COM-HPC Archives - Tria

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COM-HPC

COM-HPC

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    COM-HPC

    TRIA HCA-PLH

    The TRIA HCA-PLH COM-HPC Client module features the Intel® Coreâ„¢ Ultra Series Processor (Series 3), providing developers with a powerful workhorse to …

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    COM-HPC

    TRIA HMM-IQX

    The TRIA HMM-IQX is a COM-HPC Mini module based on the Qualcomm Dragonwing IQ-X processor for compact, high-performance edge AI systems.

    It combines Qualcomm Oryon CPU cores, Adreno graphics and a Hexagon NPU with up to 45 TOPS AI performance, alongside LPDDR5X memory, PCI Express, USB4, DisplayPort, UFS storage and dual Ethernet interfaces.

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    COM-HPC

    TRIA HMM-RLP

    The TRIA HMM-RLP module featuring the COM-HPC Mini formfactor is ideal for system designs that require outstanding performance and flexible IO connect…

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    COM-HPC

    TRIA HCA-MLH

    The TRIA HCA-MLH COM-HPC Client module features the Intel® Coreâ„¢ Ultra processor Series 1 and 2, providing developers with a powerful and scalable pla…

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    COM-HPC

    TRIA HS-SK-ILDL-EV-KIT001

    The MSC HS-SK-ILDL-EV-KIT001 is a ready-to-run Starter Kit for COM-HPC Server modules based on the Intel® Xeon® D-1700 Processor. It is ideally suited…

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    COM-HPC

    TRIA HCA-RLP

    The TRIA HCA-RLP COM-HPC Client module features the 13th Gen Intel® Coreâ„¢ processor, giving application designers a great variety of choices of power …

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    COM-HPC

    TRIA HCA-ALP

    The TRIA HCA-ALP COM-HPC Client module features the 12th Gen Intel® Coreâ„¢ processor, giving application designers a great variety of choices of power …

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    Carrier Boards

    TRIA HS-MB-EV

    The MSC HS-MB-EV is intended for design teams that require an easy and fast enablement of COM-HPC® based solutions for lab evaluation, rapid prototypi…

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    Carrier Boards

    TRIA HC-MB-EV

    The TRIA HC-MB-EV is an ATX COM-HPC Client carrier board for lab evaluation, rapid prototyping and application development.

    It supports COM-HPC Client modules in Size A, B and C and provides access to key interfaces including PCIe Gen 3/4, USB4 Type-C, SATA, M.2, DisplayPort, eDP, MIPI CSI and dual RJ45 LAN with up to 10GbE support, depending on the installed module.

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    COM-HPC

    TRIA HSD-ILDL

    The TRIA HSD-ILDL COM-HPC Server module hosts the Intel® Xeon® D-1700 processor and delivers server class performance on embedded form factor

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    COM-HPC

    TRIA HCC-CFLS

    The TRIA HCC-CFLS module is the first member of the new COM-HPC product family. It enables a PICMG COM-HPC Client interface and features size C module…

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