TRIA SM2S-IQ615
The TRIA SM2S-IQ615 module family is powered by the Dragonwing IQ-615 Processor from Qualcomm.
The processors integrates 8 ARM Cores (2x A76 + 6xA55 Arm Cortex cores) and a powerfull Adreno 612 GPU, bringing performance and energy efficiency to Linux-based edge applications. The Hexagon™ V66 DSP with Dual hexagon Vector, enabling developers to create more capable, cost-effective and energy-efficient machine learning (ML) applications. The IQ-615 processors deliver advanced security with Secure boot, secure debug, TrustZone, Qualcomm® Trusted Execution Environment and hardware supported KeyStore.
TRIA SM2S-IQ615 provides fast and low power LPDDR4 memory technology, combined with up to 256GB eMMC Flash memory. An extensive set of interfaces for embedded applications are available, such as Dual Gigabit Ethernet, PCI Express Gen. 2, USB 2.0/3.1, DP v1.4, MIPI-DSI, LVDS, and up to 3x MIPI CSI-2 for connecting cameras.
The module is compliant with the SMARC 2.2 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-IQ615 module,
Tria Technologies provides a development platform and a starter kit. A Yocto based Linux Board Support Package is available.
Highlights
- Octal Core CPU powered by the Dragonwing IQ-615 Processor from Qualcomm
- Dual core Arm Cortex-A76 up to 1.9GHz
- And hexa core Arm Cortex-A55 up to 1.6GHz
- Adreno 612 GPU
- Hexagon™ V66 DSP with Dual hexagon Vector (1.1 TOPs)
- Spectra™ 230 image processing engine (ISP)
- Adreno 443 VPU Video Decode/Encode 4k60(D)/1k60/(E)
- Up to 8GB LPDDR4x SDRAM 3110MT/s
- Up to 256GB eMMC Flash, up to 256GB UFS Flash (option)
- Up to 5x USB 2.0, 2x USB 3.1, 1x SDIO
- Up to 2x PCIe Gen2 (2x 1 Lane)
- MIPI-DSI or dual channel LVDS
- 1x DP v.1.4 (up to 4 Displays)
- 3x MIPI-CSI
- Up to Dual Gigabit Ethernet, 1x SGMII
- 4x UART, 1x SPI, 1x QSPI/SPI, 5x I2C, 2x I2S Audio
- 2x CAN-FD (optional), 1x TPM 2.0 (optional)
- Yocto Linux, Ubuntu (on request)
- Optimized design for low cost and low power applications
Specifications
Technology | ARM |
Form Factor | SMARC™ 2.2 Short Size |
CPU | Octal Core CPU powered by the Dragonwing IQ-615 Processor from Qualcomm
Hexagon™ V66 DSP with Dual hexagon Vector (1.1 TOPs) |
Chipset | SOC |
RAM | Up to 8GB LPDDR4x SDRAM 3110MT/s, soldered |
Flash | Up to 256GB eMMC Flash and up to 256GB UFS Flash (option) |
Storage Interfaces | 1x SDIO |
USB | Up to 5x USB 2.0 Host interfaces (1x Host/Client) Up to 2x USB 3.1 Host interfaces |
Serial Interfaces | 2x UART with 2-wire hand shake 2x UART w/o hand shake |
Bus Interfaces | Up to 2x PCI-Express x1 Gen. 2 (2x 1 Lane) 6x I²C (1x general purpose, 3x CAM, 1x LCD, 1x PM) 1x SPI, 1x QSPI/SPI Bus 2x CAN-FD / 2.0B (optional) |
Display Controller | Adreno 612 GPU Spectra™ 230 image processing engine (ISP) Adreno 443 VPU Video Decode/Encode 4k60(D)/1k60/(E) |
Display Interfaces | MIPI-DSI Display Interface, 4 lanes, up to 1920x1200 @ 60fps or dual-channel LVDS interface, 18 or 24 bit (up to 1920x1080) DP 1.4 (up to 4 Displays) |
Network Interface | up to 2x 10/100/1000Base-T , 1x SGMII |
Audio Interface | 2x I2S Audio |
Security Device | Trusted Platform Module (TPM) 2.0 (optional) Secure boot, secure debug, TrustZone, Qualcomm® Trusted Execution Environment, hardware supported KeyStore, HDCP v1.4 and 2.2 for DisplayPort, secure I²C and secure SPI, AVB2.0 Crypto engines: Crypto engine v5 (CE5), DRBG/PRNG (FIPS-compliant), inline crypto engine (FIPScompliant), ICE (In-line-crypto-engine) based disk encryption, PRNG with TRNG seed TrustZone services: Secure file system, secure display, and eFuse read/write, RPMB, Crypto lib |
Miscellaneous | Watchdog Timer for system reset (programmable, 1s … 600s) RTC (optional: temperature compensated) 14x GPIO, configurable as input or output 64kbit ID EEPROM on I2C bus MIPI CSI-2 v1.3 camera interface, CSI0, 2 lane MIPI CSI-2 v1.3 camera interface, CSI1, 4 lane MIPI CSI-2 v1.3 camera interface, CSI2, 4-lane (optional) |
