Vision AI-KIT 6490
Target Applications:
- Ruggedized Handheld Scanners & Tablets
- Mobile Vision-AI Edge Compute Applications
- Info kiosks, Vending Machines, Interactive HMI
- Multi-camera Security Systems with Recognition
- Service & Industrial Robots
Key Features:
- 8-core (4x A78, 4x A55) QCS6490 SMARC module
- 6th gen NPU (12 TOPS) and 3D GPU (Adreno 643)
- VPU (4k30 enc/4K60 dec) and triple ISP (Spectra 570L)
- LPDDR5(3200) x32 w/ ECC and UFS 3.1 Flash memory
- 4x MIPI-CSI camera interfaces (concurrent)
- 1x MIPI-DSI and MiniDP display outputs (concurrent)
- 2x PDM mics, audio codec, SAI audio, stereo jack
- 2x USB3.1, 3x USB2.0 and 2x CAN-FD interfaces
- 1 Gbps Ethernet and optional Wi-Fi 6E networking
- 2x M.2 slots, 40-pin and 12-pin expansion headers
Kit Includes:
- Vision AI Carrier Board fitted with SMARC compute module
- 1x MIPI CSI IMX577 12MP camera
- USB-C PD power supply (12V)
- Extruded aluminum heatsink
Qualcomm Dragonwing™ QCS6490 Development Kit
The Vision AI-KIT 6490 features an energy-efficient, multi-camera, SMARC 2.1.1 compute module, based on the Qualcomm QCS6490 SOC device.
High performance cores on the Vision AI-KIT 6490 (Qualcomm Dragonwing™ QCS6490 Development Kit) include an 8-core Kryo™ 670 CPU, Adreno 643 GPU, Hexagon DSP and 6th gen AI Engine (12 TOPS), Spectra 570L ISP (64MP/30fps capability) and Adreno 633 VPU (4K30/4K60 enc/dec rates), ensure that exceptional concurrent video I/O processing performance is delivered.
A useful subset of the SMARC interfaces are pinned-out on the carrier board, to support four cameras, two displays, five USB interfaces, CAN-FD, Gigabit Ethernet and optional high-speed Wi-Fi networking. The audio subsystem includes two PDM microphones, stereo audio Codec, digital audio interface and analog audio jack I/O.
Integrated TPM and Wi-Fi/BT modules are offered as assembly options of the QCS6490 SMARC compute module. The carrier board has M.2 slots for NVME storage and advanced wireless options. Compact 100 mm x 79 mm carrier board dimensions and mounting hole alignment with similar AI developer boards, enable a drop-in capability with many enclosures.
Qualcomm Linux BSP (Yocto, 6.6 kernel), plus a range of AI/ML and multimedia open-source example applications are provided. Windows 11 IoT Enterprise and Android support will release in 1H25. (Ubuntu Linux for QCS6490 may at later date be supported.)
Request a Quote for the Vision AI-KIT6490
Part Number: SM2-SK-QCS6490-EP6-KIT001
Specifications
| Technology | 6 nm |
| Dimensions | 100mm x 79mm |
| CPU | 4x A78 4x A55 |
| Chipset | QCS6490 |
| Chipset Brand | Qualcomm |
| Chipset Sub-brand | Dragonwing Q Series |
| RAM | 8 GB |
| Flash | 64 GB |
| Storage Interfaces | PCI Express gen3 x2 interface (M.2 Key-M slot) |
| USB | 2x USB 3.1 3x USB 2.0 |
| Serial Interfaces | 3 in total: 2 @3.3V levels 1 @1.8V levels |
| Bus Interfaces | PCIe gen3 x2 interface (M.2 Key-M slot) PCIe gen3 x1 interface (M.2 Key-E slot) SDIO x4 (M.2 Key-E slot) |
| PCI Express | 1x PCI Express gen3 x2 |
| Display Controller | Adreno 643 GPU |
| Display Interfaces | 1x MIPI-DSI (4-lane) 1x MiniDisplayPort |
| Network Interface | 1x 1Gb/s, RJ45 connector with two status LEDs |
| Audio Interface | 2x PDM Microphones DA7212 Codec stereo analog audio jack SAI digital audio header+AS3 |
| Security Device | Assembly option |
| Camera Interface | 4x MIPI CSI |
| OS Support | Yocto Linux Win 11 IoT Enterprise (Ubuntu Linux and Android options not currently supported) |
| Power Requirement | 12V @3A USB-C PD power supply included |
| Min Temperature (°C) | -20C |
| Max Temperature (°C) | +65C |
| Cooling | Extruded Aluminium Heatsink |
| Wireless Module | Wi-Fi 6E BT5.4 options * SMARC module assembly option * M.2 Key-E slot |
Errata & Product Change Notices
Getting Started Guides
Mechanical Drawings
Product Brief
Forum Support
Product support from the community including blogs and discussions around technical issues and challenges.
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