TRIA Q7-ASL
Intel ModuleThe new TRIA Q7-ASL module features the Intel Atom® processors x7000RE/C Series (codenamed “Amston Lake”). The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment. The board is ideal for system products that are exposed to harsh ambient conditions. It is designed for extended temperature range and 24/7 continuous operation.
The new TRIA Q7-ASL offers triple independent display support with a maximum of 4k resolution, fast LPDDR5 memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient Q7 2.1 module.
Different SOCs with dual-, quad- and eight-core processors are supported by this design. In addition to an extensive set of interfaces and features, the TRIA Q7-ASL offers 1 Gigabit Ethernet based on Intel® i226 and supports up to 2.5GbE bandwidth.
For evaluation and design-in of the TRIA Q7-ASL module, Tria Technologies provides a suitable Q7 2.1 development platform. A complete, ready-to-run Starterkit is also available.
Highlights
- Up to eight processing cores
- Power efficient processors, TDP 6 to 12W
- Integrated Intel UHD Gen.12 graphics, max. 32 executing units .
- Up to 16GB LPDDR5 SDRAM, In-band ECC
- Up to 256GB eMMC 5.1 Flash (optional)
- 2x SATA-III interface (6Gbps)
- 1x DP++
- LVDS / Embedded DisplayPort
- Up to 4x PCI Express x1/x2/x4 Gen. 3
- 2x USB 3.1 Host interfaces
- 8x USB 2.0 Host interfaces
- 1x 1/2,5 Gigabit Ethernet (Intel® i226)
- 1x SGMII Interface on SATA-Port1 (optional)
- UART, SPI, I2C, SMBus.
- HD Audio
- Trusted Platform Module TPM 2.0
- Qseven 2.1 compliant
- UEFI Firmware
Order Info
| Order No. | Description | Reference | Status |
| 118187 | Qseven 2.1 module with Intel Atom x7835RE, Octa-Core (1.3GHz), 12W, TCC, 16GB LPDDR5 (4800 MT/s), 32EU, 64GB eMMC, 2x SATA, 1x 2.5GbE LAN, 2x USB 3.2, 6x USB 2.0 (1x Host/Device), TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40°C...+85°C(Engineering Sample - get in touch with your sales representative) | MSC Q7-ASL-X7835RE-46N0111I ES PCBES | OR |
| 118188 | Qseven 2.1 module with Intel Atom x7433RE, Quad-Core (1.5GHz), 9W, TCC, 16GB LPDDR5 (4800 MT/s), 32EU, 64GB eMMC, 2x SATA, 1x 2.5GbE LAN, 2x USB 3.2, 6x USB 2.0 (1x Host/Device), TPM 2.0, eDP, IUC (Industrial use conditions), industrial temperature -40°C...+85°C(Engineering Sample - get in touch with your sales representative) | MSC Q7-ASL-X7433RE-46N0111I ES PCBES | OR |
| 118189 | Qseven 2.1 module with Intel Atom x7433RE, Quad-Core (1.5GHz), 9W, TCC, 8GB LPDDR5 (4800 MT/s), 32EU, 16GB eMMC, 1x SATA, SGMII on SATA0, 1x 2.5GbE LAN, 2x USB 3.2, 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrial temperature -40°C...+85°C(Engineering Sample - get in touch with your sales representative) | MSC Q7-ASL-X7433RE-34N0291I ES PCBES | OR |
Accessories
Carrier Options
| Order No. | Description | Reference |
| 67690 | Qseven Rev. 2.0 compatible embedded platform (148 x 102mm), 10-28V input voltage, 1x RS232 on DB9 connector, 1x RS485 on pin header, 1x RS232 no handshake on pin header, dual RJ45 LAN connector with LED, 1x SATA, 1x mSATA slot, SD card holder, 1x USB 3.0 connector, 2x USB 2.0 connector, 1x USB 2.0 on pin row, 1x microUSB 2.0 OTG, CAN, I2C, LPC/ GPIO on pin header, I2C/SMBus, SPI, DisplayPort connector, LVDS/eDP on JILI30 connector, regulated backlight supply, mini PCI Express slot, HD Audio, CMOS battery. Commercial temperature range 0..+70°C | MSC Q7-MB- EP6-601 PCBFTX |
Cooling Options
| Order No. | Description | Reference |
| 118185 | Passive Heatsink for Q7-ALN and Q7-ASL variants, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC Q7-ASL-01 HSI-001 |
| 118186 | Heatspreader for Q7-ALN and Q7-ASL variants, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC Q7-ASL-01 HSP-001 |
| 1053769 | Heat rail for Q7 baseboards. Recommended for conductive heat transfer from the Q7 module to the Q7 baseboard. Already assembled on all MSC baseboards. | MSC Q7-XXX-01 HTR-001 |
Support
As registered customer you can directly create a ticket in our Support Center (Ticket) and visit our Technical Documentation Center (TechDoC)
Mechanical data
TRIA Q7-XXX-01 HTR-001
TRIA Q7-ASL-01 HSP-001
TRIA Q7-ASL-01 HSI-001
TRIA_Q7_ALN_ASL-3D
App_Note_052_Mechanical_documentation_guide1v0
Related Products
-
Modules
TRIA Q7-ALN
Read moreThe new TRIA Q7-ALN module features the Intel Atom® processors x7000E Intel® Core™ i3 processor Intel® Processors N Series (codenamed “Alderlake Lake …
-
Modules
TRIA Q7-BT
Add to basketThe TRIA Q7-BT module is based on the Qseven Rev. 2.0 and using Intel’s multi-core System-On-Chip (SOC) Atom generation that integrates next generatio…
-
Modules
TRIA Q7-BW
Add to basketThe TRIA Q7-BW module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation (“Braswell”) that integrates next generation Intel processor…
-
Modules
TRIA Q7-EL
Add to basketThe TRIA Q7-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”).
