Tria’s latest compute modules powered by Qualcomm now support Windows, Android, and Linux—enabling scalable, low-power embedded systems with edge AI and multi-OS flexibility.
Tria launches the C6C-RYZ8 COM Express Compact Type 6 module at Embedded World 2025. Powered by AMD Ryzenâ„¢ Embedded 8000 Series with integrated AI acceleration, the module brings scalable x86 performance to compact embedded systems.
Tria rocks Embedded World debut with launch of COM Express Compact Type 6 module​ Read More »
Tria introduces its first COM-HPC Mini form factor module—HMM-RLP—powered by 13th Gen Intel® Core™ processors. Designed for edge compute performance in space-constrained systems, the module debuts at Embedded World 2025.
At Embedded World 2025, Tria Technologies will launch five new embedded module families powered by Qualcomm Dragonwing™ and Snapdragon® platforms. Designed for edge AI, low power, and industrial performance, these modules enable next-generation IoT and embedded applications.
Tria to launch five new product families powered by Qualcomm at Embedded World Read More »
Tria Technologiesâ„¢, an Avnet company specialising in embedded compute boards, is making its Embedded World debut in Hall 3A Booth 225.
Tria debuts at Embedded World 2025 with new product launches ​ Read More »
Triaâ„¢, an Avnet company specialising in embedded compute boards, welcomes two senior appointments to strengthen its operations and grow key accounts worldwide.
Tria Technologies Announces Two Senior Management Appointments ​ Read More »
Tria Technologies introduces the MSC C6-MB-EV4, a new COM Express Type 6 carrier board that streamlines prototyping, evaluation, and system design.
Tria Technologies Launches New COM Express Type 6 Carrier Board Read More »
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