News
Tria Technologies Launches Module with New Generation Intel Processor
Tria Technologies launches a COM-HPC Client module powered by Intel Core Ultra Series 3 processors, enabling high-performance AI at the Edge for embedded applications.
Tria Technologies brings multi-OS support to Qualcomm-based hardware
Tria Technologies expands operating system support on Qualcomm-based hardware with Yocto Linux, Windows 11 IoT and Android for embedded and industrial applications.
Wireless modules for embedded systems now available from Tria Technologies
Tria Technologies introduces SPB611 and SPB209 wireless modules supporting Wi-Fi, Bluetooth and mesh networking for embedded system design.
Tria Technologies launches OSM-LF-IMX95, a compact OSM-compliant Module powered by NXP i.MX 95 Applications Processor
Tria Technologies introduces the OSM-LF-IMX95, a compact OSM-compliant compute module powered by the NXP i.MX 95 processor, delivering high performance, advanced security and power efficiency for next-generation embedded and edge AI platforms.
Local manufacturer Tria Technologies sponsors Stutensee festival anniversary celebrations
Stutensee, Germany – June 30, 2025 – Tria Technologies, an Avnet company specializing in the manufacturing of embedded compute boards, is proudly sponsoring the 50-year celebrations of History and Culture in Stutensee.
Tria collaborates with Avnet for AWS re:Invent 2025
Tria Technologies and Avnet collaborated at AWS re:Invent 2025 to demonstrate edge-to-cloud solutions featuring Qualcomm QCS6490 and AMD/ZUBoard-1CG FPGA SOC platforms, highlighting real-time AI and industrial gesture recognition integrated with AWS IoT Connect.
Tria Technologies Provides Lifetime Extension and Performance Boost for Qseven COM Standard
Tria Technologies extends the lifetime and performance capabilities of the Qseven standard with the TRIA-Q7-ASL and TRIA-Q7-ALN modules, offering long-term availability, improved processing performance, and support for Intel “Amston Lake”, “Alder Lake N” and “Twin Lake” platforms.
Tria Technologies to bring Qualcomm DragonwingTM IQ-6 Series to market with two new compute modules
Tria Technologies introduces the TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 compute modules featuring the Qualcomm Dragonwing™ IQ-6 Series processor, delivering industrial-grade edge AI performance, versatile interfaces, and support for SMARC and OSM form factors.
Tria enhances SMARC portfolio with new module based on Renesas RZ/G3E processor for HMI applications
Tria adds the SM2S-G3E to its SMARC portfolio, bringing the Renesas RZ/G3E processor to HMI, industrial automation and AI-enabled edge applications.
Tria’s new family of compute modules powered by Qualcomm processors now support Windows, Android and Linux
Tria’s latest compute modules powered by Qualcomm now support Windows, Android, and Linux—enabling scalable, low-power embedded systems with edge AI and multi-OS flexibility.
Tria rocks Embedded World debut with launch of COM Express Compact Type 6 module
Tria launches the C6C-RYZ8 COM Express Compact Type 6 module at Embedded World 2025. Powered by AMD Ryzen™ Embedded 8000 Series with integrated AI acceleration, the module brings scalable x86 performance to compact embedded systems.
Tria introduces first HMM-RLP module featuring COM-HPC Mini form factor at Embedded World 2025
Tria introduces its first COM-HPC Mini form factor module—HMM-RLP—powered by 13th Gen Intel® Core™ processors. Designed for edge compute performance in space-constrained systems, the module debuts at Embedded World 2025.
Tria to launch five new product families powered by Qualcomm at Embedded World
At Embedded World 2025, Tria Technologies will launch five new embedded module families powered by Qualcomm Dragonwing™ and Snapdragon® platforms. Designed for edge AI, low power, and industrial performance, these modules enable next-generation IoT and embedded applications.
Tria debuts at Embedded World 2025 with new product launches
Tria Technologies™, an Avnet company specialising in embedded compute boards, is making its Embedded World debut in Hall 3A Booth 225.
Tria Technologies Announces Two Senior Management Appointments
Tria Technologies announces senior management appointments for Kate Pritchard and Daniel Denzler, strengthening go-to-market leadership and business line management across boards and systems.
Tria Technologies Announces Major New Partnership with Qt Group
Tria Technologies and Qt Group partner to support embedded HMI and GUI development with Qt 6, SimpleSwitch, SMARC modules and integrated software workflows.
Tria Technologies Launches New COM Express Type 6 Carrier Board
Tria Technologies introduces the MSC C6-MB-EV4, a new COM Express Type 6 carrier board that streamlines prototyping, evaluation, and system design.
New! COM Express modules with AMD Ryzen Embedded R2000
Tria Technologies presents the C6C-RYZ2 COM Express Type 6 modules with AMD Ryzen Embedded R2000 processors, ideal for industrial and medical applications.
