Tria introduces the C6C-PLH COM Express Compact Type 6 module, bringing Intel Core Ultra Series 3 processing and integrated AI acceleration to demanding embedded applications.
Tria Technologies will showcase compute platforms, displays, systems and engineering services alongside a new modular software platform at electronica 2026.
Tria Technologies launches a COM-HPC Client module powered by Intel Core Ultra Series 3 processors, enabling high-performance AI at the Edge for embedded applications.
Tria Technologies Launches Module with New Generation Intel Processor Read More »
Tria Technologies expands operating system support on Qualcomm-based hardware with Yocto Linux, Windows 11 IoT and Android for embedded and industrial applications.
Tria Technologies brings multi-OS support to Qualcomm-based hardware Read More »
Tria Technologies introduces SPB611 and SPB209 wireless modules supporting Wi-Fi, Bluetooth and mesh networking for embedded system design.
Wireless modules for embedded systems now available from Tria Technologies Read More »
Tria Technologies introduces the OSM-LF-IMX95, a compact OSM-compliant compute module powered by the NXP i.MX 95 processor, delivering high performance, advanced security and power efficiency for next-generation embedded and edge AI platforms.
Stutensee, Germany – June 30, 2025 – Tria Technologies, an Avnet company specializing in the manufacturing of embedded compute boards, is proudly sponsoring the 50-year celebrations of History and Culture in Stutensee.
Tria Technologies and Avnet collaborated at AWS re:Invent 2025 to demonstrate edge-to-cloud solutions featuring Qualcomm QCS6490 and AMD/ZUBoard-1CG FPGA SOC platforms, highlighting real-time AI and industrial gesture recognition integrated with AWS IoT Connect.
Tria collaborates with Avnet for AWS re:Invent 2025 Read More »
Tria Technologies extends the lifetime and performance capabilities of the Qseven standard with the TRIA-Q7-ASL and TRIA-Q7-ALN modules, offering long-term availability, improved processing performance, and support for Intel “Amston Lake”, “Alder Lake N” and “Twin Lake” platforms.
Tria Technologies introduces the TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 compute modules featuring the Qualcomm Dragonwing™ IQ-6 Series processor, delivering industrial-grade edge AI performance, versatile interfaces, and support for SMARC and OSM form factors.
Tria adds the SM2S-G3E to its SMARC portfolio, bringing the Renesas RZ/G3E processor to HMI, industrial automation and AI-enabled edge applications.
Tria’s latest compute modules powered by Qualcomm now support Windows, Android, and Linux—enabling scalable, low-power embedded systems with edge AI and multi-OS flexibility.
Tria launches the C6C-RYZ8 COM Express Compact Type 6 module at Embedded World 2025. Powered by AMD Ryzen™ Embedded 8000 Series with integrated AI acceleration, the module brings scalable x86 performance to compact embedded systems.
Tria rocks Embedded World debut with launch of COM Express Compact Type 6 module Read More »
Tria introduces its first COM-HPC Mini form factor module—HMM-RLP—powered by 13th Gen Intel® Core™ processors. Designed for edge compute performance in space-constrained systems, the module debuts at Embedded World 2025.
At Embedded World 2025, Tria Technologies will launch five new embedded module families powered by Qualcomm Dragonwing™ and Snapdragon® platforms. Designed for edge AI, low power, and industrial performance, these modules enable next-generation IoT and embedded applications.
Tria to launch five new product families powered by Qualcomm at Embedded World Read More »
Tria Technologies™, an Avnet company specialising in embedded compute boards, is making its Embedded World debut in Hall 3A Booth 225.
Tria debuts at Embedded World 2025 with new product launches Read More »
Tria Technologies announces senior management appointments for Kate Pritchard and Daniel Denzler, strengthening go-to-market leadership and business line management across boards and systems.
Tria Technologies Announces Two Senior Management Appointments Read More »
Tria Technologies and Qt Group partner to support embedded HMI and GUI development with Qt 6, SimpleSwitch, SMARC modules and integrated software workflows.
