8ULP-SOM

The 8ULP SOM is a compact (43mm x 36mm), ultra-low power, peripheral-rich, compute module, designed for integration onto custom OEM hardware.

The NXP i.MX 8ULP device on this SOM is architected for optimal power efficiency, with separated processing domains, e.g.

  • Application domain with two Arm® Cortex®-A35 cores plus 3D/2D GPUs (plus comprehensive Linux enablement for rich GUI applications)
  • Real Time domain with Arm Cortex-M33F core for real-time performance, plus Cadence Fusion F1 DSP core for low-power audio/voice use cases.
  • LPAV domain (Low Power Audio Video) with a Cadence Tensilica HiFi 4 DSP core for advanced audio, ML and sensor applications.

An EdgeLock Security Enclave and µPower Manager have RISC-V cores to manage advanced security features and govern over 20 different power mode configurations across the processing domains. Together with the onboard NXP PCA9460B PMIC, exceptional energy efficiency is achieved.

Memory resources include OCRAM (896 KB), x32bit LPDDR4X DDR (2 GB), 8bit PSRAM (8 MB), eMMC 5.1 flash (32GB) and 8bit SPI NOR flash (4 MB).

Board to board interface is via two 100pin (0.4 mm pitch) connectors that can accommodate different stacking heights and have mating connectors from both Samtec and TE Connectivity.

The compact SOM dimensions, energy-efficient multi-processor architecture, EdgeLock security, graphic capabilities and rich peripheral mix, all add-up to a versatile intelligent edge solution.

Highlights

Target Applications:
  • Surveillance Camera with Recognition
  • Medical Devices, Portable Patient Monitors
  • Inventory and Asset Monitoring
  • Smart Building Control & HVAC
  • Food & Beverage POS Equipment
Key Features:
  • 2x A35 (800 MHz), 1x M33 (216 MHz)
  • 3D/2D GPU (317 MHz)
  • HiFi4 DSP and Fusion DSP
  • 32GB eMMC Flash, 4MB SPI Flash
  • 2GB LPDDR4X (x32bit)
  • 8MB Octal PSRAM, 896KB OCRAM
  • Ethernet,LPSPI,LPI2C,LPUART,CAN,I2S
  • 2x USB OTG, MIPI DSI, MIPI CSI
  • 2x 100pin B2B connectors
  • Operating Temperature -40C~+85°C
Kit Includes:
  • 8ULP SOM (system-on-module)

Specifications

Family: AAG
Release date: 0000-00-00 00:00:00
CPU: 2x A35 (800 MHz); 1x M33 (216 MHz);
Chipset: NXP
RAM: 2GB LPDDR4X (x32bit); 8MB octal PSRAM; 896KB OCRAM
Flash: 32 GB eMMC; 16 MB octal QSPI NOR flash
USB: 2x USB 2.0 OTG
Serial Interfaces: 8x LPUART; 5x LPSPI; 7x LPI2C
Display Interfaces: MIPI DSI (4 lane)
Network Interface: 10/100 Ethernet
Audio Interface: Stereo audio jack;
Power Requirement: 5V, 1.5A
Dimensions: 43mm x 36mm
Cooling: n/a
Carrier: MaaXBoard 8ULP
Memory: 32GB eMMC Flash; 4MB octal SPI Flash;2GB LPDDR4X (x32bit);8MB octal PSRAM; 896KB OCRAM
Chipset Brand: i.MX
Wireless Module: M.2 Wi-Fi/BT module (3rd-party options)
Max Temperature (°C): -40C;
Min Temperature (°C): 85°C;
Compute Standard: SOM (propriety)
Camera Interface: MIPI CSI (2 lane)
Chipset Sub-brand: 8ULP
E14-forums: https://community.element14.com/products/devtools/avnetboardscommunity/avnetboard-forums/f/maaxboard-hardware-design
Product Brief: FY24_1370_8ULP_SOM_Product_Briefe_r4.pdf
Target_Applications_1: Surveillance Camera with Recognition
Target_Applications_2: Medical Devices, Portable Patient Monitors
Target_Applications_3: Inventory and Asset Monitoring
Target_Applications_4: Smart Building Control & HVAC
Target_Applications_5: Food & Beverage POS Equipment
Kit_Includes_1: 8ULP SOM (system-on-module)
Key_Features_1: 2x A35 (800 MHz), 1x M33 (216 MHz)
Key_Features_2: 3D/2D GPU (317 MHz)
Key_Features_3: HiFi4 DSP and Fusion DSP
Key_Features_4: 32GB eMMC Flash, 4MB SPI Flash
Key_Features_5: 2GB LPDDR4X (x32bit)
Key_Features_6: 8MB Octal PSRAM, 896KB OCRAM
Key_Features_7: Ethernet,LPSPI,LPI2C,LPUART,CAN,I2S
Key_Features_8: 2x USB OTG, MIPI DSI, MIPI CSI
Key_Features_9: 2x 100pin B2B connectors
Key_Features_10: Operating Temperature -40C~+85°C
Product_Brief_Name: FY24_1370_8ULP_SOM_Product_Briefe_r4.pdf

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