Simply high performance for your demanding imaging applications
Two new compute module families powered by Intel Core Ultra bring high performance, AI acceleration, and scalability to demanding imaging and embedded applications.
Qualcomm for AI, brought to you by Tria
Tria’s Qualcomm-based SMARC modules support edge AI, vision AI and industrial IoT applications with high-performance processing, AI acceleration and camera support.
Tria Brings High Performance on ARM-based processors to Two New Computer-on-Modules in Collaboration with Qualcomm
Tria introduces two SMARC modules based on Qualcomm QCS6490 and QCS5430 processors, bringing high-performance Arm-based processing to edge AI and industrial IoT applications.
Tria Showcases Three New COM Modules Powered by New Intel Atom Processors at Embedded World 2024
Tria showcases three COM modules based on Intel Atom x7000RE and x7000C Series processors at Embedded World 2024 for compact industrial edge applications.
Tria Promoted to Platinum NXP Partner
Tria has been promoted to Platinum Partner status within NXP® Semiconductor’s prestigious Global Partner Program. Platinum Partners are those companies who collaborate closely with NXP to enrich the enablement and implementation of total system solutions.
Avnet Introduces High Performance SM2S-IMX95 SMARC Module
Avnet (Nasdaq: AVT) launches a new SMARC module family based on NXP’s new i.MX 95 Applications Processor. The MSC SM2S-IMX95 SMARC module family is based on the new SMARC 2.1.1 standard allowing easy integration with SMARC baseboards.
Avnet Launches Two Modules based on Intel Core Ultra Processor
Avnet (Nasdaq: AVT) is launching two high-end Computer-on Module (CoM) products for compute and graphics intensive applications featuring Intel* Core* Ultra processors. The CoM module based on COM Express Type 6 with Basic formfactor (C6B-MLH) is intended as a technology refinement for applications that have the module standard already integrated. Architects that are targeting higher I/O bandwidth and connectivity can select the COM-HPC Client Size A module (HCA-MLH).
Tria Expands OSM Product Line with i.MX 8M Plus
Tria launches module based on the compact OSM Size M format featuring NXP’s i.MX 8M Plus family of processors. The TRIA OSM-MF-IMX8PLUS is based on the compact OSM 1.1 standard (Size-M) “Medium” for completely machine processible low-cost embedded computer modules during soldering, assembly and testing.
Tria’s Latest TRIA C10M-ALN Module Features the Intel Atom* Processor x7000E Series
TRIA C10M-ALN is a COM Express Type 10 Mini module based on Intel Atom x7000E Series processors, with LPDDR5 memory, eMMC, USB, PCIe and 2.5GbE support.
Avnet Opens Technology Campus in Southern Germany
Avnet opens a technology campus in Eschbach, Germany, with manufacturing, engineering, logistics and co-working space for compute, display, system and server assembly.
Extend the Lifecycle of C6C-RYZ Modules with New Drop-In Replacement
TRIA C6C-RYZ2 extends the lifecycle of C6C-RYZ COM Express modules as a drop-in replacement based on AMD Ryzen Embedded R2000 processors.
Intel Core processors on COM Express and COM-HPC computing platforms: high performance for AI applications
Tria COM Express and COM-HPC module families based on 13th and 12th Gen Intel Core processors support high-performance industrial and AI applications.
Tria announces complete starter kit for new SMARC modules based on NXP’s i.MX 93 applications processors
Tria announces a SMARC starter kit for NXP i.MX 93 applications processors, enabling evaluation and application development for low-power embedded systems.
Avnet Embedded launches compact SMARC module family based on Intel® Atom® x7000E Series processors with up to eight cores
Avnet Embedded is expanding its comprehensive SMARC™ product portfolio including announcing availability of the scalable MSC SM2S-ALN module family.
Tria brings full Windows 10 IoT on industrial Arm-based SMARC module platform with NXP i.MX 8M Plus SoCs
Tria brings Windows 10 IoT Enterprise LTSC to Arm-based SMARC modules with NXP i.MX 8M Plus processors for industrial embedded platforms.
RASynBoard brings low-power, edge AI processing to embedded sensor applications
RASynBoard brings low-power edge AI processing to embedded sensor applications, combining always-on sensing, wireless connectivity and AI model development support.
Tria launches new COM Express Compact module family based on new Intel Atom x7000E Series processor generation
Tria launches the TRIA C6C-ALN COM Express® Type 6 module family, utilizing the next generation of Intel® Atom® processor technology.
Tria announces first high-performance COM Express module family based on 13th generation Intel Core processors
Tria announces a high-performance COM Express Type 6 module family based on 13th Gen Intel Core processors for industrial, medical, transportation, video surveillance and gaming applications.
