TRIA SM2S-ASL
The TRIA SM2S-ASL module features the Intel Atom® processors x7000RE/C Series (codenamed “Amston Lake”). The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment. The board is ideal for system products that are exposed to harsh ambient conditions. It is designed for extended temperature range and 24/7 continuous operation.
The TRIA SM2S-ASL offers triple independent display support with a maximum of 4k resolution, fast LPDDR5 memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1.1 module.
Different SOCs with dual-, quad- and eight-core processors are supported by this design. In addition to an extensive set of interfaces and features, the TRIA SM2S-ASL offers 2 Gigabit Ethernet based on Intel® i226 and supports up to 2.5GbE bandwidth.
For evaluation and design-in of the TRIA SM2S-ASL module, Tria provides a suitable SMARC 2.1.1 development platform. A complete, ready-to-run Starterkit is also available.
Highlights
- Up to eight processing cores
- Power efficient processors, TDP 6 to 12W
- Integrated Intel UHD Gen.12 graphics, max. 32 executing units .
- Up to 16GB LPDDR5 SDRAM, In-band ECC
- Up to 256GB eMMC 5.1 Flash (optional)
- SATA-III interface (6Gbps)
- 2x DP++
- LVDS / Embedded DisplayPort and MIPI-DSI
- Triple Independent Display support
- 2x MIPI-CSI Camera Interface
- Up to 4x PCI Express x1/x2/x4 Gen. 3
- 2x USB 3.2 Gen2 (up to 10Gb/s)
- 6x USB 2.0
- 2x 1/2,5 Gigabit Ethernet (Intel® i226)
- 1x SGMII Interface on PCIE-D
- UART, SPI, I2C, SMBus
- HD/I2S Audio
- Trusted Platform Module TPM 2.0
- SMARC 2.1.1 compliant
- UEFI Firmware
Specifications
Technology | x86 |
Form Factor | SMARC® 2.1.1 Short Size |
CPU | Intel Atom® x7835RE, octa-core, 1.3GHz, 32EU, TCC, 12W, IUC, ET Intel Atom® x7433RE, quad-core, 1.5GHz, 32EU, TCC, 9W, IUC, ET Intel Atom® x7213RE, dual-core, 2.0GHz, 16EU, TCC, 9W, IUC, ET Intel Atom® x7211RE, dual-core, 1.0GHz, 16EU, TCC, 6W, IUC, ET Intel Atom® x7405C, quad-core, 2.2GHz, no GPU, TCC, 12W, EUC, CT Intel Atom® x7203C, dual-core, 2.0GHz, no GPU, TCC, 9W, EUC, CT Note: base frequency shown, other frequencies supported ET- Extended temperature CT- Commercial temperature EUC - Intel Embedded Use Conditions IUC - Intel Industrial Use Conditions |
Chipset | Integrated in SOC |
RAM | Up to 16GB LPDDR5 SDRAM, up to 4800MT/s, IBECC, soldered |
Flash | Up to 256GB eMMC V5.1 Flash, soldered (optional) |
Storage Interfaces | 1x SATA-III 6Gbps |
USB | 2x USB 3.2 Gen2 (up to 10Gb/s) 6x USB 2.0 |
Serial Interfaces | 4x UART (two with handshake) |
Bus Interfaces | Up to 4x PCI-Express x1 Gen. 3 lanes 1x I2C Bus 1x SPI Bus (Boot) 1x SPI Bus (general purpose)/ eSPI (optional) 1x SMBus |
Display Controller | Integrated Intel UHD Graphics (Gen12) Up to 32 execution units (EU) Note: only available with the Intel Atom Processor x7000RE Series |
Display Interfaces | Three independent displays supported 2x DP++ Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or Embedded DisplayPort 1.4b up to 4096 x 2304 @ 60Hz and MIPI-DSI x4 Interface up to 4096 x 2160 @ 60Hz (optional) Note: display interfaces are only available with the Intel Atom Processor x7000RE Series |
Network Interface | 2x 10/100/1000Base-T, up to 2.5Gbps based on Intel i226 with TSN support 1x SGMII (up to 2.5Gbps) Interface on PCIE-D |
Audio Interface | High Definition Audio and I2S Audio or 2x I2S Audio |
Security Device | Infineon Trusted Platform Module 2.0 |
Miscellaneous | MIPI CSI-2 camera interface (CSI0, 2 lane) MIPI CSI-2 camera interface (CSI1, 4 lane) Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan |
Feature Highlights | SMARC™ 2.1.1 compliant |
Firmware | AMI Aptio UEFI |
OS Support | Windows 10 LTSC Windows 11 LTSC Yocto Project (LTS kernel 2021) |
Power Requirement | +5V +/-5% +5V Standby |
Environment | Temperature Range: Commercial: 0° … 60°C (operating) Industrial: -40° … 85°C (operating) -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing) |
Dimensions | 82 x 50 mm |
Certificates | UL / CE |
Cooling | Heatspreader Heatsink |
Carrier | TRIA SM2-MB-EP1 |
Order Info
