TRIA SM2S-QCS6490 | Compute Module by Tria
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TRIA SM2S-QCS6490

SMARC
Yocto
Android
Windows
SGET

The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm® QCS6490 processor, a 6nm processor with high performance and best in class power to performance ratio. QCS6490 integrates Qualcomm® Kryo™ 670 CPU which contains up to eight cores: four Arm® Cortex®-A78 cores, four Arm® Cortex®-A55 cores, Qualcomm® Adreno™ 643 GPU, Qualcomm® Adreno™ 633 VPU and the latest re-engineered Qualcomm® Hexagon™ processor. The GPU supports video encode/ decode at up to 4K30/4K60 and many different display connictities (LVDS, MIPI-DSI, eDP/DP). It delivers powerful edge AI for high-performance with upto 12 TOPS at low power and massive camera support with 4 MIPI-CSI inputs.

This solution delivers powerful performance and is purpose-built for industrial and commercial IoT applications such as ruggedized handhelds and tablets, kiosks, industrial scanners, dash cameras, point-of-sale systems and human machine interface systems.

The module is compliant with the latest SMARC 2.1.1 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-QCS6490 module, Tria provides a development platform and a starter kit. Support for Linux is available (Android support available on request).

Highlights

  • Quad core Arm Cortex-A78 up to 2.7GHz
  • And Quad core Arm Cortex-A55 @ 1.95GHz
  • Adreno 643 GPU @ 812MHz
  • AI DSP/NSP Dual HVX, 4K HMX up to 12(15) TOPs
  • Up to 16GB LPDDR5 SDRAM 6400MT/s
  • Up to 1TB UFS Flash
  • Display up to FHD+144Hz
  • Video up to 4k30(E)/4K60(D)
  • 5xUSB 2.0, 2x USB 3.1
  • 2x PCIe Gen3 x1, 1x PCIe Gen3 x2
  • 1x MIPI-DSI or LVDS
  • 1x DP 1.4 (2 lane) + 1x eDP/DP
  • 4x MIPI-CSI Camera Interface
  • WLAN/BT Wireless Module (option)
  • 2x Gigabit Ethernet
  • 2x I2S Audio Interface
  • 4x UART, 2x SPI, 2x CAN2.0-FD, 5x I²C
  • HW Key manager and ECC, Secure boot, Crypto engines, etc.
  • Windows 11 IOT, Yocto Linux and Android (Ubuntu Linux on request)

Specifications

TechnologyArm
Form FactorSMARCâ„¢ 2.2 Short Size
CPUQCS6490:
1x A78@2.7GHz, 3x A78@2.4GHz, 4xA55@1.95GHz
2xHVX,4K-HMX 1.45GHz
(12.15 INT8 TOPS)
ChipsetSOC
RAMUp to 16GB LPDDR5 SDRAM, up to 6400MT/s, soldered
FlashUp to 1TB UFS, soldered (optional)
Storage InterfacesUFS (onboard)
NVME (carrier)
SD-Card (carrier)
USB2x USB 3.1 Host interfaces
5x USB 2.0 Host interfaces
Serial Interfaces4x UART (two with handshake)
Bus InterfacesUp to 4x PCI-Express x1 Gen. 3 lanes
5x I2C (1x general, 2x CAM, 1x LCD, 1x PM)
2x SPI Bus
1x SDIO
2x CAN2.0-FD
Display ControllerAdreno 643 GPU @ up to 812MHz
Display InterfacesMIPI-DSI 4 - lane
FHD+ @144Hz
LVDS (optional instead of MIPI-DSI)
1920x1200 WUXGA 60Hz
DP 1.4 (2 lane)
4K30 (4K60 compression to 16bpp)
eDP/DP (4 lane)
1920x1080p60
Network Interface2x 10/100/1000Base-T
Audio Interface2x I2S Audio
Security DeviceInfineon Trusted Platform Module 2.0
HW Key manager and ECC, Secure boot, Crypto engines, Key provisioning security, Qualcomm®
Trusted Execution Environment (TEE), Qualcomm Content Protection (Widevine), Secure camera/UI
MiscellaneousMIPI CSI-2 camera interface on SMARC interface:
1x 2 lane, 1x 4 lane
MIPI CSI-2 camera interface on CSI Connector:
2x 4 lane
Watchdog Timer:
Initiates system reset, (programmable, 1s ... 255h)
Fan Supply:
PWM Speed Control for system fan on carrier board
RTC battery:
external
System Monitoring:
Voltage, Temperature, CPU Fan, System Fan
EEPROM:
64kbit ID EEPROM on I2C bus
GPIO:
14x GPIO, configurable as input or output, 13x interrupt capable
Feature HighlightsSMARCTM 2.2 compliant
FirmwareUEFI boot
OS SupportWindows 11 IoT
Yocto Linux
Android
Ubuntu Linux (on request)
Power RequirementPower Supply +5V +/-5%, 5V Standby
Power Consumption 7W typ. (tbd: depending on CPU, CPU load and onboard features)
EnvironmentTemperature Range:
Commercial: 0° ... 70°C (operating) -20° ... 85°C (storage)
Extended: -30° ... 85°C (operating) -40° ... 85°C (storage)
Humidity:
5 ... 95% (operating, non-condensing)
5 ... 95% (storage, non-condensing)
Dimensions82 x 50 mm
CertificatesUL / CE
CoolingHeatspreader
CarrierTRIA SM2-MB-EP1
TRIA SM2-MB-EP5-012

