT1171/RT1172/RT1173/RT1175/RT1176
Chipset	SOC
RAM	Up to 2 MB SRAM (internal) + optional HyperRAM™ with up to 64MB
Flash	Up to 256MB QUAD SPI NOR Flash
Storage Interfaces	1x eMMC/SD Interface (4 Lane)
USB	2x USB 2.0 Host/Client
Serial Interfaces	1x UART Console with Rx, Tx only 2x UART with 2-wire hand shake 2x UART w/o hand shake
Bus Interfaces	up to 2x I2C 2x SPI (with two chip selects) up to 2x CAN-FD /CAN 2.0B
Display Controller	2D GPU with Vector Graphics Acceleration
Display Interfaces	MIPI-DSI Display Interface
Network Interface	2x Ethernet (1x RGMII, 1x RMII)
Audio Interface	1x I2S Audio
Security Device	Hardware Elliptic Curve Cryptography Hardware-protected keys for secure boot AES engine for data encryption, optional SE050 Secure Element
Miscellaneous	High accuracy, temperature compensated (DTCXO) RTC 24x GPIO, configurable as input or output, interrupt capable, 14x configurable as FlexIO up to 2x ADC inputs (12-bit) up to 6x PWM MIPI-CSI Camera interface
Feature Highlights	OSM, Size-S compatible
OS Support	NXP’s MCUXpresso software and tools
Power Requirement	Power Supply +5V +/-5% Power Consumption 1-2 W typ.
Environment	Temperature Range: 0°C … +70°C operating commercial -40°C … +85°C operating extended -40°C … +85°C storage Humidity: 5 … 95% (operating, non condensing) 5 … 95% (storage, non-condensing)

Order Info

Order No.

Description

Reference

Status

tbd	OSM 1.1 module based on NXP i.MX RT1172, Cortex-M7 at 800MHz, 1x RGMII, 1x RMII, 2x USB2.0 Host/Device, 1x MIPI-DSI, 1x MIPI-CSI, 1x SDIO, industrial temperature -40°C...+85°C (Engineering Sample - get in touch with your sales representative)	MSC OSM-SF- IMXRT1170 ES1 PCBES	OR

tbd

OSM 1.1 module based on NXP i.MX RT1172, Cortex-M7 at 800MHz, 1x RGMII, 1x RMII, 2x USB2.0 Host/Device, 1x MIPI-DSI, 1x MIPI-CSI, 1x SDIO, industrial temperature -40°C...+85°C (Engineering Sample - get in touch with your sales representative)

MSC OSM-SF- IMXRT1170 ES1 PCBES