Stutensee, Germany – 29 October 2026 – Tria Technologies, an Avnet company specialising in embedded compute solutions, will showcase its hardware and software portfolio at electronica 2026. On Stand B5.103, visitors can explore compute modules, displays, systems and engineering services alongside the launch of a new modular software platform for developing, securing and maintaining connected products.

At Messe München from November 10-13, Tria will also participate in edge lab LIVE, electronica’s dedicated area for practical edge-computing demonstrations and exchange. Across both venues, the company will discuss how hardware, software and long-term support come together in embedded projects.

The launch of the new software platform will mark an expansion of Tria’s offering beyond hardware selection and integration. Its modular foundation lets manufacturers combine Tria compute platforms with the operating systems, development tools, security capabilities and engineering services their programmes require, while retaining control of their software architecture.

“Our customers need more than a board to bring an embedded product to market and keep it running,” said Daniel Denzler, Vice President, Tria Technologies. “At electronica, we’re excited to connect with visitors to discuss the whole project: the right hardware, a software starting point that does not lock anyone in, and the support needed as security requirements and products evolve.”

Hardware, software and services on show

Tria’s new software offering begins with a minimalist board support package (BSP) for customer-owned or Tria-supported software stacks. Optional components can be added as project requirements evolve. Visitors can explore the complete new Tria software package and learn how it accelerates product development, enhances security and drives innovation when building solutions with Tria’s hardware. Alongside these tools, Tria will show how its compute modules and systems can be adapted through custom engineering and supported after deployment.

Among the hardware on show will also be TRIA OSM-SB-EP5, an OSM V1.2 carrier board for Size-S, Size-M, and Size-L, which accelerates software and simplifies hardware development. Additionally, there will also be a new OSM and COM express module on display to support edge AI and industrial systems.

Meet Tria at electronica

Designers and OEMs can visit Stand B5.103 to discuss current projects, compare platform options and see how Tria’s new software platform, Compute modules and custom board development fits their design plans. Tria’s participation in edge lab LIVE! will offer another opportunity to engage with the company around practical edge-computing applications.

Further information is available at www.tria-technologies.com.