Order Info

Order No.DescriptionReferenceStatus
117779SMARC 2.2 module with Qualcomm QCS6490 4x A78
@2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics:
Adreno A643@812MHz, NPU: 12 TOPs, 8GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI
interfaces, 2x MIPI CSI on SMARC and 2x onboard,
Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3
x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/
BT, TPM 2.0, 2x CAN FD, Extended Temperature -25°...
+85°C
MSC SM2S-QCS6490-
FPF-36N08F1E PCBFTX
PV
117749SMARC 2.2 module with Qualcomm QCS5430 2x A78
@2.1GHz + 4x A55 @1,8GHz, 3W CPU TDP, Graphics:
Adreno A642L@315Mhz, NPU: 3.5 TOPs, 4GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS
interfaces, 2x MIPI CSI on SMARC and 2x onboard,
Ethernet: 2x 1Gbit, 32GB UFS memory, PCIe: 2x PCIe Gen3
x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/
BT, TPM 2.0, 2x CAN FD, Extended Temperature -25°...
+85°C
MSC SM2S-QCS5430-
FP1-25N02F1E PCBFTX
PV
117777SMARC 2.2 module with Qualcomm QCS6490 4x A78
@2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics:
Adreno A643@812MHz, NPU: 12 TOPs, 8GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS
interfaces, 2x MIPI CSI on SMARC and 2x onboard,
Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3
x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, WLAN/
BT, TPM 2.0, 2x CAN FD, Extended Temperature -25°...
+85°C
MSC SM2S-QCS6490-
FPF-36N02F1E PCBFTX
PV
117775SMARC 2.2 module with Qualcomm QCS6490 4x A78
@2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics:
Adreno A643@812MHz, NPU: 12 TOPs, 4GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS
interfaces, 2x MIPI CSI on SMARC and 2x onboard,
Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3
x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, no
WLAN/BT, TPM 2.0, 2x CAN FD, Extended Temperature
-25°... +85°C
MSC SM2S-QCS6490-
FPF-26N0271E PCBFTX
PV
117751SMARC 2.2 module with Qualcomm QCS5430 2x A78
@2.1GHz + 4x A55 @1,8GHz, 3W CPU TDP, Graphics:
Adreno A642L@315Mhz, NPU: 3.5 TOPs, 4GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS
interfaces, 2x MIPI CSI on SMARC and 2x onboard,
Ethernet: 2x 1Gbit, 32GB UFS memory, PCIe: 2x PCIe Gen3
x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, no
WLAN/BT, TPM 2.0, 2x CAN FD, Extended Temperature
-25°... +85°C
MSC SM2S-QCS5430-
FP1-25N0271E PCBFTX
PV
117783SMARC 2.2 module with Qualcomm QCS6490 4x A78
@2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics:
Adreno A643@812MHz, NPU: 12 TOPs, 16GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI
interfaces, 2x MIPI CSI on SMARC and 2x onboard,
Ethernet: 2x 1Gbit, 128GB UFS memory, PCIe: 2x PCIe
Gen3 x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1,
no WLAN/BT, TPM 2.0, 2x CAN FD, Extended Temperature
-25°... +85°C
MSC SM2S-QCS6490-
FPF-47N0871E PCBFTX
PV
117747SMARC 2.2 module with Qualcomm QCS5430 2x A78
@2.1GHz + 4x A55 @1,8GHz, 3W CPU TDP, Graphics:
Adreno A642L@315Mhz, NPU: 3.5 TOPs, 2GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI
interfaces, 2x MIPI CSI on SMARC and 0x onboard,
Ethernet: 0x 1Gbit, 32GB UFS memory, PCIe: 1x PCIe Gen3
x1 + 0x PCIe Gen3 x2, USB: 2x USB 2.0 + 0x USB 3.1, no
WLAN/BT, TPM 2.0, 0x CAN FD, Extended Temperature
-25°... +85°C
MSC SM2S-QCS5430-
FP1-15N0821E PCBFTX
OR
122445SMARC 2.2 module with Qualcomm QCS6490 4x A78
@2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics:
Adreno A643@812MHz, NPU: 12 TOPs, 4GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI
interfaces, 2x MIPI CSI on SMARC and 0x onboard,
Ethernet: 0x 1Gbit, 32GB UFS memory, PCIe: 1x PCIe Gen3
x1 + 0x PCIe Gen3 x2, USB: 2x USB 2.0 + 0x USB 3.1, no
WLAN/BT, TPM 2.0, 0x CAN FD, Extended Temperature
-25°... +85°C
MSC SM2S-QCS6490-
FPF-25N0821E PCBFTX
OR
117781SMARC 2.2 module with Qualcomm QCS6490 4x A78
@2.4/2.7GHz + 4x A55 @1,9GHz, 5W CPU TDP, Graphics:
Adreno A643@812MHz, NPU: 12 TOPs, 8GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and MIPI DSI
interfaces, 2x MIPI CSI on SMARC and 2x onboard,
Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3
x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, no
WLAN/BT, TPM 2.0, 2x CAN FD, Extended Temperature
-25°... +85°C
MSC SM2S-QCS6490-
FPF-36N0871E PCBFTX
PV
119090SMARC 2.2 module with Qualcomm QCS5430 2x A78
@2.1GHz + 4x A55 @1,8GHz, 3W CPU TDP, Graphics:
Adreno A642L@315Mhz, NPU: 3.5 TOPs, 8GB LPDDR5
SDRAM 6400MT/s, DP 1.4 (2 lane), eDP/DP and LVDS
interfaces, 2x MIPI CSI on SMARC and 2x onboard,
Ethernet: 2x 1Gbit, 64GB UFS memory, PCIe: 2x PCIe Gen3
x1 + 1x PCIe Gen3 x2, USB: 5x USB 2.0 + 2x USB 3.1, no
WLAN/BT, TPM 2.0, 2x CAN FD, Extended Temperature
-25°... +85°C
MSC SM2S-QCS5430-
FP1-36N0271E PCBFTX
PV