Feature Highlights | SMARC™ 2.2 compliant |
OS Support | Yocto Linux Board Support Package Ubuntu Linux (on request) |
Power Requirement | Power Supply +5V +/-5%, 5V Standby Power Consumption 4-8W typ. (tbd: depending on CPU, CPU load and onboard features) |
Environment | Temperature Range: Commercial: 0° … 70°C (operating) -20° … 85°C (storage) Extended: -25° … 85°C (operating) -40° … 85°C (storage) Industrial: -40° … 85°C (operating) -40° … 85°C (storage) Humidity: 5 … 95% (operating, non condensing) 5 … 95% (storage, non-condensing) |
Dimensions | 82 x 50 mm |
Certificates | UL / CE |
Cooling | Heatspreader / Heatsink |
Carrier | TRIA SM2-MB-EP1 TRIA SM2-MB-EP5-012 |
Order Info
Order No. | Description | Reference | Status |
117005 | SMARC 2.2 module based on Qualcomm IQ-615 2x A76 at 1.9GHz + 6x A55 at 1,6GHz, 3W CPU TDP, 8GB LPDDR4, 32GB eMMC, 2x GbE LAN, 1x SGMII, 2x PCIe, USB-Hub, 2x CAN-FD, LVDS, DP, MIPI-CSI2, TPM 2.0, 1x QSPI, 1x SPI, industrial temperature -40°... +85°C (Engineering Sample - get in touch with your sales representative) | MSC SM2S-IQ615- OC-35N0661I ES PCBES | OR |
117006 | SMARC 2.2 module based on Qualcomm IQ-615 2x A76 at 1.9GHz + 6x A55 at 1,6GHz, 3W CPU TDP, 2GB LPDDR4, 4GB eMMC, 1x GbE LAN, no SGMII, 1x PCIe, no USB-Hub, no CAN-FD, DSI, DP, no MIPI-CSI2, no TPM 2.0, 2x SPI, industrial temperature -40°... +85°C (Engineering Sample - get in touch with your sales representative) | MSC SM2S-IQ615- OC-12N0C10I ES PCBES | OR |
117007 | SMARC 2.2 module based on Qualcomm IQ-615 2x A76 at 1.9GHz + 6x A55 at 1,6GHz, 3W CPU TDP, 4GB LPDDR4, 16GB eMMC, 2x GbE LAN, 1x SGMII, 2x PCIe, USB-Hub, 2x CAN-FD, LVDS, DP, no MIPI-CSI2, 1x QSPI, 1x SPI, no TPM 2.0, industrial temperature -40°... +85°C (Engineering Sample - get in touch with your sales representative) | MSC SM2S-IQ615- OC-24N0650I ES PCBES | OR |
Accessories
Carrier Options
Order No. | Description | Reference |
68488 | SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°C | MSC SM2-MB-EP1-001 PCBFTX |
115138 | SMARC 2.1 compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 2x CAN, dual RJ45 LAN with LED (from module), 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 3.0/DisplayPort Type C , 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x µUSB 2.0 Host/Device, 2x SPI, I²C, 12 GPIO on FC, 1x DisplayPort++ , LVDS/eDP/DSI on JILI30 connector, µSD Card Slot, regulated backlight supply, I2S Audio with amplifier, system fan connector, camera connector, RTC battery. Industrial temperature range -40..+85°C | MSC SM2S-MB-EP5-012 PCBFTX |
Cooling Options
Order No. | Description | Reference |
117998 | Heatspreader for SM2S-IQ615 module, consisting of a single-piece aluminum plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC SM2S-IQ615-01 HSP-001 |
117997 | Passive Heatsink for SM2S-IQ615 module, consisting of a single-piece aluminum pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC SM2S-IQ615-01 HSI-001 |
117996 | Passive Heatsink for SM2S-IQ615 module, consisting of a single-piece aluminum pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs (Engineering Sample - get in touch with your sales representative) | MSC SM2S-IQ615-01 HSI-001 ES |
Starter Kits
Order No. | Description | Reference |
tbd | Starter Kit for SMARC Short Size modules for Qualcomm IQ615 processor. Includes TRIA SM2- MB-EP1 Mini-ITX Baseboard, Heatsink, Heatspreader and Power Supply with cable kit. The StarterKit does not include the SMARC module. Please order your choice of TRIA SM2S-IQ615 module separately. | MSC SM2-SK-IQ615- EP1-KIT001 BRDFTX |
Modules (COM / SOM) > SMARC > Module > TRIA SM2S-IQ615
Talk to the experts!
Let us know about your product or your challenge and our team will get in touch to discuss how we can help.