Order No. | Description | Reference | Status |
114189 | SMARC 2.1.1 module with Intel Atom x7835RE, Octa-Core (1.3GHz), 12W, TCC, 16GB LPDDR5 (4800 MT/s), 32EU, 32GB eMMC, no PCIex4, PCIe/ SGMII on PCIe_D, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40°C...+85°C | MSC SM2S-ASL-x7835RE-45N0191I PCBFTX | PV |
114191 | SMARC 2.1.1 module with Intel Atom x7433RE, Quad-Core (1.5GHz), 9W, TCC, 8GB LPDDR5 (4800 MT/s), 32EU, 32GB eMMC, PCIex4, no SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40°C...+85°C | MSC SM2S-ASL-x7433RE-35N0281I PCBFTX | PV |
114193 | SMARC 2.1.1 module with Intel Atom x7213RE, Dual-Core (2.0GHz), 9W, TCC, 8GB LPDDR5 (4800 MT/s), 16EU, 16GB eMMC, no PCIex4, PCIe/ SGMII on PCIe_D, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40°C...+85°C | MSC SM2S-ASL-x7213RE-34N0291I PCBFTX | PV |
114195 | SMARC 2.1.1 module with Intel Atom x7211RE, Dual-Core (1.0GHz), 6W, TCC, 4GB LPDDR5 (4800 MT/s), 16EU, 16GB eMMC, no PCIex4, PCIe/ SGMII on PCIe_D, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40°C...+85°C | MSC SM2S-ASL-x7211RE-24N0291I PCBFTX | PV |
114197 | SMARC 2.1.1 module with Intel Atom x7203C, Dual-Core (2.0GHz), 9W, TCC, 4GB LPDDR5 (4800 MT/s), 16GB eMMC, no PCIex4, PCIe/SGMII on PCIe_D, SATA, 2x 2.5GbE LAN, 2x USB 3.1, 6x USB 2.0, TPM 2.0, no Graphics, EUC (Embedded use conditions), commercial temperature 0°C...+ 60°C | MSC SM2S-ASL-x7203C-24N0N91C PCBFTX | OR |
Accessories
Carrier Options
Order No. | Description | Reference |
68488 | SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°C | MSC SM2-MB-EP1-001 PCBFTX |
85087 | SMARC 2.x compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED (1 x LAN i210), 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 3.0/ DisplayPort Type C , 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, I²C, 12 GPIO on FC, 1x DisplayPort+ + , LVDS/ eDP/DSI on JILI30 connector, μSD Card Slot, regulated backlight supply, HD Audio with amplifier, system fan connector, camera connector, RTC battery. Industrial temperature range -40..+85°C, x86 full version | MSC SM2S-MB-EP5-001 PCBFTX |
83979 | SMARC 2.x compatible embedded platform (146 x 80mm), 12V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED, 1x M.2 2280 Key M slot , 1x USB 2.0 Type A, 1x USB3.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, 12 GPIO on FC, 1x DisplayPort++ , LVDS/eDP/DSI on JILI30 connector, regulated backlight supply, RTC battery, Industrial temperature range -40..+85°C, x86 slim version | MSC SM2S-MB-EP5-003 PCBFTX |
Cooling Options
Order No. | Description | Reference |
98357 | Passive Heatsink for SM2S-ALN and SM2S-ASL variants, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through- hole standoffs | MSC SM2S-ALN-01 HSI-001 |
98358 | Heatspreader for SM2S-ALN and SM2S-ASL variants, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC SM2S-ALN-01 HSP-001 |
Support
Application Notes
App_Note_055_Qt6_On_Mscldk_With_Qt5
App_Note_038_SMARC_2-1-1_Carrier-Board_Recommendations
App_Note_043_Converting_eMMC_from_MLC_to_pSLC.pdf
App_Note_032_Secure_Boot
App_Note_030_Addendum_Building_from_MSC_Git_2025-09-26
App_Note_030_Building_from_MSC_Git_V3_0
App_Note_028_MSC_AutoFLASH
App_Note_022_MSC_BIOS_Configurator_Tool
App_Note_021_Install_Win7_on_Recent_Intel_Architectures
App_Note_019_Activate_screen_after_WoL_from_sleep
App_Note_017_OS_Boot_support_for_different_media
App_Note_002_EDID_File_generation
Mechanical data
App_Note_052_Mechanical_documentation_guide1v0
MSC_SM2S-ALN_SM2S-ASL_3D
MSC_SM2S-ALN-01_HSP-001_3D
MSC_SM2S-ALN-01_HSI-001_3D
BIOS
TRIA_PI_HSUART-WIN_DRIVER
BIOS_Update_SM2S-ALN-ASL_BIOS_V211_01
BIOS_Update_SM2S-ALN-ASL_BIOS_V200_01
Drivers
Intel_CSME_SW_2425.6.26.0_Consumer
Release_29.4.1
Graphic_101_6080
Chipset-10.1.19899.8597-Public-Client
30.100.2422.24-ADL-N-v1
gna-03.00.00.1457-win-3_0_sv2_resign-20220819
MSCHSUart_V113_02
Demo images
msc-image-base-intel-corei7-64_Scarthgap_02042025
msc-image-lxqt-intel-corei7-64_Scarthgap_02042025
Modules (COM / SOM) > SMARC > Module > TRIA SM2S-ASL
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