Tria presents scalable SMARC module family based on i.MX 93 applications processors from NXP Semiconductors
Tria continues its long and successful partnership with NXP™ Semiconductors and presents the scalable TRIA SM2S-IMX93 SMARC 2.1.1™ module family.
Tria and Renesas cooperate in the field of SMARC modules and present first energy- and cost-efficient module family based on RZ/G2UL processors
Tria and Renesas developed the SM2S-G2UL SMARC module family for cost-effective, power-efficient embedded and entry-level HMI applications.
Tria announces options for rapid evaluation of OSM modules on existing SMARC platforms
Tria is pushing forward the rapid development of innovative OSM standard modules (Open Standard Module™) and offers special options for rapid evaluation of OSM prototypes.
Tria launches platform enabling developers to switch between x86 and ARM based SMARC® 2.1.1 module families
Tria simplifies embedded software development on SMARC® 2.1.1 module families and launches platform enabling developers to switch between x86 and ARM® based modules without changing code.
Tria integrates new i.MX 93 processor technology from NXP™ Semiconductors into SMARC™ module family
Tria announces at embedded world 2022 that the leading provider of embedded computing modules is supporting the new i.MX 93 Applications Processor family from NXP™ Semiconductors on the latest SMARC 2.1.1™ form factor.
Tria brings full Windows® 10 IoT to its ARM®-based SMARC™ modules with NXP i.MX 8M SoCs
In Hall 3A, Booth 111 (Avnet Silica) at embedded world 2022, Tria is showing a demonstration featuring an ARM®-based embedded compute module integrating an i.MX 8M processor from NXP™ Semiconductors running the full Microsoft Windows® 10 IoT Enterprise operating system.
Tria presents COM-HPC modules based on 12th Gen Intel® Core™ processors for high-performance computing
Tria expands its COM-HPC product portfolio for high-performance computing applications and presents the new TRIA HCA-ALP client module family in Hall 3, Booth 135 at embedded world 2022.
Tria Technologies integrates 12th Gen Intel Core processors into COM Express Compact module family
Tria Technologies presents the TRIA C6C-ALP COM Express Compact module family with 12th Gen Intel Core P-series and U-series processors.
Tria announces groundbreaking of major new manufacturing site in Eschbach, Germany
Tria has held a groundbreaking ceremony to mark the commencement of a new multi-million-euro manufacturing site in Europe.
Tria Technologies presents COM-HPC Server module family based on Intel Xeon D processors
Tria Technologies introduced the TRIA HSD-ILDL COM-HPC Server module family based on Intel Xeon D-1700 processors for IoT, AI/deep learning and edge computing applications.
Tria has opened a new design center for embedded products in Deggendorf, Germany
Underlining its global leadership in the embedded market, Tria has opened a new design center in Deggendorf, Germany, on January 1, 2022.
Tria announces high-performance COM Express™ module family based on 12th Gen Intel® Core™ processors
Tria expands its broad COM Express™ product portfolio at the higher end of the performance range. The new TRIA C6B-ALP COM Express™ Type 6 module family bases on 12th Gen Intel® Core™ H-series processors (codenamed „Alder Lake H-series“), offering a wide selection of CPU variants with scalable energy efficiency and high computing performance.
Tria supports Arm®’s Project Cassini for rapid development of SMARC-based IoT systems
Tria is enabling the rapid development of reliable embedded systems based on compact SMARC 2.1.1™ standard modules with integrated Arm® processors.
Tria announces high-performance COM Express™ module family based on 11th Gen. Intel® Core™ H-Series processors for IoT and AI industrial products
Tria supports the fast development of powerful industrial applications and expands its COM Express™ product portfolio at the higher end of the performance range.
Tria co-hosts webinar with Intel on 11th generation processors
Tria Technologies joined Intel for a webinar on 11th generation Intel Core processors for embedded computing, including mission-critical applications and the C6C-TLU COM Express module.
Tria announces SMARC 2.1™ modules featuring Intel’s Atom® x6000E series for increasing edge computing performance
With the TRIA SM2S-EL module family, Tria is expanding its already extensive range of SMARC 2.1™ standard modules in the upper performance segment. The TRIA SM2S-EL modules integrate the new multi-core Intel Atom® x6000E and Intel Atom® Pentium® / Celeron® N und J Series processor technology (codenamed „Elkhart Lake”).
Tria Technologies announces SMARC 2.1™ module featuring NXP‘s i.MX 8M Plus for Edge based embedded vision and audio AI applications
Tria Technologies announces the powerful TRIA SM2S-IMX8PLUS SMARC 2.1™ module family, which integrates the new i.MX 8M Plus applications processor from NXP™ Semiconductor.