TRIA C6C-PLH
- COM Express Type 6, Compact formfactor
- Intel® Core™ Ultra Series 3 processors
- Up to sixteen cores
- Industrial grading options (Intel® TCC, TSN, IBECC, ind. Temp., 24/7)
- Integrated AI accelarator (NPU)
- Up to 96GB LPDDR5x SDRAM, IBECC
- Intel® Iris® Xe graphics, up to 12 Xe cores
- Three DisplayPort/HDMI interfaces
- LVDS and Embedded DisplayPort interface
- Four independent display streams
- Up to eighteen PCI Express® Gen 4 lanes and up to to two PCI Express® Gen 3 lanes
- Up to two USB4, up to four USB 3 and eight USB 2.0 ports
- Two UARTs
- Up to two SATA 6Gb/s mass storage interfaces
- 1 Gb / 2.5 Gb Ethernet port (Intel® i226)
- Trusted Platform Module TPM 2.0
- Long-term product availability
The TRIA C6C-PLH COM Express module features the Intel® Core™ Ultra Series 3 processors, providing developers with a powerful workhorse to boost their target applications. The module is ideal for challenging tasks in robotics, industrial automation, transportation, medical equipment, process control and HMI terminals that require uncompromised performance. The architecture scales up to sixteen cores at 15 to 65W thermal design power (TDP). Together with the integrated AI accelerator (NPU) and up to 12 Xe GPU Cores, the processor greatly boosts AI projects and compute intense duties. The board is ideal for mission critical applications supporting industrial temperature range, 24/7 continuous operation, memory down with in-band ECC protection and optional conformal coating.
For highest data throughput the module enables fastest energy efficient LPDDR5x memory technology with up to 96GB capacity. Up to eighteen PCIe Gen 4 lanes and up to two PCIe Gen 3 lanes allow for accessing external accelerators, storage, and I/O at high bandwidth. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller.
System investments are well protected through long-term availability of the module, designed, and manufactured by Tria Technologies. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Specifications
| Technology | x86 |
| Form Factor | COM Express Compact |
| CPU | Intel® Core™ Ultra Series 3 processors: Intel® Core™ Ultra X9 processor 388H 16 Cores, 2.1 GHZ, 12Xe, vPRO®, 25W BP, 12 PCIe Intel® Core™ Ultra X9 processor 378H 16 Cores, 2.1 GHZ, 12Xe, 25W BP, 12 PCIe Intel® Core™ Ultra 9 processor 386H 16 Cores, 2.1 GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe Intel® Core™ Ultra X7 processor 368H 16 Cores, 2.0 GHZ, 12Xe, vPRO®, 25W BP, 12 PCIe Intel® Core™ Ultra 7 processor 366H 16 Cores, 2.0 GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe Intel® Core™ Ultra 7 processor 365 8 Cores, 2.4 GHZ, 4Xe, vPRO®, 25W BP, 12 PCIe Intel® Core™ Ultra X7 processor 358H 16 Cores, 1.9 GHZ, 12Xe, 25W BP, 12 PCIe Intel® Core™ Ultra 7 processor 356H 16 Cores, 1.9 GHZ, 4Xe, 25W BP, 20 PCIe Intel® Core™ Ultra 7 processor 355 8 Cores, 2.3 GHZ, 4Xe, 25W BP, 12 PCIe Intel® Core™ Ultra 5 processor 338H 12 Cores, 1.9 GHZ, 10Xe, vPRO®, 25W BP, 12 PCIe Intel® Core™ Ultra 5 processor 336H 12 Cores, 1.9 GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe Intel® Core™ Ultra 5 processor 335 8 Cores, 2.2 GHZ, 4Xe, vPRO®, 25W BP, 12 PCIe Intel® Core™ Ultra 5 processor 325 8 Cores, 2.1 GHZ, 4Xe, 25W BP, 12 PCIe Intel® Core™ Ultra 5 processor 332 6 Cores, 2.5 GHZ, 2Xe, vPRO®, 25W BP, 12 PCIe Intel® Core™ Ultra 5 processor 322 6 Cores, 2.5 GHZ, 2Xe, 25W BP, 12 PCIe Intel® Core™ Ultra X7 processor 358HR 16 Cores, x.x GHZ, 12Xe, vPRO®, 25W BP, 12 PCIe Intel® Core™ Ultra 7 processor 366HRE 16 Cores, x.x GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe, ind. T. Intel® Core™ Ultra 7 processor 365RE 8 Cores, x.x GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe, ind. T. Intel® Core™ Ultra 5 processor 336HRE 12 Cores, x.x GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe, ind. T. Intel® Core™ Ultra 5 processor 335RE 8 Cores, x.x GHZ, 4Xe, vPRO®, 25W BP, 20 PCIe, ind. T. Note: P core base frequency at processor base power (25W BP) shown, other clock frequencies at different power levels supported |