Accessories

Carrier Options

Order No.DescriptionReference
68488SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USBMSC SM2-MB-EP1-001
2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPortPCBFTX
and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2
camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery,
Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack,
commercial temperature range 0..+70°C
115138SMARC 2.1 compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232,MSC SM2S-MB-EP5-012
2x CAN, dual RJ45 LAN with LED (from module), 1x M.2 2280 Key M slot, mPCIe slot, 1xPCBFTX
USB 3.0 Type A, 1x USB 3.0/DisplayPort Type C , 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x
μUSB 2.0 Host/Device, 2x SPI, I2C, 12 GPIO on FC, 1x DisplayPort++ , LVDS/eDP/DSI on
JILI30 connector, μSD Card Slot, regulated backlight supply, I2S Audio with amplifier,
system fan connector, camera connector, RTC battery. Industrial temperature range
-40..+85°C
OrderDescriptionReference
No.

Cooling Options

Order No.DescriptionReference
Order No.DescriptionNomenclature
116667Passive Heatsink for all SM2S-QCS6490 and SM2S-QCS5430 modules, consisting of aMSC SM2S-QCS-01
single-piece aluminum pin cooler and thermal pad for contact to the processor, withHSI-001
2.7mm through-hole standoffs
116668Heatspreader for all SM2S-QCS6490 and SM2S-QCS5430 modules, consisting of a single-MSC SM2S-QCS-01
piece aluminum plane and thermal pad for contact to the processor, with 2.7mm through-HSP-001
hole standoffs

Starter Kits

Order No.DescriptionReference
114394Starter Kit for SMARC Short Size modules for Qualcomm QCS6490 / QCS5430 processor.MSC SM2-SK-
Includes TRIA SM2-MB-EP1 Mini-ITX Baseboard, Heatsink and Power Supply with cable kit. TheQCS6490-EP1-KIT001
StarterKit does not include the SMARC module. Please order your choice of TRIA SM2S-BRDFTX
QCS6490 or SM2S-QCS5430 module separately.
117702QCS6490 Vision-AI Development Kit for Qualcomm QCS6490 / QCS5430 processor. IncludesMSC SM2-SK-
TRIA SM2S-QCS6490 module, Heatsink, TRIA SM2-MB-EP6 Mini Baseboard, Camera, PowerQCS6490-EP6-KIT001
Supply and USB-C cable. Example Software for Yocto Linux and Linux BSP will be provided byBRDFTX
TRIA.

Support

As registered customer you can directly create a ticket in our Support Center (Ticket) and visit our Technical Documentation Center (TechDoC)

Manual

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TRIA SM2S-QCS6490/QCS5430 User Manual

Last update: September 11, 2025

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MSC SM2-SK-QCS6490-EP1-KIT001 Startup Guide

Last update: August 11, 2025

Application Notes

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TRIA SM2S-QCS5430/QCS6490 Application Notes

Last update: August 18, 2026

Mechanical data

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MSC_SM2S-QCS6490__SM2S_QCS5430-01_HSP-001_3D

Last update: August 22, 2025

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MSC_SM2S-QCS6490_SM2S_QCS5430-01_HSI-001_3D

Last update: August 11, 2025

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MSC_SM2S_QCS6490__SM2S_QCS5430_3D

Last update: June 10, 2025

Demo images

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msc-image-base-sm2s-qcs6490_scarthgap_13042026

Last update: April 14, 2026

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msc-image-weston-sm2s-qcs6490_scarthgap_13042026

Last update: April 14, 2026

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Download Datasheet

Click the link below to download TRIA SM2S-QCS6490 datasheet.

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