
Tria and Qualcomm
Tria’s collaboration with Qualcomm Technologies brings high-performance system-on-modules (SoMs) to meet rising demand across industrial and IoT sectors. These solutions are designed to deliver exceptional power and efficiency for applications such as rugged handhelds, kiosks, and edge AI systems.
Leveraging Tria’s global design, manufacturing, and distribution expertise, the collaboration provides scalable, next-generation compute solutions that simplify development and accelerate product innovation.
Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges.
Building on nearly 40 years of experience in setting industry standards and creating era-defining technology breakthroughs, Qualcomm Technologies delivers leading edge AI, high-performance, low-power computing, and superior connectivity.
Together with ecosystem partners, Qualcomm® IoT technologies and solutions utilize the real-world intelligent edge to offer end-to-end, ready-to-deploy solutions so customers can digitally transform their businesses to optimize their operations, monetize massive amounts of data, innovate in new ways, and drive cost savings.
Qualcomm-based SMARC® Modules
Tria’s Qualcomm-based SMARC modules bring advanced AI acceleration, efficient compute, and rich multimedia capabilities to the edge. Designed for industrial and commercial IoT, they combine low power with robust connectivity in a compact, versatile format ideal for next-gen embedded devices.
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Modules
TRIA SM2S-QCS5430
The TRIA SM2S-QCS5430 SMARC 2.1.1 module family is powered by the Qualcomm® QCS5430 processor, a 6nm processor with high performance and best in class…
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Modules
TRIA SM2S-QCS6490
The TRIA SM2S-QCS6490 SMARC 2.1.1 module family is powered by the Qualcomm® QCS6490 processor, a 6nm processor with high performance and best in class…
TRIA SM2S-QCS6490
The TRIA SM2S-QCS6490 SMARC module, powered by Qualcomm’s QCS6490 processor, delivers high performance for industrial and commercial IoT applications, including rugged handhelds, tablets, kiosks, scanners, dash cams, POS systems, and HMIs. Read more…
TRIA SM2S-QCS5430
The TRIA SM2S-QCS5430 SMARC module, powered by Qualcomm’s QCS5430 processor, combines high performance with exceptional power efficiency. It’s purpose-built for industrial and commercial IoT applications, including rugged handhelds, tablets, kiosks, scanners, dash cams, POS systems, and HMIs. The module supports powerful edge AI (up to 3.5 TOPS), advanced graphics, and extensive camera and display interfaces. Read more…
Qualcomm-based OSM Module
Tria’s Qualcomm-based OSM module delivers compact, low-power edge compute with integrated AI and multimedia capabilities. Ideal for embedded Linux edge applications.
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Modules
TRIA OSM-LF-IQ615
The TRIA OSM-LF-IQ615 is based on the new OSM 1.2 standard (Size-L) “Large” and is powered by the Dragonwing IQ-615 Processor from Qualcomm. It is a l…
TRIA OSM-LF-IQ615
The MSC OSM-LF-IQ615 module, built on the OSM 1.2 Size-L standard and powered by Qualcomm’s Dragonwing IQ-615 processor, offers efficient performance for Linux-based edge applications. With 8 Arm cores, an Adreno 612 GPU, and Hexagon V66 DSP, it enables secure, low-power machine learning and multimedia processing. Ideal for embedded systems, it supports LPDDR4 memory, up to 256GB eMMC, and a range of interfaces including Gigabit Ethernet, USB 3.1, MIPI-CSI, and DisplayPort. Read more…
Qualcomm-based COM Express® Module
Tria’s Qualcomm-based COM Express module delivers compact, power-efficient AI compute for rugged edge applications.
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COM Express
TRIA C6C-QCSX
The TRIA C6C-QCSX COM Express module features the Qualcomm Snapdragon® X Elite processor family. This highly energy-efficient processor offers best-in…
TRIA C6C-QCSX
