Intel Embedded Compute Modules | Tria Technologies
Logo of titanium Intel partner Tria

Tria and Intel

Tria is a proud Titanium Tier Member of the Intel Partner Alliance (IPA), the highest level of partnership within Intel’s prestigious network. This partnership provides us with unparalleled access to Intel’s cutting-edge technologies, pre-release product information, and dedicated support. As a result, we can deliver the earliest availability of Intel’s solutions and enable faster, smoother integration into customer designs.

Intel-based SMARC® Modules

Tria’s Intel-based SMARC modules deliver scalable performance, low power, and rich I/O for embedded systems operating at the edge. Based on the Intel Atom®, processor, this product family supports up to 8 cores and is ideal for a wide range of industrial and commercial applications.

Browse our Award-winning SMARC modules powered by Intel processors:

  • Modules

    TRIA SM2S-AL

    The new TRIA SM2S-AL module features Intel’s next-generation low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom Processor E3900…

    Add to basket
  • Modules

    TRIA SM2S-ALN

    The new TRIA SM2S-ALN module features the Intel Atom® processors x7000E Series, Intel® Core ™i3 processor and Intel® Processors N Series (codenamed “A…

    Add to basket
  • Modules

    TRIA SM2S-ASL

    The new TRIA SM2S-ASL module features the Intel Atom® processors x7000RE/C Series (codenamed “Amston Lake”). The CPU architecture is based on the same…

    Add to basket
  • Modules

    TRIA SM2S-EL

    The new TRIA SM2S-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart L

    Add to basket

Intel-based COM Express® Modules

Tria’s Intel-based COM Express modules offer scalable performance, rich I/O, and long-term reliability for embedded systems. Supporting Intel Atom®, Core™, and Core™ Ultra processors, they’re available in multiple form factors and power envelopes. With flexible onboard memory options, they’re ideal for robotics, automation, transportation and medical applications.

Browse our COM Express modules powered by Intel processors:

  • COM Express

    TRIA C10M-AL

    The TRIA C10M-AL module is based on Intel’s multi-core system-on-chip (SOC) Atom generation (codenamed “Apollo Lake”). It integrates next generation I…

    Add to basket
  • COM Express

    TRIA C10M-ALN

    The new TRIA C10M-ALN module features the Intel Atom® processors x7000E Series, Intel® Core ™i3 processor and Intel® Processors N Series (codenamed “A…

    Add to basket
  • COM Express

    TRIA C10M-ASL

    The TRIA C10M-ASL features the Intel® Atom® Processor x7000RE/C Series. With support for up to eight processor cores, the module fits to a wide range …

    Add to basket
  • COM Express

    TRIA C10M-BT

    The Tria C10M-BT module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation that integrates processor core, graphics, memory, and I/O …

    Add to basket
  • COM Express

    Tria C10M-BTC

    The TRIA C10M-BTC module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation that integrates processor core, graphics, memory, and I/O…

    Add to basket

Intel-based COM-HPC® Modules

COM-HPC Client and Server modules provide unmatched I/O connectivity and support for the highest performance CPUs.

COM-HPC Mini modules deliver high performance and I/O bandwidth in the smallest available footprint. They’re ideal for space-constrained applications in rugged environments with limited cooling capacity, particularly in automation and medical applications that demand compelling processing performance on AI-enabled platforms.

Browse our groundbreaking COM-HPC modules powered by Intel processors:

  • COM-HPC

    TRIA HCA-ALP

    The TRIA HCA-ALP COM-HPC Client module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power …

    Add to basket
  • COM-HPC

    TRIA HCA-MLH

    The TRIA HCA-MLH COM-HPC Client module features the Intel® Core™ Ultra processor, providing developers with a powerful workhorse to boost their target…

    Add to basket
  • COM-HPC

    TRIA HCA-RLP

    The TRIA HCA-RLP COM-HPC Client module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power …

    Add to basket
  • COM-HPC

    TRIA HCC-CFLS

    The TRIA HCC-CFLS module is the first member of the new COM-HPC product family. It enables a PICMG COM-HPC Client interface and features size C module…

    Add to basket
  • COM-HPC

    TRIA HMM-RLP

    The TRIA HMM-RLP module featuring the COM-HPC Mini formfactor is ideal for system designs that require outstanding performance and flexible IO connect…

    Add to basket

Intel-based Qseven® Modules

We deliver Qseven modules powered by the latest Intel Atom processor generations. Designed to protect customer investments, these modules enable easy migration to the next processor generation and accelerate time to market.

Browse our Qseven modules powered by Intel processors

  • Modules

    TRIA Q7-AL

    The new TRIA Q7-AL module features Intel’s next-generation low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom Processor E3900 s…

    Add to basket
  • Modules

    TRIA Q7-BT

    The TRIA Q7-BT module is based on the Qseven Rev. 2.0 and using Intel’s multi-core System-On-Chip (SOC) Atom generation that integrates next generatio…

    Add to basket
  • Modules

    TRIA Q7-BW

    The TRIA Q7-BW module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation (“Braswell”) that integrates next generation Intel processor…

    Add to basket
  • Modules

    TRIA Q7-EL

    The new TRIA Q7-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lak

    Add to basket

Advantages of Intel Processors

Intel® Core™ Ultra:

Tria uses Intel® Core™ Ultra processors to deliver high-performance compute with integrated AI acceleration. With up to 24 cores, they support advanced productivity, creativity, and real-time processing across edge systems and embedded AI applications.

Intel® Core™:

Tria integrates Intel® Core™ processors into systems that require fast, responsive performance for demanding visual and multitasking workloads. They’re ideal for embedded platforms handling real-time processing in automation and media transcoding.

Intel® Xeon®:

Tria uses Intel® Xeon® processors in embedded and edge platforms where scalable performance, high-speed memory, and real-time data processing are essential. Common applications include automation, networking, and industrial servers.

Intel® Atom®:

Tria builds rugged, long-life embedded systems using Intel® Atom® processors, combining low power usage with consistent performance. These are suited for industrial automation, robotics, and fanless edge devices aligned with Industry 4.0 goals.

Focus Markets

Our partnership with Intel accelerates innovation across a broad range of markets, including:

Latest News and Insights

Stay informed with our latest innovations and industry insights involving Intel and Tria.

PR_Boards_ASL-1030x686

Avnet Showcases Three New COM Modules Powered by New Intel Atom Processors at Embedded World 2024

Avnet (Nasdaq: AVT) is launching three new Computer on Modules (CoM) based on Intel’s newly announced Atom* Processor x7000RE and x7000C Series at Embedded World 2024. With support for up to eight processor cores, these modules are ideal for applications that require reliable and compact industrial compute platforms. Their industrial grade capabilities include extended temperature range and 24/7 continuous operation.

Read More »
MSC-HCA-MLH-MSC-C6B-MLH-1

Avnet Launches Two Modules based on Intel Core Ultra Processor

Avnet (Nasdaq: AVT) is launching two high-end Computer-on Module (CoM) products for compute and graphics intensive applications featuring Intel* Core* Ultra processors. The CoM module based on COM Express Type 6 with Basic formfactor (C6B-MLH) is intended as a technology refinement for applications that have the module standard already integrated. Architects that are targeting higher I/O bandwidth and connectivity can select the COM-HPC Client Size A module (HCA-MLH).

Read More »
Contact Us