TRIA C6B-MLH

Intel Module

The TRIA C6B-MLH COM Express module features the Intel® Core™ Ultra processor, providing developers with a powerful workhorse to boost their target applications. The module is ideal for challenging tasks in robotics, medical, public safety, and gaming that require uncompromising performance. The architecture scales up to sixteen cores and twenty-two threads at 28/15W thermal design power (TDP). Together with the integrated AI accelerator (NPU) and up to 128 GPUs, the processor greatly supports AI projects and compute intense duties.

For highest data throughput the module enables fast DDR5 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to ninety-six GB. Up to sixteen PCIe Gen 4 lanes and an eight lane PEG port (PCIe Gen 4) allow for accessing external accelerators, storage, and I/O at high throughput. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller.

System investments are well protected through long-term availability of the module, designed, and manufactured by Tria Technologies. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Highlights

COM Express Type 6, Basic module
Intel® Core™ Ultra Processors Series 1 and 2
Up to sixteen cores, twenty-two threads
Integrated AI accelerator (NPU) Intel® AI Boost
Up to 96GB DDR5-6400 SDRAM, dual channel, IB-ECC
Intel® Arc™ Graphics, up to 8 Xe cores (128 EUs)
Three DisplayPort/HDMI interfaces
LVDS and Embedded DisplayPort interface
Four independent display streams
Up to sixteen PCI Express® Gen 4 lanes
PEG 1×8, PCIe Gen 4 (optional)
Up to two USB4 ports
Three USB 3.2 Gen1/2 and eight USB 2.0 ports
Two UARTs
Optional on-board NVMe SSD, up to 256GB
Up to two SATA 6Gb/s mass storage interfaces
1 / 2.5 Gb Ethernet port (Intel® i226)
Trusted Platform Module TPM 2.0
Long-term product availability for selected variants 125 x 95 tbd 0 +60

Specifications

Technology	x86
Form Factor	COM Express Basic
CPU	Intel® Core™ Ultra Processors Series 2: Intel® Core™ Ultra 9 processor 285H 6P+8E+2LPE/22T, 2.9GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 45W BP Intel® Core™ Ultra 7 processor 265H 6P+8E+2LPE/22T, 2.2GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 28W BP Intel® Core™ Ultra 7 processor 255H 6P+8E+2LPE/22T, 2.0GHZ, 8Xe/128EUs, 24MB L3, 28W BP Intel® Core™ Ultra 5 processor 235H 4P+8E+2LPE/18T, 2.4GHZ, 8Xe/128EUs, 18MB L3, vPRO®, 28W BP Intel® Core™ Ultra 5 processor 225H 4P+8E+2LPE/18T, 1.7GHZ, 7Xe/112EUs, 18MB L3, 28W BP Intel® Core™ Ultra 7 processor 265U 2P+8E+2LPE/14T, 2.1GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 7 processor 255U 2P+8E+2LPE/14T, 2.0GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra 5 processor 235U 2P+8E+2LPE/14T, 2.0GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 5 processor 225U 2P+8E+2LPE/14T, 1.5GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra Processors Series 1: Intel® Core™ Ultra 7 processor 165H 6P+8E+2LPE/22T, 1.4GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 28W BP Intel® Core™ Ultra 7 processor 155H 6P+8E+2LPE/22T, 1.4GHZ, 8Xe/128EUs, 24MB L3, 28W BP Intel® Core™ Ultra 5 processor 135H 4P+8E+2LPE/18T, 1.7GHZ, 8Xe/128EUs, 18MB L3, vPRO®, 28W BP Intel® Core™ Ultra 5 processor 125H 4P+8E+2LPE/18T, 1.2GHZ, 7Xe/112EUs, 18MB L3, 28W BP Intel® Core™ Ultra 7 processor 165U 2P+8E+2LPE/14T, 1.7GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 7 processor 155U 2P+8E+2LPE/14T, 1.7GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra 5 processor 135U 2P+8E+2LPE/14T, 1.6GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 5 processor 125U 2P+8E+2LPE/14T, 1.3GHZ, 4Xe/64EUs, 12MB L3, 15W BP Note: P core base frequency at processor base power (BP) shown, other clock frequencies at different power levels supported
Chipset	Integrated into SoC
RAM	2x 262-pin SO-DIMM socket for up to 2x 48GB DDR5 SDRAM DDR5-6400 Series 2 processors DDR5-5600 Series 1 processors Dual channel operation minimum capacity 1x 8GB single channel operation inband ECC (IB-ECC) option (OS dependent)
Storage Interfaces	Up to 2x SATA channels (up to 6Gb/s) Optional on-board NVMe, 128GB, 256GB
USB	Up to 2x USB4 (mutually exclusive with DDI 1, 2) 3x USB 3.2 (Gen 1 & 2), 8x USB 2.0
Serial Interfaces	2x high-speed serial ports
Bus Interfaces	PCI Express® Gen 4, 1x8, on COMe PCIe[24:31], PEG port, optional ¹ PCI Express® Gen 4, 1x4, on COMe PCIe[20:23], optional PCI Express® Gen 4, 1x4, on COMe PCIe[16:19] Up to eight PCI Express® Gen 4 lanes on COMe PCIe[0:7], flexible bifurcation options, up to 5 root ports LPC bus (Low Pin Count bus, no DMA support) ¹ Available on H-series processors
Display Controller	Intel® Arc™ Graphics, up to 8 Xe cores / 128 execution units (EU) H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode
Display Interfaces	Four independent display streams 2x USB4/USB-C ports (DP tunneling) 3x Digital Display Interface (DP 2.1, HDMI 2.1) 1x Embedded DisplayPort 1.4b 1x LVDS 24bit, dual-channel
Network Interface	10/100/1000Base-TX, 2.5G² based on Intel i226-LM ² Available bandwidths depending on carrier design
Audio Interface	High Definition Audio
Security Device	TPM 2.0
Miscellaneous	Watchdog Timer:Initiates system reset, programmableFan Supply:4-pin header for CPU fan, PWM speed controlledand PWM speed control for system fan supportedRTC battery:externalSystem Monitoring:voltage, temperature, CPU fan, system fan
Feature Highlights	Type 6 pin-out
Firmware	UEFI Firmware:AMI Aptio® VSecurity:TPM 2.0 support, TCG compliantPower Management:ACPIActive fan controlUSB:USB legacy support (keyboard, mouse, storage)Monitoring:System MonitoringHealth MonitoringMSC Adv. Boot Device Selection:Boot device priority setting based on physical interfaces
OS Support	Windows 11 IoT Enterprise LTSC BSP for Linux (Yocto)
Power Requirement	Voltage: +8.5V to +20V, +5V Stby optional, +3V RTC voltage Power Consumption: tbd W to tbd W (typ.)
Environment	Ambient Temperature: 0° … 60°C (operating) -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing)
Dimensions	125 x 95
Certificates	UL / CE