Tria Technologies Announces Major New Partnership with Qt Group Read More »
Tria Technologies introduces the MSC C6-MB-EV4, a new COM Express Type 6 carrier board that streamlines prototyping, evaluation, and system design.
Tria Technologies Launches New COM Express Type 6 Carrier Board Read More »
Tria Technologies presents the C6C-RYZ2 COM Express Type 6 modules with AMD Ryzen Embedded R2000 processors, ideal for industrial and medical applications.
New! COM Express modules with AMD Ryzen Embedded R2000 Read More »
Two new compute module families powered by Intel Core Ultra bring high performance, AI acceleration, and scalability to demanding imaging and embedded applications.
Simply high performance for your demanding imaging applications Read More »
Tria’s Qualcomm-based SMARC modules support edge AI, vision AI and industrial IoT applications with high-performance processing, AI acceleration and camera support.
Qualcomm for AI, brought to you by Tria Read More »
Tria introduces two SMARC modules based on Qualcomm QCS6490 and QCS5430 processors, bringing high-performance Arm-based processing to edge AI and industrial IoT applications.
Tria showcases three COM modules based on Intel Atom x7000RE and x7000C Series processors at Embedded World 2024 for compact industrial edge applications.
Tria has been promoted to Platinum Partner status within NXP® Semiconductor’s prestigious Global Partner Program. Platinum Partners are those companies who collaborate closely with NXP to enrich the enablement and implementation of total system solutions.
Tria Promoted to Platinum NXP Partner Read More »
Avnet (Nasdaq: AVT) launches a new SMARC module family based on NXP’s new i.MX 95 Applications Processor. The MSC SM2S-IMX95 SMARC module family is based on the new SMARC 2.1.1 standard allowing easy integration with SMARC baseboards.
Avnet Introduces High Performance SM2S-IMX95 SMARC Module Read More »
Avnet (Nasdaq: AVT) is launching two high-end Computer-on Module (CoM) products for compute and graphics intensive applications featuring Intel* Core* Ultra processors. The CoM module based on COM Express Type 6 with Basic formfactor (C6B-MLH) is intended as a technology refinement for applications that have the module standard already integrated. Architects that are targeting higher I/O bandwidth and connectivity can select the COM-HPC Client Size A module (HCA-MLH).
Avnet Launches Two Modules based on Intel Core Ultra Processor Read More »
Tria launches module based on the compact OSM Size M format featuring NXP’s i.MX 8M Plus family of processors. The TRIA OSM-MF-IMX8PLUS is based on the compact OSM 1.1 standard (Size-M) “Medium” for completely machine processible low-cost embedded computer modules during soldering, assembly and testing.
Tria Expands OSM Product Line with i.MX 8M Plus Read More »
TRIA C10M-ALN is a COM Express Type 10 Mini module based on Intel Atom x7000E Series processors, with LPDDR5 memory, eMMC, USB, PCIe and 2.5GbE support.
Tria’s Latest TRIA C10M-ALN Module Features the Intel Atom* Processor x7000E Series Read More »
Avnet opens a technology campus in Eschbach, Germany, with manufacturing, engineering, logistics and co-working space for compute, display, system and server assembly.
Avnet Opens Technology Campus in Southern Germany Read More »
TRIA C6C-RYZ2 extends the lifecycle of C6C-RYZ COM Express modules as a drop-in replacement based on AMD Ryzen Embedded R2000 processors.
Extend the Lifecycle of C6C-RYZ Modules with New Drop-In Replacement Read More »
Tria COM Express and COM-HPC module families based on 13th and 12th Gen Intel Core processors support high-performance industrial and AI applications.
Tria announces a SMARC starter kit for NXP i.MX 93 applications processors, enabling evaluation and application development for low-power embedded systems.
Avnet Embedded is expanding its comprehensive SMARC™ product portfolio including announcing availability of the scalable MSC SM2S-ALN module family.
Tria brings Windows 10 IoT Enterprise LTSC to Arm-based SMARC modules with NXP i.MX 8M Plus processors for industrial embedded platforms.
RASynBoard brings low-power edge AI processing to embedded sensor applications, combining always-on sensing, wireless connectivity and AI model development support.
