Tria Technologies introduces the OSM-LF-IMX95, a compact OSM-compliant compute module powered by the NXP i.MX 95 processor, delivering high performance, advanced security and power efficiency for next-generation embedded and edge AI platforms.
Tria Technologies extends the lifetime and performance capabilities of the Qseven standard with the TRIA-Q7-ASL and TRIA-Q7-ALN modules, offering long-term availability, improved processing performance, and support for Intel “Amston Lake”, “Alder Lake N” and “Twin Lake” platforms.
Tria Technologies introduces the TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 compute modules featuring the Qualcomm Dragonwing™ IQ-6 Series processor, delivering industrial-grade edge AI performance, versatile interfaces, and support for SMARC and OSM form factors.
Stutensee, Germany – July 30, 2025 –Tria Technologies, an Avnet company specialising in the manufacturing of embedded compute boards, launches its new SMARC module based on a processor from embedded semiconductor solution provider, Renesas.
Tria’s latest compute modules powered by Qualcomm now support Windows, Android, and Linux—enabling scalable, low-power embedded systems with edge AI and multi-OS flexibility.
Tria launches the C6C-RYZ8 COM Express Compact Type 6 module at Embedded World 2025. Powered by AMD Ryzen™ Embedded 8000 Series with integrated AI acceleration, the module brings scalable x86 performance to compact embedded systems.
Tria rocks Embedded World debut with launch of COM Express Compact Type 6 module Read More »
Tria introduces its first COM-HPC Mini form factor module—HMM-RLP—powered by 13th Gen Intel® Core™ processors. Designed for edge compute performance in space-constrained systems, the module debuts at Embedded World 2025.
At Embedded World 2025, Tria Technologies will launch five new embedded module families powered by Qualcomm Dragonwing™ and Snapdragon® platforms. Designed for edge AI, low power, and industrial performance, these modules enable next-generation IoT and embedded applications.
Tria to launch five new product families powered by Qualcomm at Embedded World Read More »
Tria Technologies™, an Avnet company specialising in embedded compute boards, is making its Embedded World debut in Hall 3A Booth 225.
Tria debuts at Embedded World 2025 with new product launches Read More »
Tria™, an Avnet company specialising in embedded compute boards, welcomes two senior appointments to strengthen its operations and grow key accounts worldwide.
Tria Technologies Announces Two Senior Management Appointments Read More »
Tria Technologies introduces the MSC C6-MB-EV4, a new COM Express Type 6 carrier board that streamlines prototyping, evaluation, and system design.
Tria Technologies Launches New COM Express Type 6 Carrier Board Read More »
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