The TRIA C6C-QCSX COM The TRIA C6C-QCSX COM Express module, powered by Qualcomm’s Snapdragon® X Elite processor, delivers exceptional performance-per-watt for compact, power-efficient designs. With up to 12 Oryon™ CPU cores, Adreno™ GPU, and a 45 TOPS Hexagon™ NPU, it’s ideal for AI-driven applications in automation, robotics, autonomous systems, and medical devices. The module supports up to 64GB LPDDR5X, rich I/O, and long-term availability for scalable, future-ready designs. Read more…
Qualcomm-based COM-HPC® Modules
Tria’s Qualcomm-based COM-HPC module brings high-end processing to modular compute for edge AI, media analytics, and industrial applications.
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COM Express
TRIA C6C-QCSX
The TRIA C6C-QCSX COM Express module features the Qualcomm Snapdragon® X Elite processor family. This highly energy-efficient processor offers best-in…
TRIA HMM-QCSX COM-HPC
The TRIA HMM-QCSX COM-HPC Mini module, powered by Qualcomm’s Snapdragon® X Elite processor, delivers top-tier performance-per-watt in an ultra-compact form. With up to 12 Oryon™ CPU cores, Adreno™ GPU, and a 45 TOPS Hexagon™ NPU, it’s ideal for space-constrained AI-driven systems in automation, robotics, and medical devices. It supports up to 64GB LPDDR5X, extensive I/O, and long-term availability for future-ready designs. Read more…
Development Kit: Vision AI-KIT IQ9
Engineered for industrial edge AI workloads, the Vision AI-KIT IQ9 development kit features a 3.5” SBC fitted with the Qualcomm Dragonwing™ IQ-9075 SiP module. With up to 100 TOPS AI acceleration, 16-camera support, and real-time processing cores, it’s ideal for evaluating advanced vision and control applications in rugged environments. Read more…
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AAG Compute
Vision AI-KIT IQ9
Qualcomm Dragonwing™ IQ-9075 Development Kit
Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP…
Advantages of Qualcomm Processors
QCS6490 Processor:
Delivers premium performance for connected, AI-enhanced edge devices with up to 12 TOPS, multi-OS support, and powerful camera, compute, and connectivity features in an energy-efficient design.
QCS5430 Processor:
Delivers premium-tier performance, scalable AI, and Wi-Fi 6E connectivity for rugged edge devices. Ideal for industrial IoT applications with multi-camera support, powerful compute, and OTA upgrade flexibility.
Q615 Processor:
Delivers cost-effective, industrial-grade performance with AI support, multi-OS flexibility, and 10+ year longevity. Ideal for gateways, controllers, and HMIs operating in demanding environments.
Snapdragon® X Elite:
Built for peak AI and compute performance with a 12-core Oryon™ CPU, Adreno™ GPU, and 45 TOPS NPU. Delivers multi-day battery life, Wi-Fi 7, and on-device generative AI for high-performance, energy-efficient systems.
Focus Markets
Our collaboration accelerates innovation across a broad range of markets, including:
- Building Automation
- Security
- Transportation
- Industrial Automation
- POS/POI
- Energy
Latest News and Insights
Stay informed with our latest innovations and industry insights involving Qualcomm and Tria.

Tria’s new family of compute modules powered by Qualcomm processors now support Windows, Android and Linux
Tria’s latest compute modules powered by Qualcomm now support Windows, Android, and Linux—enabling scalable, low-power embedded systems with edge AI and multi-OS flexibility.

Tria to launch five new product families powered by Qualcomm at Embedded World
At Embedded World 2025, Tria Technologies will launch five new embedded module families powered by Qualcomm Dragonwing™ and Snapdragon® platforms. Designed for edge AI, low power, and industrial performance, these modules enable next-generation IoT and embedded applications.

Qualcomm for AI, brought to you by Tria
We are pleased to launch compact embedded compute modules (MSC SM2S-QCS6490 and MSC SM2S-QCS5430) powered by ARM-based Qualcomm processors. The compact SMARC boards offer an excellent balance of performance and energy efficiency.