RASynBoard brings low-power, edge AI processing to embedded sensor applications Read More »
Tria launches the TRIA C6C-ALN COM Express® Type 6 module family, utilizing the next generation of Intel® Atom® processor technology.
Tria announces a high-performance COM Express Type 6 module family based on 13th Gen Intel Core processors for industrial, medical, transportation, video surveillance and gaming applications.
Tria continues its long and successful partnership with NXP™ Semiconductors and presents the scalable TRIA SM2S-IMX93 SMARC 2.1.1™ module family.
Tria and Renesas developed the SM2S-G2UL SMARC module family for cost-effective, power-efficient embedded and entry-level HMI applications.
Tria is pushing forward the rapid development of innovative OSM standard modules (Open Standard Module™) and offers special options for rapid evaluation of OSM prototypes.
Tria announces options for rapid evaluation of OSM modules on existing SMARC platforms Read More »
Tria simplifies embedded software development on SMARC® 2.1.1 module families and launches platform enabling developers to switch between x86 and ARM® based modules without changing code.
Tria announces at embedded world 2022 that the leading provider of embedded computing modules is supporting the new i.MX 93 Applications Processor family from NXP™ Semiconductors on the latest SMARC 2.1.1™ form factor.
In Hall 3A, Booth 111 (Avnet Silica) at embedded world 2022, Tria is showing a demonstration featuring an ARM®-based embedded compute module integrating an i.MX 8M processor from NXP™ Semiconductors running the full Microsoft Windows® 10 IoT Enterprise operating system.
Tria brings full Windows® 10 IoT to its ARM®-based SMARC™ modules with NXP i.MX 8M SoCs Read More »
Tria expands its COM-HPC product portfolio for high-performance computing applications and presents the new TRIA HCA-ALP client module family in Hall 3, Booth 135 at embedded world 2022.
Tria Technologies presents the TRIA C6C-ALP COM Express Compact module family with 12th Gen Intel Core P-series and U-series processors.
Tria has held a groundbreaking ceremony to mark the commencement of a new multi-million-euro manufacturing site in Europe.
Tria announces groundbreaking of major new manufacturing site in Eschbach, Germany Read More »
Tria Technologies introduced the TRIA HSD-ILDL COM-HPC Server module family based on Intel Xeon D-1700 processors for IoT, AI/deep learning and edge computing applications.
Tria Technologies presents COM-HPC Server module family based on Intel Xeon D processors Read More »
Underlining its global leadership in the embedded market, Tria has opened a new design center in Deggendorf, Germany, on January 1, 2022.
Tria has opened a new design center for embedded products in Deggendorf, Germany Read More »
Tria expands its broad COM Express™ product portfolio at the higher end of the performance range. The new TRIA C6B-ALP COM Express™ Type 6 module family bases on 12th Gen Intel® Core™ H-series processors (codenamed „Alder Lake H-series“), offering a wide selection of CPU variants with scalable energy efficiency and high computing performance.
Tria is enabling the rapid development of reliable embedded systems based on compact SMARC 2.1.1™ standard modules with integrated Arm® processors.
Tria supports Arm®’s Project Cassini for rapid development of SMARC-based IoT systems Read More »
Tria supports the fast development of powerful industrial applications and expands its COM Express™ product portfolio at the higher end of the performance range.
Tria Technologies joined Intel for a webinar on 11th generation Intel Core processors for embedded computing, including mission-critical applications and the C6C-TLU COM Express module.
Tria co-hosts webinar with Intel on 11th generation processors Read More »
With the TRIA SM2S-EL module family, Tria is expanding its already extensive range of SMARC 2.1™ standard modules in the upper performance segment. The TRIA SM2S-EL modules integrate the new multi-core Intel Atom® x6000E and Intel Atom® Pentium® / Celeron® N und J Series processor technology (codenamed „Elkhart Lake”).
Tria Technologies announces the powerful TRIA SM2S-IMX8PLUS SMARC 2.1™ module family, which integrates the new i.MX 8M Plus applications processor from NXP™ Semiconductor.
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