Vision AI-KIT 6490: Qualcomm QCS6490 Development Kit
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Vision AI-KIT 6490

Yocto
Android

Target Applications:

  • Ruggedized Handheld Scanners & Tablets
  • Mobile Vision-AI Edge Compute Applications
  • Info kiosks, Vending Machines, Interactive HMI
  • Multi-camera Security Systems with Recognition
  • Service & Industrial Robots

Key Features:

  • 8-core (4x A78, 4x A55) QCS6490 SMARC module
  • 6th gen NPU (12 TOPS) and 3D GPU (Adreno 643)
  • VPU (4k30 enc/4K60 dec) and triple ISP (Spectra 570L)
  • LPDDR5(3200) x32 w/ ECC and UFS 3.1 Flash memory
  • 4x MIPI-CSI camera interfaces (concurrent)
  • 1x MIPI-DSI and MiniDP display outputs (concurrent)
  • 2x PDM mics, audio codec, SAI audio, stereo jack
  • 2x USB3.1, 3x USB2.0 and 2x CAN-FD interfaces
  • 1 Gbps Ethernet and optional Wi-Fi 6E networking
  • 2x M.2 slots, 40-pin and 12-pin expansion headers

Kit Includes:

  • Vision AI Carrier Board fitted with SMARC compute module
  • 1x MIPI CSI IMX577 12MP camera
  • USB-C PD power supply (12V)
  • Extruded aluminum heatsink

Qualcomm Dragonwing™ QCS6490 Development Kit

The Vision AI-KIT 6490 features an energy-efficient, multi-camera, SMARC 2.1.1 compute module, based on the Qualcomm QCS6490 SOC device.

High performance cores on the Vision AI-KIT 6490 (Qualcomm Dragonwing™ QCS6490 Development Kit) include an 8-core Kryo™ 670 CPU, Adreno 643 GPU, Hexagon DSP and 6th gen AI Engine (12 TOPS), Spectra 570L ISP (64MP/30fps capability) and Adreno 633 VPU (4K30/4K60 enc/dec rates), ensure that exceptional concurrent video I/O processing performance is delivered.

A useful subset of the SMARC interfaces are pinned-out on the carrier board, to support four cameras, two displays, five USB interfaces, CAN-FD, Gigabit Ethernet and optional high-speed Wi-Fi networking. The audio subsystem includes two PDM microphones, stereo audio Codec, digital audio interface and analog audio jack I/O.

Integrated TPM and Wi-Fi/BT modules are offered as assembly options of the QCS6490 SMARC compute module. The carrier board has M.2 slots for NVME storage and advanced wireless options. Compact 100 mm x 79 mm carrier board dimensions and mounting hole alignment with similar AI developer boards, enable a drop-in capability with many enclosures.

Qualcomm Linux BSP (Yocto, 6.6 kernel), plus a range of AI/ML and multimedia open-source example applications are provided. Windows 11 IoT Enterprise and Android support will release in 1H25. (Ubuntu Linux for QCS6490 may at later date be supported.)

Request a Quote for the Vision AI-KIT6490
Part Number: SM2-SK-QCS6490-EP6-KIT001

Specifications

Technology6 nm
Dimensions100mm x 79mm
CPU4x A78
4x A55
ChipsetQCS6490
Chipset BrandQualcomm
Chipset Sub-brandDragonwing Q Series
RAM8 GB
Flash64 GB
Storage InterfacesPCI Express gen3 x2 interface (M.2 Key-M slot)
USB2x USB 3.1
3x USB 2.0
Serial Interfaces3 in total:
2 @3.3V levels
1 @1.8V levels
Bus InterfacesPCIe gen3 x2 interface (M.2 Key-M slot)
PCIe gen3 x1 interface (M.2 Key-E slot)
SDIO x4 (M.2 Key-E slot)
PCI Express1x PCI Express gen3 x2
Display ControllerAdreno 643 GPU
Display Interfaces1x MIPI-DSI (4-lane)
1x MiniDisplayPort
Network Interface1x 1Gb/s, RJ45 connector with two status LEDs
Audio Interface2x PDM Microphones
DA7212 Codec
stereo analog audio jack
SAI digital audio header+AS3
Security DeviceAssembly option
Camera Interface4x MIPI CSI
OS SupportYocto Linux
Win 11 IoT Enterprise
(Ubuntu Linux and Android options not currently supported)
Power Requirement12V @3A USB-C PD power supply included
Min Temperature (°C)-20C
Max Temperature (°C)+65C
CoolingExtruded Aluminium Heatsink
Wireless ModuleWi-Fi 6E BT5.4 options
* SMARC module assembly option
* M.2 Key-E slot

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