Order Info

Order No.

Description

Reference

Status

tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 7 265H 16C/22T, vPro 2.2GHz, 28W BP Graphics: Intel Arc 128 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA 3x USB3, 8x USB2, PEG x8 Gen 4, PCIe G4 1x4, PCIe G4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-265H-NN3J1C PCBFTX	OR
tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 5 235H 14C/18T, vPro 2.4GHz, 28W BP Graphics: Intel Arc 128 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA, 3x USB3, 8x USB2, PEG x8 Gen 4, PCIe G4 2x4, PCIe G4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-235H-NN3J1C PCBFTX	OR
tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 7 265U 12C/14T, vPro 2.1GHz, 15W BP Graphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-265U-NN3J1C PCBFTX	OR
tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 5 235U 12C/14T, vPro 2.0GHz, 15W BP Graphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-235U-NN3J1C PCBFTX	OR
tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 7 155H 16C/22T, 1.4GHz, 28W BP Graphics: Intel Arc 128 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA, 3x USB3, 8x USB2, PEG x8 Gen 4, PCIe G4 2x4, PCIe G4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-155H-NN3J1C PCBFTX	PV
tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 5 125H 14C/18T, 1.2GHz, 28W BP Graphics: Intel Arc 112 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA, 3x USB3, 8x USB2, PEG x8 Gen 4, PCIe G4 2x4, PCIe G4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-125H-NN3J1C PCBFTX	PV
tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 7 165U 12C/14T, vPro 1.7GHz, 15W BP Graphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-165U-NN3J1C PCBFTX	PV
tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 7 155U 12C/14T, 1.7GHz, 15W BP Graphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-155U-NN3J1C PCBFTX	OR
tbd	COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Core Ultra 5 125U 12C/14T, 1.3GHz, 15W BP Graphics: Intel 64 EUs 3x DP/HDMI 1x LVDS 1x eDP 2x CSI Ethernet: Intel i226-LM Gbit, TSN HD audio TPM 2.0 2x SATA, 3x USB3, 8x USB2, PCIe Gen 4 2x4, PCIe Gen 4 6x 2x socket for DDR5 0...+60°C.	MSC C6B-MLH-125U-NN3J1C PCBFTX	PV

Accessories

Carrier Options

Order No.

Description

Reference

111650

COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, M.2, SD card socket, SATA, DisplayPort, LVDS, eDP, VGA, HD audio interfaces; ATX power connector. Dimensions 305 x 244 mm (ATX form factor)

MSC C6-MB-EV4 PCBFTX

Cooling Options

Order No.

Description

Reference

114058	Passive Heatsink for C6B-MLH consisting of a singlepiece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.	MSC C6B-MLH-01 HSI-001
114175	Passive Heatsink / heat pipe for C6B-MLH consisting of a single-piece aluminum profile with fins and embedded heatpipe, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.	MSC C6B-MLH-01 HSI-HP-001
114057	Heatspreader for C6B-MLH. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.	MSC C6B-MLH-01 HSP-001
114176	Heatspreader / heat pipe for C6B-MLH. Singlepiece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to CPU, chipset, NVMe.	MSC C6B-MLH-01 HSP-HP-001
114177	Heatspreader for C6B-MLH. Single-piece aluminum profile, standoffs with M2.5 thread, screws and thermopads for the thermal contact to CPU, chipset, NVMe.	MSC C6B-MLH-02 HSP-001

Memory Options

Order No.

Description

Reference

115233	8GB DDR5-5600 SO-DIMM, commercial temperature	MOD SODIMM DDR5 8GB PC5-44800 CL22 1B
115234	16GB DDR5-5600 SO-DIMM, commercial temperature	MOD SODIMM DDR5 16GB PC5-44800 CL22 1B
115235	32GB DDR5-5600 SO-DIMM, commercial temperature	MOD SODIMM DDR5 32GB PC5-44800 CL22 2B

Support

Application Notes