Qualcomm Embedded Compute Modules | Tria Technologies
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Tria and Qualcomm

Tria’s collaboration with Qualcomm Technologies brings high-performance system-on-modules (SoMs) to meet rising demand across industrial and IoT sectors. These solutions are designed to deliver exceptional power and efficiency for applications such as rugged handhelds, kiosks, and edge AI systems.

Leveraging Tria’s global design, manufacturing, and distribution expertise, the collaboration provides scalable, next-generation compute solutions that simplify development and accelerate product innovation.

Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges.

Building on nearly 40 years of experience in setting industry standards and creating era-defining technology breakthroughs, Qualcomm Technologies delivers leading edge AI, high-performance, low-power computing, and superior connectivity.

Together with ecosystem partners, Qualcomm® IoT technologies and solutions utilize the real-world intelligent edge to offer end-to-end, ready-to-deploy solutions so customers can digitally transform their businesses to optimize their operations, monetize massive amounts of data, innovate in new ways, and drive cost savings.

Qualcomm-based SMARC® Modules

Tria’s Qualcomm-based SMARC modules bring advanced AI acceleration, efficient compute, and rich multimedia capabilities to the edge. Designed for industrial and commercial IoT, they combine low power with robust connectivity in a compact, versatile format ideal for next-gen embedded devices.

TRIA SM2S-QCS6490

The TRIA SM2S-QCS6490 SMARC module, powered by Qualcomm’s QCS6490 processor, delivers high performance for industrial and commercial IoT applications, including rugged handhelds, tablets, kiosks, scanners, dash cams, POS systems, and HMIs. Read more…

TRIA SM2S-QCS5430

The TRIA SM2S-QCS5430 SMARC module, powered by Qualcomm’s QCS5430 processor, combines high performance with exceptional power efficiency. It’s purpose-built for industrial and commercial IoT applications, including rugged handhelds, tablets, kiosks, scanners, dash cams, POS systems, and HMIs. The module supports powerful edge AI (up to 3.5 TOPS), advanced graphics, and extensive camera and display interfaces. Read more…

Qualcomm-based OSM Module

Tria’s Qualcomm-based OSM module delivers compact, low-power edge compute with integrated AI and multimedia capabilities. Ideal for embedded Linux edge applications.

TRIA OSM-LF-IQ615

The MSC OSM-LF-IQ615 module, built on the OSM 1.2 Size-L standard and powered by Qualcomm’s Dragonwing IQ-615 processor, offers efficient performance for Linux-based edge applications. With 8 Arm cores, an Adreno 612 GPU, and Hexagon V66 DSP, it enables secure, low-power machine learning and multimedia processing. Ideal for embedded systems, it supports LPDDR4 memory, up to 256GB eMMC, and a range of interfaces including Gigabit Ethernet, USB 3.1, MIPI-CSI, and DisplayPort. Read more…

Qualcomm-based COM Express® Module

Tria’s Qualcomm-based COM Express module delivers compact, power-efficient AI compute for rugged edge applications.

  • COM Express

    TRIA C6C-QCSX

    The TRIA C6C-QCSX COM Express module features the Qualcomm Snapdragon® X Elite processor family. This highly energy-efficient processor offers best-in…

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TRIA C6C-QCSX

The TRIA C6C-QCSX COM The TRIA C6C-QCSX COM Express module, powered by Qualcomm’s Snapdragon® X Elite processor, delivers exceptional performance-per-watt for compact, power-efficient designs. With up to 12 Oryon™ CPU cores, Adreno™ GPU, and a 45 TOPS Hexagon™ NPU, it’s ideal for AI-driven applications in automation, robotics, autonomous systems, and medical devices. The module supports up to 64GB LPDDR5X, rich I/O, and long-term availability for scalable, future-ready designs. Read more…

Qualcomm-based COM-HPC® Modules

Tria’s Qualcomm-based COM-HPC module brings high-end processing to modular compute for edge AI, media analytics, and industrial applications.

  • COM Express

    TRIA C6C-QCSX

    The TRIA C6C-QCSX COM Express module features the Qualcomm Snapdragon® X Elite processor family. This highly energy-efficient processor offers best-in…

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TRIA HMM-QCSX COM-HPC

The TRIA HMM-QCSX COM-HPC Mini module, powered by Qualcomm’s Snapdragon® X Elite processor, delivers top-tier performance-per-watt in an ultra-compact form. With up to 12 Oryon™ CPU cores, Adreno™ GPU, and a 45 TOPS Hexagon™ NPU, it’s ideal for space-constrained AI-driven systems in automation, robotics, and medical devices. It supports up to 64GB LPDDR5X, extensive I/O, and long-term availability for future-ready designs. Read more…

Development Kit: Vision AI-KIT IQ9​

Engineered for industrial edge AI workloads, the Vision AI-KIT IQ9 development kit features a 3.5” SBC fitted with the Qualcomm Dragonwing™ IQ-9075 SiP module. With up to 100 TOPS AI acceleration, 16-camera support, and real-time processing cores, it’s ideal for evaluating advanced vision and control applications in rugged environments. Read more…

  • AAG Compute

    Vision AI-KIT IQ9

    Qualcomm Dragonwing™ IQ-9075 Development Kit

    Vision AI-KIT IQ9 features an industrial 3.5-inch SBC board fitted with Qualcomm Dragonwing™ IQ-9075 SIP…

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Advantages of Qualcomm Processors

QCS6490 Processor:

Delivers premium performance for connected, AI-enhanced edge devices with up to 12 TOPS, multi-OS support, and powerful camera, compute, and connectivity features in an energy-efficient design.

QCS5430 Processor:

Delivers premium-tier performance, scalable AI, and Wi-Fi 6E connectivity for rugged edge devices. Ideal for industrial IoT applications with multi-camera support, powerful compute, and OTA upgrade flexibility.

Q615 Processor:

Delivers cost-effective, industrial-grade performance with AI support, multi-OS flexibility, and 10+ year longevity. Ideal for gateways, controllers, and HMIs operating in demanding environments.

Snapdragon® X Elite:

Built for peak AI and compute performance with a 12-core Oryon™ CPU, Adreno™ GPU, and 45 TOPS NPU. Delivers multi-day battery life, Wi-Fi 7, and on-device generative AI for high-performance, energy-efficient systems.

Focus Markets

Our collaboration accelerates innovation across a broad range of markets, including:

Latest News and Insights

Stay informed with our latest innovations and industry insights involving Qualcomm and Tria.

Close-up of a green compute board next to a conveyor belt with brown cardboard boxes on it. There is a Qualcomm logo printed on the board.

Qualcomm for AI, brought to you by Tria

We are pleased to launch compact embedded compute modules (MSC SM2S-QCS6490 and MSC SM2S-QCS5430) powered by ARM-based Qualcomm processors. The compact SMARC boards offer an excellent balance of performance and energy efficiency.

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