| Chipset | Integrated into SoC |
| RAM | LPDDR5 memory, up to 9600 MT/s memory-down Capacity options: 16GB, 32GB, 64GB, 96GB Inband ECC (IBECC) option (OS dependent) |
| Storage Interfaces | 2x SATA channels (up to 6Gb/s), optional |
| USB | Up to 2x USB4 Gen 2, shared with COMe DDI1, DDI2 Up to 4x USB 3 8x USB 2.0 Note: capabilities depending on carrier design |
| Serial Interfaces | 2x high-speed serial ports |
| Bus Interfaces | PCI Express® Gen 4, 1x8 or 2x4 lanes on COMe PCIe[20:27], optional1 PCI Express® Gen 4, 1x4 on COMe PCIe[16:19] PCI Express® Gen 4, 6 lanes, flexible bifurcation options on COMe PCIe[0:5] PCI Express® Gen 3, 2 lanes, COMe PCIe[6:7], optional 1 Available on select processor variants |
| Display Controller | Intel® Iris® Xe graphics, up to 12 Xe cores H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode |
| Display Interfaces | Four independent display streams 2x USB4/USB-C ports (DP Tunneling, DP Alt Mode) on DDI 1, 2 3x Digital Display Interface (DP 2.1, HDMI 2.1) on DDI 1, 2, 3 1x Embedded DisplayPort 1.5 (mutually exclusive with LVDS) 1x LVDS 24bit, dual-channel (mutually exclusive with eDP) |
| Network Interface | 10/100/1000Base-TX, 2.5G2 based on Intel i226, TSN support 2 Available bandwidths depending on carrier design I-Temp variants: Intel® i226-IT C-Temp variants: Intel® i226-LM |
| Audio Interface | High Definition Audio |
| Security Device | TPM 2.0 |
| Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
| Feature Highlights | COM Express Type 6 pin-out |
| Firmware | UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring Tria Adv. Boot Device Selection: Boot device priority setting based on physical interfaces |
| OS Support | Windows 11 IoT Enterprise LTSC 2024 BSP for Linux (Yocto) |
| Power Requirement | Voltage: +8.5V to +20V, +5V Stby optional Power Consumption: tbd W to tbd W (typ., variant dependent) |
| Environment | Ambient Temperature: 0° ... 60°C (operating) -25° ... 85°C (storage) Industrial temperature variants: -40 ... +85°C (operating) Humidity: 5 ... 95% (operating, non-condensing), 5 ... 95% (storage, non-condensing) |
| Dimensions | 95mm x 95mm |
| Certificates | UL / CE |
Accessories
Carrier Options
| Order No. | Description | Reference |
| 111650 | COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, M.2, SD card socket, SATA, DisplayPort, LVDS, eDP, VGA, HD audio interfaces; ATX power connector. Dimensions 305 x 244 mm (ATX form factor) | MSC C6-MB-EV4 PCBFTX |
| 119830 | COM Express Type 6 Evaluation Carrier Board with PCI Express x4 and x16 slots, USB 3.0/2.0, USB4 Type-C, GbE, M.2, SATA, DisplayPort, LVDS, eDP; ATX power connector. Dimensions 170 x 170 mm (Mini-ITX form factor) | MSC C6-MB-EV4M BRDFTX |
Cooling Options
| Order No. | Description | Reference |
| tbd | Passive Heatsink for C6C-PLH consisting of a single-piece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to major devices. | MSC C6C-PLH-01 HSI-001 |
| tbd | Passive Heatsink / heat pipe for C6C-PLH consisting of a single-piece aluminum profile with fins and embedded heatpipe, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to major devices. | MSC C6C-PLH-01 HSI-HPI-001 |
| tbd | Heatspreader for C6C-PLH. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to major devices. | MSC C6C-PLH-01 HSP-001 |
| tbd | Heatspreader / heat pipe for C6C-PLH. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to major devices. | MSC C6C-PLH-01 HP-001 |
| tbd | Heatspreader for C6C-PLH. Single-piece aluminum profile, standoffs with M2.5 thread, screws and thermopads for the thermal contact to major devices. | MSC C6C-PLH-02 HSP-001 |
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