MSC Modules Archives - Tria

MSC Modules

All MSC Compute Modules and associated carrier boards and development kits

  • MSC Modules

    TRIA SPB209A

    SPB209A is a complete WLAN and Bluetooth Dual-mode module ready for onboard integration in Linux platforms. The ultra-small 14x14x2.5mm low power, hig…

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  • COM-HPC

    TRIA HCA-PLH

    The TRIA HCA-PLH COM-HPC Client module features the Intel® Core™ Ultra Series Processor (Series 3), providing developers with a powerful workhorse to …

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  • MSC Modules

    TRIA SPB611

    SPB611 is a complete WiFi 6/Bluetooth 5 module with integrated EMC shield, ready for onboard integration in a hosted environment. SPB611 enables a cos…

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  • COM-HPC

    TRIA HMM-IQX

    The TRIA HMM-IQX COM-HPC Mini module is based on the Qualcomm Dragonwing™ IQ-X processor. This highly energy-efficient processor offers best-in-class …

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  • COM Express

    TRIA C6C-IQX

    COM Express module powered by Qualcomm Dragonwing IQ-X processors, designed for high-performance and energy-efficient AI and edge applications.

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  • Carrier boards

    TRIA OSM-SB-EP5

    The OSM-SB-EP5 is the right platform for evaluation of the OSM-Modules with all available interfaces, but can be used as well as SimpleFlex s

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  • Modules

    TRIA OSM-SF-IMXRT1170

    The TRIA OSM‑SF‑IMXRT1170 is based on the new OSM 1.1 standard (Size‑S) "Small" for completely machine processible low‑cost embedded compute…

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  • Carrier Boards

    TRIA C6-MB-EV4M

    COM Express™, an open specification of the PICMG (PCI Industrial Computer Manufacturer Group), is a module concept to bring PCI Express and other high…

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  • Carrier Boards

    TRIA SM2-MB-EP2

    The new SMARC™ 2.2 embedded platform TRIA SM2-MB-EP2 offers the possibility to test all the functional interfaces of SMARC 2.2 without compro

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  • Modules

    TRIA SM2S-IQ615

    SMARC module powered by the Qualcomm Dragonwing IQ-615 processor, designed for high-performance and energy-efficient edge applications.

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  • Modules

    TRIA Q7-ASL

    The new TRIA Q7-ASL module features the Intel Atom® processors x7000RE/C Series (codenamed “Amston Lake”). The CPU architecture is based on the same E…

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  • Modules

    TRIA Q7-ALN

    The new TRIA Q7-ALN module features the Intel Atom® processors x7000E Intel® Core™ i3 processor Intel® Processors N Series (codenamed “Alderlake Lake …

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  • Modules

    TRIA SM2S-G3E

    SMARC 2.2 module powered by Renesas RZ/G3E processors, designed for energy-efficient edge applications with integrated AI and multimedia capabilities.

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  • Modules

    TRIA OSM-LF-IMX95

    The TRIA OSM-LF-IMX95 is based on the OSM 1.2 standard (Size-L) “Large” for completely machine processible low-cost embedded computer modules during s…

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  • Modules

    TRIA OSM-SF-IMX93

    The TRIA OSM-SF-IMX93 is based on the OSM 1.1 standard (Size-S) “Small” for completely machine processible low-cost embedded computer modules during s…

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  • Modules

    TRIA OSM-SF-IMX91

    The TRIA OSM-SF-IMX91 is based on the OSM 1.1 standard (Size-S) “Small” for completely machine processible low-cost embedded computer modules during s…

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  • Modules

    TRIA OSM-LF-IQ615

    The TRIA OSM-LF-IQ615 is based on the OSM 1.2 standard (Size-L) “Large” and is powered by the Dragonwing IQ-615 Processor from Qualcomm. It is a low-c…

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  • COM-HPC

    TRIA HMM-RLP

    The TRIA HMM-RLP module featuring the COM-HPC Mini formfactor is ideal for system designs that require outstanding performance and flexible IO connect…

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  • COM Express

    TRIA C6C-RYZ8

    COM Express module powered by AMD Ryzen Embedded 8000 Series processors, designed for high-performance AI and graphics-intensive edge applications.

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  • Modules

    TRIA OSM-MF-IMX8PLUS

    The TRIA OSM-MF-IMX8PLUS is based on the OSM 1.2 standard (Size-M) “Medium” for completely machine processible low-cost embedded computer modules duri…

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  • Modules

    TRIA SM2S-IMX95

    SMARC module powered by NXP i.MX 95 processors, designed for next-generation edge applications with integrated AI acceleration and advanced security features.

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  • Modules

    TRIA SM2S-ASL

    SMARC module powered by Intel Atom® x7000RE/C Series processors, designed for reliable performance in industrial and embedded applications operating under demanding conditions.

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  • COM Express

    TRIA C6C-ASL

    COM Express module powered by Intel Atom x7000RE/C Series processors, designed for reliable performance in industrial and embedded applications under harsh conditions.

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  • COM-HPC

    TRIA HCA-MLH

    The TRIA HCA-MLH COM-HPC Client module features the Intel® Core™ Ultra processor, providing developers with a powerful workhorse to boost their target…

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  • COM Express

    TRIA C6B-MLH

    COM Express module powered by Intel Core Ultra processors, designed for high-performance AI and compute-intensive embedded applications.

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  • Modules

    TRIA SM2S-QCS6490

    SMARC module powered by the Qualcomm QCS6490 processor, designed for high-performance edge AI and industrial IoT applications.

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  • Modules

    TRIA SM2S-QCS5430

    SMARC module powered by the Qualcomm QCS5430 processor, designed for energy-efficient edge AI and industrial IoT applications.

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  • COM Express

    TRIA C10M-ASL

    COM Express Mini module powered by Intel Atom x7000RE/C processors, designed for reliable performance in compact embedded systems operating under harsh conditions.

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  • Carrier Boards

    TRIA C6-MB-EV4

    COM Express™, an open specification of the PICMG (PCI Industrial Computer Manufacturer Group), is a module concept to bring PCI Express and other high…

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  • Modules

    TRIA SM2S-RYZ2

    SMARC module powered by AMD Ryzen Embedded R2000 processors, designed for high-performance computing and graphics in space- and power-constrained embedded applications.

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